JP2006524173A - 高熱伝導率のヒートシンク - Google Patents
高熱伝導率のヒートシンク Download PDFInfo
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- JP2006524173A JP2006524173A JP2006503938A JP2006503938A JP2006524173A JP 2006524173 A JP2006524173 A JP 2006524173A JP 2006503938 A JP2006503938 A JP 2006503938A JP 2006503938 A JP2006503938 A JP 2006503938A JP 2006524173 A JP2006524173 A JP 2006524173A
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- Prior art keywords
- silicon
- component according
- volume
- diamond
- composite material
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- 239000010432 diamond Substances 0.000 claims abstract description 61
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 57
- 239000002245 particle Substances 0.000 claims abstract description 32
- 239000002131 composite material Substances 0.000 claims abstract description 27
- 229910052709 silver Inorganic materials 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 150000001722 carbon compounds Chemical class 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000011230 binding agent Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001764 infiltration Methods 0.000 claims description 5
- 230000008595 infiltration Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 4
- 229910001020 Au alloy Inorganic materials 0.000 claims 4
- 229920000642 polymer Polymers 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 229910017982 Ag—Si Inorganic materials 0.000 claims 1
- 239000006023 eutectic alloy Substances 0.000 claims 1
- 238000009715 pressure infiltration Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 16
- 239000012071 phase Substances 0.000 description 11
- 239000010949 copper Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 229910000676 Si alloy Inorganic materials 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000009716 squeeze casting Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical class [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical class [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005088 metallography Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/528—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from carbonaceous particles with or without other non-organic components
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/653—Processes involving a melting step
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- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
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- C22C—ALLOYS
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3279—Nickel oxides, nickalates, or oxide-forming salts thereof
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- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
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- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
平均粒径40〜80μmの等級IIAの天然ダイヤモンド(エレメントSiX GmbH社のMicron+SND)を、エポキシ樹脂基の7体積%の結合剤と混合した。製造した前駆物質又は中間物を、金型プレスで200MPaの圧力で、寸法35×35×5mm3のプレートの形に圧縮した。プレートの有孔率は約15体積%であった。次の工程でプレートを共晶Ag・Si合金から成る箔で覆った。Si含有量は11原子%であり、炉内で浸透のために真空中で860℃の温度に加熱した。保持時間は15分であった。400℃で約10分にわたり保持した上で室温に冷却したとき、存在する相の体積含有量を、定量金属組織学的に検出した。その際、炭化珪素の値は約2体積%であり、炭化珪素はダイヤモンド粒子を大部分にわたって一様に取り囲んだ。この炭化珪素被覆の小さな層厚のため、炭化珪素相の変化は検知されなかった。その組織は、ダイヤモンドおよび炭化珪素の他に、共晶組成をなすSi析出物が埋設されたAg豊富相から成っていた。Ag豊富相の含有量は約12体積%、Siの含有量は約1体積%であった。EDXにより、Ag豊富相にAg以外の成分は検出されず、従って所定の検出限界に基づき、Ag含有量が99原子%であることが推論される。熱伝導率および熱膨張率を検出すべく、プレートをレーザおよびエロージョンで加工した。室温における熱伝導率として、平均値450W/mKを測定した。熱膨張率は、平均値で8.5×10-6K-1であった。
別の実験で、平均粒径40〜80μmのエレメントSiX GmbH社の等級Micron+MDAの人工ダイヤモンドを加工した。加工は実施例1と同様に行った。この複合材料の室温での平均熱伝導率は410W/mK、平均熱膨張率は9.0×10-6K-1であった。
実施例3として、平均粒径40〜80μmのエレメントSiX GmbH社の等級Micron+MDAの人工ダイヤモンドを加工した。前駆物質の製造は、実施例1と同様に行った。圧縮した前駆物質の共晶Ag・Si溶融物による浸透は、熱間加工鋼から成る鋳型を150℃に加熱する通常の圧搾鋳造装置で、約40MPaの気体圧力下で実施した。Ag・Si溶融物の温度は約880℃であった。室温迄のゆっくりした冷却は、400℃での約15分間にわたる保持に続いて実施した。そのように製造した複合材料の室温での平均熱伝導率は480W/mK、平均熱膨張率は8.5×10-6K-1であった。
平均粒径40〜80μmのエレメントSiX GmbH社の等級Micron+SNDの人工ダイヤモンドを、実施例3に基づき加工したが、浸透温度からの冷却時に約400℃における15分間にわたる保持過程は実施しなかった。そのように製造した複合材料の室温での平均熱伝導率は440W/mK、平均熱膨張率は8.5×10-6K-1であった。
Claims (17)
- 平均粒径5〜300μmのダイヤモンド粒子を40〜90体積%含む複合材料から成るヒートシンク用の部品において、前記複合材料が、0.005〜12体積%の珪素・炭素化合物と、7〜49体積%のAg、Au或いはAl豊富相と、5体積%以下の他の相とを含み、Ag、Au或いはAl豊富相と珪素・炭素化合物との体積比が4より大きく、ダイヤモンド粒子の表面が珪素・炭素化合物で少なくとも60%覆われていることを特徴とする部品。
- 珪素・炭素化合物がSiCであることを特徴とする請求項1記載の部品。
- Ag、Au或いはAl豊富相が、各元素を少なくとも95原子%を含むことを特徴とする請求項1又は2記載の部品。
- Ag、Au或いはAl豊富相がCuおよび/又はNiを含むことを特徴とする請求項1から3の1つに記載の部品。
- Cuおよび/又はNiを含むAg、Au或いはAl豊富相が、更にSiをも含むことを特徴とする請求項4記載の部品。
- 複合材料が、0.1〜4.5体積%の非化合珪素を含むことを特徴とする請求項1から5の1つに記載の部品。
- 複合材料が、0.1〜4.5体積%の非化合炭素を含むことを特徴とする請求項1から5の1つに記載の部品。
- 珪素・炭素化合物が、主に或いは専らダイヤモンドの炭素と珪素との反応によって形成されたことを特徴とする請求項1から7の1つに記載の部品。
- ダイヤモンド粒径が50〜150μmであることを特徴とする請求項1から8の1つに記載の部品。
- 複合材料が、0.01〜12体積%の炭化珪素と、7〜49体積%のAg、Au或いはAl豊富相とを含むことを特徴とする請求項1から9の1つに記載の部品。
- 複合材料が、0.01〜7体積%の炭化珪素と、7〜49体積%のAgを含むことを特徴とする請求項1から10の1つに記載の部品。
- Ni、Cu、Au、Ag或いはそれらの合金から成る金属被覆が設けられたことを特徴とする請求項1から11の1つに記載の部品。
- セラミック枠がろう付けされたことを特徴とする請求項1から12の1つに記載の部品。
- 請求項1から13の1つに記載の部品を製造する方法において、
粒径5〜300μmのダイヤモンド粒子とポリマ基又はワックス基の結合剤とを含み、結合剤分量が1〜20重量%である中間物を製造し、
中間物を型の中に無圧で或いは加圧して充填して成形し、
結合剤を少なくとも部分的に熱分解すべく、保護雰囲気中で中間物を300〜1200℃に加熱することによって多孔性ダイヤモンド体を製造し(この工程は次の浸透工程と一体化することも可能)、
多孔性ダイヤモンド体およびSi分量が40重量%以下である珪素含有Ag、Au或いはAl合金を、珪素を含有する各Ag、Au或いはAl合金の液相線以上の温度に真空中で加熱することで、多孔性ダイヤモンド体を浸透し、前記珪素を、熱分解済み結合剤の炭素並びにダイヤモンドと少なくとも部分的に反応させ炭化珪素に転換する
工程を少なくとも含むことを特徴とする部品の製造方法。 - 請求項1から13の1つに記載の部品を製造する方法において、
粒径5〜300μmのダイヤモンド粒子とポリマ基又はワックス基の結合剤とを含み、結合剤分量が1〜20重量%である中間物を製造し、
中間物を型の中に無圧で或いは加圧して充填して成形し、
結合剤を少なくとも部分的に熱分解すべく、保護雰囲気中で中間物を300〜1200℃に加熱することで多孔性ダイヤモンド体を製造し(この工程は次の加圧浸透工程と一体化することも可能)、
Si分量が40重量%以下である珪素含有Ag、Au或いはAl合金を、珪素を含有する各Ag、Au或いはAl合金の液相線以上の温度に加熱して多孔性ダイヤモンド体を加圧浸透する
工程を少なくとも含むことを特徴とする部品の製造方法。 - 浸透のためにAg・Si共晶合金を利用することを特徴とする請求項14又は15記載の方法。
- 半導体構成要素のヒートシンクとして利用することを特徴とする請求項1から13の1つに記載の部品の利用方法。
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JP2011165811A (ja) * | 2010-02-08 | 2011-08-25 | Allied Material Corp | 半導体素子搭載部材とその製造方法ならびに半導体装置 |
US8575625B2 (en) | 2010-02-08 | 2013-11-05 | A.L.M.T. Corp. | Semiconductor element mounting member, method of producing the same, and semiconductor device |
US9016406B2 (en) | 2011-09-22 | 2015-04-28 | Kennametal Inc. | Cutting inserts for earth-boring bits |
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EP1601631A1 (de) | 2005-12-07 |
AT7382U1 (de) | 2005-02-25 |
JP2006519928A (ja) | 2006-08-31 |
CN100400467C (zh) | 2008-07-09 |
WO2004080913A1 (de) | 2004-09-23 |
US20060157884A1 (en) | 2006-07-20 |
US20060130998A1 (en) | 2006-06-22 |
JP4995565B2 (ja) | 2012-08-08 |
WO2004080914A1 (de) | 2004-09-23 |
CN1759078A (zh) | 2006-04-12 |
EP1601630A1 (de) | 2005-12-07 |
EP1601630B1 (de) | 2017-12-27 |
JP4880447B2 (ja) | 2012-02-22 |
US8575051B2 (en) | 2013-11-05 |
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