JP2006332667A5 - - Google Patents
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- Publication number
- JP2006332667A5 JP2006332667A5 JP2006143311A JP2006143311A JP2006332667A5 JP 2006332667 A5 JP2006332667 A5 JP 2006332667A5 JP 2006143311 A JP2006143311 A JP 2006143311A JP 2006143311 A JP2006143311 A JP 2006143311A JP 2006332667 A5 JP2006332667 A5 JP 2006332667A5
- Authority
- JP
- Japan
- Prior art keywords
- width
- input lead
- lead wiring
- transition region
- base substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007704 transition Effects 0.000 claims 21
- 239000000758 substrate Substances 0.000 claims 15
- 229910000679 solder Inorganic materials 0.000 claims 11
- 239000004065 semiconductor Substances 0.000 claims 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20050043810A KR100618898B1 (ko) | 2005-05-24 | 2005-05-24 | 리드 본딩시 크랙을 방지하는 테이프 패키지 |
| US11/396,526 US7649246B2 (en) | 2005-05-24 | 2006-04-04 | Tab package connecting host device element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006332667A JP2006332667A (ja) | 2006-12-07 |
| JP2006332667A5 true JP2006332667A5 (enExample) | 2009-07-09 |
Family
ID=37553954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006143311A Pending JP2006332667A (ja) | 2005-05-24 | 2006-05-23 | リードボンディング時にクラックを防止するテープパッケージ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006332667A (enExample) |
| DE (1) | DE102006024652B4 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5047509B2 (ja) * | 2006-03-01 | 2012-10-10 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置 |
| JP4821592B2 (ja) | 2006-12-08 | 2011-11-24 | 日本電気株式会社 | 枠体の補強構造及び該構造を備えた電子機器 |
| JP2019035817A (ja) * | 2017-08-10 | 2019-03-07 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR20220064117A (ko) * | 2020-11-11 | 2022-05-18 | 삼성전기주식회사 | 플렉서블 인쇄회로기판 및 이를 포함하는 전자장치 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4680613A (en) * | 1983-12-01 | 1987-07-14 | Fairchild Semiconductor Corporation | Low impedance package for integrated circuit die |
| JP2737545B2 (ja) * | 1992-06-17 | 1998-04-08 | 日立電線株式会社 | 半導体装置用フィルムキャリアテープ及びその製造方法 |
| JPH077046A (ja) * | 1993-06-16 | 1995-01-10 | Toshiba Corp | フィルムキャリアおよび半導体装置の製造方法 |
| KR100574278B1 (ko) * | 1998-11-27 | 2006-09-22 | 삼성전자주식회사 | 테이프 캐리어 패키지 및 이를 이용한 액정표시기모듈 |
| JP3640155B2 (ja) * | 1999-01-26 | 2005-04-20 | セイコーエプソン株式会社 | 可撓性配線基板、フィルムキャリア、テープ状半導体装置、半導体装置、回路基板並びに電子機器 |
| JP2001284747A (ja) * | 2000-04-04 | 2001-10-12 | Matsushita Electric Ind Co Ltd | フレキシブル配線板 |
| JP3792554B2 (ja) * | 2001-03-26 | 2006-07-05 | シャープ株式会社 | 表示モジュール及びフレキシブル配線板の接続方法 |
| JP2003287767A (ja) * | 2002-03-27 | 2003-10-10 | Optrex Corp | 液晶表示装置 |
| KR100549409B1 (ko) * | 2003-03-11 | 2006-02-08 | 삼성전자주식회사 | 파상의 빔 리드를 구비하는 테이프 배선 기판 및 그를이용한 반도체 칩 패키지 |
-
2006
- 2006-05-22 DE DE102006024652A patent/DE102006024652B4/de not_active Expired - Lifetime
- 2006-05-23 JP JP2006143311A patent/JP2006332667A/ja active Pending
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