JP2006284925A - フレキシブル光電気混載基板およびこれを用いた電子機器 - Google Patents
フレキシブル光電気混載基板およびこれを用いた電子機器 Download PDFInfo
- Publication number
- JP2006284925A JP2006284925A JP2005104922A JP2005104922A JP2006284925A JP 2006284925 A JP2006284925 A JP 2006284925A JP 2005104922 A JP2005104922 A JP 2005104922A JP 2005104922 A JP2005104922 A JP 2005104922A JP 2006284925 A JP2006284925 A JP 2006284925A
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- Prior art keywords
- optical waveguide
- flexible
- opto
- wiring board
- bent
- Prior art date
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- 230000003287 optical effect Effects 0.000 claims abstract description 74
- 238000009429 electrical wiring Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 description 25
- 239000012790 adhesive layer Substances 0.000 description 16
- 238000005452 bending Methods 0.000 description 14
- 239000011162 core material Substances 0.000 description 14
- 239000004642 Polyimide Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229920006259 thermoplastic polyimide Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- IFYXKXOINSPAJQ-UHFFFAOYSA-N 4-(4-aminophenyl)-5,5-bis(trifluoromethyl)cyclohexa-1,3-dien-1-amine Chemical group FC(F)(F)C1(C(F)(F)F)CC(N)=CC=C1C1=CC=C(N)C=C1 IFYXKXOINSPAJQ-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- APXJLYIVOFARRM-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 APXJLYIVOFARRM-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- NMFFUUFPJJOWHK-UHFFFAOYSA-N 2-phenoxyaniline Chemical compound NC1=CC=CC=C1OC1=CC=CC=C1 NMFFUUFPJJOWHK-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
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- Optical Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005104922A JP2006284925A (ja) | 2005-03-31 | 2005-03-31 | フレキシブル光電気混載基板およびこれを用いた電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005104922A JP2006284925A (ja) | 2005-03-31 | 2005-03-31 | フレキシブル光電気混載基板およびこれを用いた電子機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008202083A Division JP2008262244A (ja) | 2008-08-05 | 2008-08-05 | フレキシブル光電気混載基板およびこれを用いた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006284925A true JP2006284925A (ja) | 2006-10-19 |
JP2006284925A5 JP2006284925A5 (enrdf_load_stackoverflow) | 2008-09-25 |
Family
ID=37406924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005104922A Pending JP2006284925A (ja) | 2005-03-31 | 2005-03-31 | フレキシブル光電気混載基板およびこれを用いた電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2006284925A (enrdf_load_stackoverflow) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008262244A (ja) * | 2008-08-05 | 2008-10-30 | Mitsui Chemicals Inc | フレキシブル光電気混載基板およびこれを用いた電子機器 |
WO2009037976A1 (ja) | 2007-09-20 | 2009-03-26 | Omron Corporation | 光配線、及び光伝送モジュール |
WO2009096067A1 (ja) | 2008-02-01 | 2009-08-06 | Hitachi Chemical Company, Ltd. | 光電気混載基板及び電子機器 |
JP2010019895A (ja) * | 2008-07-08 | 2010-01-28 | Hitachi Cable Ltd | 光電気複合配線 |
WO2010058476A1 (ja) * | 2008-11-21 | 2010-05-27 | 日立化成工業株式会社 | 光電気混載基板及び電子機器 |
JP2010286777A (ja) * | 2009-06-15 | 2010-12-24 | Toshiba Corp | 光電気配線フィルム及び光電気配線モジュール |
JP2011017985A (ja) * | 2009-07-10 | 2011-01-27 | Molex Inc | 光コネクタ組立体、光コネクタ組立体用のケーブル及び光コネクタ組立体用のプラグ |
JP2013228467A (ja) * | 2012-04-24 | 2013-11-07 | Nippon Mektron Ltd | 光電気混載フレキシブルプリント配線板、及びその製造方法 |
CN103809237A (zh) * | 2012-11-08 | 2014-05-21 | 日东电工株式会社 | 光电混载基板 |
US9146348B2 (en) | 2011-01-07 | 2015-09-29 | Panasonic Intellectual Property Management Co., Ltd. | Optical-electrical composite flexible circuit substrate including optical circuit and electrical circuit |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354106U (enrdf_load_stackoverflow) * | 1986-09-29 | 1988-04-12 | ||
JPH02244788A (ja) * | 1989-03-17 | 1990-09-28 | Hitachi Ltd | 回路基板 |
JPH06222230A (ja) * | 1993-01-26 | 1994-08-12 | Nippon Telegr & Teleph Corp <Ntt> | フレキシブル電気・光配線回路モジュールとその製造方法 |
JPH06308519A (ja) * | 1993-04-20 | 1994-11-04 | Nippon Telegr & Teleph Corp <Ntt> | フレキシブル電気光混載配線板 |
JPH07312469A (ja) * | 1994-05-16 | 1995-11-28 | Nippon Mektron Ltd | 多層フレキシブル回路基板の屈曲部構造 |
JP2001194546A (ja) * | 2000-01-11 | 2001-07-19 | Toppan Printing Co Ltd | 光配線フィルムの製造方法 |
JP2002171033A (ja) * | 2000-12-04 | 2002-06-14 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板 |
JP2002319766A (ja) * | 2001-04-20 | 2002-10-31 | Nippon Mektron Ltd | 屈曲性のケーブル部を有するプリント基板およびその製造方法 |
JP2003133734A (ja) * | 2001-10-24 | 2003-05-09 | Nippon Mektron Ltd | ケーブル部を有するフレキシブルプリント基板 |
JP2003258390A (ja) * | 2002-03-06 | 2003-09-12 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント配線板 |
JP2003287637A (ja) * | 2002-03-28 | 2003-10-10 | Hitachi Cable Ltd | 光導波路付きプリント基板及びその製造方法 |
-
2005
- 2005-03-31 JP JP2005104922A patent/JP2006284925A/ja active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354106U (enrdf_load_stackoverflow) * | 1986-09-29 | 1988-04-12 | ||
JPH02244788A (ja) * | 1989-03-17 | 1990-09-28 | Hitachi Ltd | 回路基板 |
JPH06222230A (ja) * | 1993-01-26 | 1994-08-12 | Nippon Telegr & Teleph Corp <Ntt> | フレキシブル電気・光配線回路モジュールとその製造方法 |
JPH06308519A (ja) * | 1993-04-20 | 1994-11-04 | Nippon Telegr & Teleph Corp <Ntt> | フレキシブル電気光混載配線板 |
JPH07312469A (ja) * | 1994-05-16 | 1995-11-28 | Nippon Mektron Ltd | 多層フレキシブル回路基板の屈曲部構造 |
JP2001194546A (ja) * | 2000-01-11 | 2001-07-19 | Toppan Printing Co Ltd | 光配線フィルムの製造方法 |
JP2002171033A (ja) * | 2000-12-04 | 2002-06-14 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板 |
JP2002319766A (ja) * | 2001-04-20 | 2002-10-31 | Nippon Mektron Ltd | 屈曲性のケーブル部を有するプリント基板およびその製造方法 |
JP2003133734A (ja) * | 2001-10-24 | 2003-05-09 | Nippon Mektron Ltd | ケーブル部を有するフレキシブルプリント基板 |
JP2003258390A (ja) * | 2002-03-06 | 2003-09-12 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント配線板 |
JP2003287637A (ja) * | 2002-03-28 | 2003-10-10 | Hitachi Cable Ltd | 光導波路付きプリント基板及びその製造方法 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009037976A1 (ja) | 2007-09-20 | 2009-03-26 | Omron Corporation | 光配線、及び光伝送モジュール |
US20120020609A1 (en) * | 2007-09-20 | 2012-01-26 | Omron Corporation | Optical wiring arrangement and optical transmission module |
WO2009096067A1 (ja) | 2008-02-01 | 2009-08-06 | Hitachi Chemical Company, Ltd. | 光電気混載基板及び電子機器 |
JP2010019895A (ja) * | 2008-07-08 | 2010-01-28 | Hitachi Cable Ltd | 光電気複合配線 |
JP2008262244A (ja) * | 2008-08-05 | 2008-10-30 | Mitsui Chemicals Inc | フレキシブル光電気混載基板およびこれを用いた電子機器 |
JPWO2010058476A1 (ja) * | 2008-11-21 | 2012-04-12 | 日立化成工業株式会社 | 光電気混載基板及び電子機器 |
WO2010058476A1 (ja) * | 2008-11-21 | 2010-05-27 | 日立化成工業株式会社 | 光電気混載基板及び電子機器 |
JP2010286777A (ja) * | 2009-06-15 | 2010-12-24 | Toshiba Corp | 光電気配線フィルム及び光電気配線モジュール |
JP2011017985A (ja) * | 2009-07-10 | 2011-01-27 | Molex Inc | 光コネクタ組立体、光コネクタ組立体用のケーブル及び光コネクタ組立体用のプラグ |
US20120243833A1 (en) * | 2009-07-10 | 2012-09-27 | Molex Incorporated | Hybrid optical connector assembly, cable for use with hybrid optical connector assembly and plug for use with hybrid optical connector assembly |
US8801299B2 (en) | 2009-07-10 | 2014-08-12 | Molex Incorporated | Hybrid optical connector assembly, cable for use with hybrid optical connector assembly and plug for use with hybrid optical connector assembly |
US9146348B2 (en) | 2011-01-07 | 2015-09-29 | Panasonic Intellectual Property Management Co., Ltd. | Optical-electrical composite flexible circuit substrate including optical circuit and electrical circuit |
JP2013228467A (ja) * | 2012-04-24 | 2013-11-07 | Nippon Mektron Ltd | 光電気混載フレキシブルプリント配線板、及びその製造方法 |
CN103809237A (zh) * | 2012-11-08 | 2014-05-21 | 日东电工株式会社 | 光电混载基板 |
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