JP2006294976A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

Info

Publication number
JP2006294976A
JP2006294976A JP2005115664A JP2005115664A JP2006294976A JP 2006294976 A JP2006294976 A JP 2006294976A JP 2005115664 A JP2005115664 A JP 2005115664A JP 2005115664 A JP2005115664 A JP 2005115664A JP 2006294976 A JP2006294976 A JP 2006294976A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
element mounting
semiconductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005115664A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006294976A5 (enExample
Inventor
Koji Nishida
浩二 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Priority to JP2005115664A priority Critical patent/JP2006294976A/ja
Priority to US11/402,008 priority patent/US20060231935A1/en
Publication of JP2006294976A publication Critical patent/JP2006294976A/ja
Publication of JP2006294976A5 publication Critical patent/JP2006294976A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP2005115664A 2005-04-13 2005-04-13 半導体装置およびその製造方法 Pending JP2006294976A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005115664A JP2006294976A (ja) 2005-04-13 2005-04-13 半導体装置およびその製造方法
US11/402,008 US20060231935A1 (en) 2005-04-13 2006-04-12 BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005115664A JP2006294976A (ja) 2005-04-13 2005-04-13 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2006294976A true JP2006294976A (ja) 2006-10-26
JP2006294976A5 JP2006294976A5 (enExample) 2007-11-15

Family

ID=37107717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005115664A Pending JP2006294976A (ja) 2005-04-13 2005-04-13 半導体装置およびその製造方法

Country Status (2)

Country Link
US (1) US20060231935A1 (enExample)
JP (1) JP2006294976A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182104A (ja) * 2008-01-30 2009-08-13 Toshiba Corp 半導体パッケージ
JP2012186301A (ja) * 2011-03-04 2012-09-27 Olympus Corp 配線板、配線板の製造方法、および撮像装置
WO2020179458A1 (ja) * 2019-03-07 2020-09-10 株式会社村田製作所 電子部品
US11521702B2 (en) 2020-02-27 2022-12-06 Seiko Epson Corporation Semiconductor apparatus
US11683883B2 (en) 2020-02-27 2023-06-20 Seiko Epson Corporation Semiconductor apparatus
US20230389190A1 (en) * 2022-04-21 2023-11-30 Skyworks Solutions, Inc. System and method for normalizing solder interconnects in a circuit package module after removal from a test board
US12028971B2 (en) 2020-02-27 2024-07-02 Seiko Epson Corporation Semiconductor apparatus
US12171061B2 (en) 2020-02-27 2024-12-17 Seiko Epson Corporation Semiconductor apparatus with inspection terminals

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8319114B2 (en) * 2008-04-02 2012-11-27 Densel Lambda K.K. Surface mount power module dual footprint
KR20150004118A (ko) * 2013-07-02 2015-01-12 삼성디스플레이 주식회사 표시 장치용 기판, 상기 표시 장치용 기판의 제조 방법, 및 상기 표시 장치용 기판을 포함하는 표시 장치
US10790328B2 (en) * 2017-11-28 2020-09-29 Asahi Kasei Microdevices Corporation Semiconductor package and camera module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176647A (ja) * 1993-12-21 1995-07-14 Matsushita Electric Works Ltd チップキャリア
JPH07307408A (ja) * 1994-05-10 1995-11-21 Canon Inc Ｉｃパッケージおよびその組立方法
JP2001210742A (ja) * 2000-01-27 2001-08-03 Kyocera Corp 電子部品搭載用基板およびその多数個取り配列基板
JP2003197813A (ja) * 2001-12-28 2003-07-11 Mitsubishi Electric Corp 電子装置
JP2003218265A (ja) * 2002-01-21 2003-07-31 Tokyo Denpa Co Ltd 電子部品容器
JP2004200416A (ja) * 2002-12-18 2004-07-15 Kyocera Corp 配線基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541491B2 (ja) * 1994-06-22 2004-07-14 セイコーエプソン株式会社 電子部品
JP2976917B2 (ja) * 1997-03-31 1999-11-10 日本電気株式会社 半導体装置
KR100259359B1 (ko) * 1998-02-10 2000-06-15 김영환 반도체 패키지용 기판 및 반도체 패키지, 그리고 그 제조방법
US6175152B1 (en) * 1998-06-25 2001-01-16 Citizen Watch Co., Ltd. Semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176647A (ja) * 1993-12-21 1995-07-14 Matsushita Electric Works Ltd チップキャリア
JPH07307408A (ja) * 1994-05-10 1995-11-21 Canon Inc Ｉｃパッケージおよびその組立方法
JP2001210742A (ja) * 2000-01-27 2001-08-03 Kyocera Corp 電子部品搭載用基板およびその多数個取り配列基板
JP2003197813A (ja) * 2001-12-28 2003-07-11 Mitsubishi Electric Corp 電子装置
JP2003218265A (ja) * 2002-01-21 2003-07-31 Tokyo Denpa Co Ltd 電子部品容器
JP2004200416A (ja) * 2002-12-18 2004-07-15 Kyocera Corp 配線基板

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182104A (ja) * 2008-01-30 2009-08-13 Toshiba Corp 半導体パッケージ
JP2012186301A (ja) * 2011-03-04 2012-09-27 Olympus Corp 配線板、配線板の製造方法、および撮像装置
US9693460B2 (en) 2011-03-04 2017-06-27 Olympus Corporation Wiring board, manufacturing method for wiring board, and image pickup apparatus
WO2020179458A1 (ja) * 2019-03-07 2020-09-10 株式会社村田製作所 電子部品
US11963302B2 (en) 2019-03-07 2024-04-16 Murata Manufacturing Co., Ltd. Electronic component
US11521702B2 (en) 2020-02-27 2022-12-06 Seiko Epson Corporation Semiconductor apparatus
US11683883B2 (en) 2020-02-27 2023-06-20 Seiko Epson Corporation Semiconductor apparatus
US12028971B2 (en) 2020-02-27 2024-07-02 Seiko Epson Corporation Semiconductor apparatus
US12171061B2 (en) 2020-02-27 2024-12-17 Seiko Epson Corporation Semiconductor apparatus with inspection terminals
US20230389190A1 (en) * 2022-04-21 2023-11-30 Skyworks Solutions, Inc. System and method for normalizing solder interconnects in a circuit package module after removal from a test board
US12376236B2 (en) * 2022-04-21 2025-07-29 Skyworks Solutions, Inc. Method for normalizing solder interconnects in a circuit package module after removal from a test board

Also Published As

Publication number Publication date
US20060231935A1 (en) 2006-10-19

Similar Documents

Publication Publication Date Title
US6028358A (en) Package for a semiconductor device and a semiconductor device
JP2009026805A (ja) 半導体装置及びその製造方法
KR20100087329A (ko) 칩 스케일 적층형 다이 패키지
US20110215461A1 (en) Method for manufacturing a semiconductor device and a semiconductor device
JP2012253190A (ja) 半導体パッケージ及びその実装方法
JP2010277829A (ja) 接続端子付き基板
TW200807666A (en) Manufacturing Method of Semiconductor Device
JP2005079581A (ja) テープ基板、及びテープ基板を用いた半導体チップパッケージ、及び半導体チップパッケージを用いたｌｃｄ装置
US6507118B1 (en) Multi-metal layer circuit
JP2009194079A (ja) 半導体装置用配線基板とその製造方法及びそれを用いた半導体装置
JP3927783B2 (ja) 半導体部品
JP2006294976A (ja) 半導体装置およびその製造方法
JP3424581B2 (ja) Ｂｇａ用テープキャリアおよびそれを用いた半導体装置
JP5372346B2 (ja) 半導体装置及びその製造方法
JP5803345B2 (ja) 半導体チップの製造方法、回路実装体及びその製造方法
US20080043447A1 (en) Semiconductor package having laser-embedded terminals
JP2009026861A (ja) 半導体装置及びその製造方法
JPWO2011021364A1 (ja) 半導体装置およびその製造方法
JP4506168B2 (ja) 半導体装置およびその実装構造
JP4494249B2 (ja) 半導体装置
JP2011029370A (ja) 積層型半導体装置及びその製造方法
JP2009224461A (ja) 配線基板及びその製造方法
JP4917979B2 (ja) 半導体装置及びその製造方法
JP4737995B2 (ja) 半導体装置
JP2020150172A (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070927

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080117

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100107

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100112

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100315

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110208

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20111011