JP2006332667A - リードボンディング時にクラックを防止するテープパッケージ - Google Patents

リードボンディング時にクラックを防止するテープパッケージ Download PDF

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Publication number
JP2006332667A
JP2006332667A JP2006143311A JP2006143311A JP2006332667A JP 2006332667 A JP2006332667 A JP 2006332667A JP 2006143311 A JP2006143311 A JP 2006143311A JP 2006143311 A JP2006143311 A JP 2006143311A JP 2006332667 A JP2006332667 A JP 2006332667A
Authority
JP
Japan
Prior art keywords
tape package
wiring
semiconductor chip
package according
lead wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006143311A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006332667A5 (enExample
Inventor
Ye-Chung Chung
鄭　禮貞
Shiin Kyo
姜　思尹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR20050043810A external-priority patent/KR100618898B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2006332667A publication Critical patent/JP2006332667A/ja
Publication of JP2006332667A5 publication Critical patent/JP2006332667A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2006143311A 2005-05-24 2006-05-23 リードボンディング時にクラックを防止するテープパッケージ Pending JP2006332667A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050043810A KR100618898B1 (ko) 2005-05-24 2005-05-24 리드 본딩시 크랙을 방지하는 테이프 패키지
US11/396,526 US7649246B2 (en) 2005-05-24 2006-04-04 Tab package connecting host device element

Publications (2)

Publication Number Publication Date
JP2006332667A true JP2006332667A (ja) 2006-12-07
JP2006332667A5 JP2006332667A5 (enExample) 2009-07-09

Family

ID=37553954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006143311A Pending JP2006332667A (ja) 2005-05-24 2006-05-23 リードボンディング時にクラックを防止するテープパッケージ

Country Status (2)

Country Link
JP (1) JP2006332667A (enExample)
DE (1) DE102006024652B4 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234898A (ja) * 2006-03-01 2007-09-13 Sanyo Electric Co Ltd 半導体装置
WO2008069152A1 (ja) 2006-12-08 2008-06-12 Nec Corporation 枠体の補強構造及び該構造を備えた電子機器
JP2019035817A (ja) * 2017-08-10 2019-03-07 株式会社ジャパンディスプレイ 表示装置
CN114554675A (zh) * 2020-11-11 2022-05-27 三星电机株式会社 柔性印刷电路板及包括柔性印刷电路板的电子装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065662A (ja) * 1992-06-17 1994-01-14 Hitachi Cable Ltd 半導体装置用フィルムキャリアテープ及びその製造方法
JPH077046A (ja) * 1993-06-16 1995-01-10 Toshiba Corp フィルムキャリアおよび半導体装置の製造方法
JP2000195898A (ja) * 1998-11-27 2000-07-14 Samsung Electronics Co Ltd テ―プキャリヤパッケ―ジおよびこれを用いた液晶表示器モジュ―ル
JP2001284747A (ja) * 2000-04-04 2001-10-12 Matsushita Electric Ind Co Ltd フレキシブル配線板
JP2002358026A (ja) * 2001-03-26 2002-12-13 Sharp Corp 表示モジュール並びにフレキシブル配線板及びフレキシブル配線板の接続方法
JP2003287767A (ja) * 2002-03-27 2003-10-10 Optrex Corp 液晶表示装置
JP2004274007A (ja) * 2003-03-11 2004-09-30 Samsung Electronics Co Ltd 波状のビームリードを備えたテープ配線基板及びそれを用いた半導体チップパッケージ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680613A (en) * 1983-12-01 1987-07-14 Fairchild Semiconductor Corporation Low impedance package for integrated circuit die
JP3640155B2 (ja) * 1999-01-26 2005-04-20 セイコーエプソン株式会社 可撓性配線基板、フィルムキャリア、テープ状半導体装置、半導体装置、回路基板並びに電子機器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065662A (ja) * 1992-06-17 1994-01-14 Hitachi Cable Ltd 半導体装置用フィルムキャリアテープ及びその製造方法
JPH077046A (ja) * 1993-06-16 1995-01-10 Toshiba Corp フィルムキャリアおよび半導体装置の製造方法
JP2000195898A (ja) * 1998-11-27 2000-07-14 Samsung Electronics Co Ltd テ―プキャリヤパッケ―ジおよびこれを用いた液晶表示器モジュ―ル
JP2001284747A (ja) * 2000-04-04 2001-10-12 Matsushita Electric Ind Co Ltd フレキシブル配線板
JP2002358026A (ja) * 2001-03-26 2002-12-13 Sharp Corp 表示モジュール並びにフレキシブル配線板及びフレキシブル配線板の接続方法
JP2003287767A (ja) * 2002-03-27 2003-10-10 Optrex Corp 液晶表示装置
JP2004274007A (ja) * 2003-03-11 2004-09-30 Samsung Electronics Co Ltd 波状のビームリードを備えたテープ配線基板及びそれを用いた半導体チップパッケージ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234898A (ja) * 2006-03-01 2007-09-13 Sanyo Electric Co Ltd 半導体装置
WO2008069152A1 (ja) 2006-12-08 2008-06-12 Nec Corporation 枠体の補強構造及び該構造を備えた電子機器
JP2019035817A (ja) * 2017-08-10 2019-03-07 株式会社ジャパンディスプレイ 表示装置
CN114554675A (zh) * 2020-11-11 2022-05-27 三星电机株式会社 柔性印刷电路板及包括柔性印刷电路板的电子装置

Also Published As

Publication number Publication date
DE102006024652B4 (de) 2012-11-08
DE102006024652A1 (de) 2007-01-18

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