WO2009037976A1 - 光配線、及び光伝送モジュール - Google Patents

光配線、及び光伝送モジュール Download PDF

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Publication number
WO2009037976A1
WO2009037976A1 PCT/JP2008/065888 JP2008065888W WO2009037976A1 WO 2009037976 A1 WO2009037976 A1 WO 2009037976A1 JP 2008065888 W JP2008065888 W JP 2008065888W WO 2009037976 A1 WO2009037976 A1 WO 2009037976A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
optical transmission
wiring arrangement
transmission module
electronic device
Prior art date
Application number
PCT/JP2008/065888
Other languages
English (en)
French (fr)
Inventor
Masaaki Kasai
Hayami Hosokawa
Naru Yasuda
Hiroshi Sameshima
Yoshitaka Tatara
Naoki Yoshitake
Original Assignee
Omron Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation filed Critical Omron Corporation
Priority to US12/673,102 priority Critical patent/US20120020609A1/en
Priority to CN200880104159A priority patent/CN101784927A/zh
Priority to KR1020117030899A priority patent/KR101173830B1/ko
Priority to KR1020107002756A priority patent/KR101125438B1/ko
Priority to EP08832655A priority patent/EP2189825A4/en
Publication of WO2009037976A1 publication Critical patent/WO2009037976A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J19/00—Character- or line-spacing mechanisms
    • B41J19/18—Character-spacing or back-spacing mechanisms; Carriage return or release devices therefor
    • B41J19/20—Positive-feed character-spacing mechanisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/16—Connectors or connections adapted for particular applications for telephony
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
    • H01R35/02—Flexible line connectors without frictional contact members
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

　電子機器内の配線への応用に際して要求される可動性を満たし、外部の構造体との接触による折れ・擦れ・磨耗の低減を実現する目的のため、本発明の光配線（４）は、電子機器に搭載される光配線であって、光信号を伝送する光伝送路（９）を備え、電子機器内の構造体（１１）との接触時に発生する摩擦を、光伝送路（９）と構造体（１１）との接触時よりも低減させ、かつ光伝送路（９）の変形に応じて可撓する潤滑層（１０）が設けられている。
PCT/JP2008/065888 2007-09-20 2008-09-03 光配線、及び光伝送モジュール WO2009037976A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/673,102 US20120020609A1 (en) 2007-09-20 2008-09-03 Optical wiring arrangement and optical transmission module
CN200880104159A CN101784927A (zh) 2007-09-20 2008-09-03 光配线及光传输模块
KR1020117030899A KR101173830B1 (ko) 2007-09-20 2008-09-03 광 배선 및 광 전송 모듈
KR1020107002756A KR101125438B1 (ko) 2007-09-20 2008-09-03 광 배선 및 광 전송 모듈
EP08832655A EP2189825A4 (en) 2007-09-20 2008-09-03 OPTICAL WIRING ARRANGEMENT AND OPTICAL TRANSMISSION MODULE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007244311A JP2009075365A (ja) 2007-09-20 2007-09-20 光配線、及び光伝送モジュール
JP2007-244311 2007-09-20

Publications (1)

Publication Number Publication Date
WO2009037976A1 true WO2009037976A1 (ja) 2009-03-26

Family

ID=40467795

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065888 WO2009037976A1 (ja) 2007-09-20 2008-09-03 光配線、及び光伝送モジュール

Country Status (6)

Country Link
US (1) US20120020609A1 (ja)
EP (1) EP2189825A4 (ja)
JP (1) JP2009075365A (ja)
KR (2) KR101173830B1 (ja)
CN (1) CN101784927A (ja)
WO (1) WO2009037976A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010044408A1 (ja) * 2008-10-16 2010-04-22 オムロン株式会社 接着方法、接着構造、光学モジュールの製造方法および光学モジュール
JP2011058005A (ja) * 2010-12-07 2011-03-24 Omron Corp 接着方法、接着構造、光学モジュールの製造方法および光学モジュール
JP2011128237A (ja) * 2009-12-15 2011-06-30 Sumitomo Bakelite Co Ltd 光電気混載基板および電子機器

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013050651A (ja) * 2011-08-31 2013-03-14 Omron Corp 光導波路、光伝送モジュールおよび電子機器
JP6026346B2 (ja) * 2013-03-06 2016-11-16 日東電工株式会社 位置センサ
JP2014197364A (ja) * 2013-03-07 2014-10-16 日東電工株式会社 情報表示システム
KR20190071964A (ko) * 2017-12-15 2019-06-25 주식회사 레신저스 코팅된 나노선을 포함하는 광배선 및 이의 제조방법
JP7471937B2 (ja) * 2019-07-05 2024-04-22 日東電工株式会社 光ケーブルの敷設施工方法および光ケーブル敷設施工セット
WO2021006207A1 (ja) * 2019-07-05 2021-01-14 日東電工株式会社 光ケーブルの敷設施工方法および光ケーブル敷設施工セット
JP6923093B2 (ja) * 2019-07-19 2021-08-18 住友ベークライト株式会社 光導波路、接着層付き光導波路、光配線部品および電子機器

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153940A (ja) * 1994-11-25 1996-06-11 Kanegafuchi Chem Ind Co Ltd フレキシブル回路基板
JP2001102700A (ja) * 1999-07-27 2001-04-13 Sanyo Electric Co Ltd フレキシブルプリント基板及びフレキシブルプリント基板を有する携帯電話端末
JP2005156882A (ja) 2003-11-25 2005-06-16 Kyocera Corp ポリマ光導波路フィルム
JP2006024584A (ja) * 2004-07-06 2006-01-26 Sumitomo Electric Printed Circuit Inc フレキシブルプリント基板
JP2006038962A (ja) * 2004-07-22 2006-02-09 Nitto Denko Corp 保護層付き光導波路
JP2006284925A (ja) 2005-03-31 2006-10-19 Mitsui Chemicals Inc フレキシブル光電気混載基板およびこれを用いた電子機器
JP2006313389A (ja) * 2001-12-28 2006-11-16 Hitachi Chem Co Ltd ポリマー光導波路フィルム
WO2007004575A1 (ja) * 2005-06-30 2007-01-11 Mitsui Chemicals, Inc. 光導波路フィルムおよび光電気混載フィルム
JP2007212899A (ja) * 2006-02-10 2007-08-23 Omron Corp 光伝送路、光伝送モジュール、および電子機器
JP2007233360A (ja) * 2006-02-03 2007-09-13 Toray Ind Inc 光デバイス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110110638A1 (en) * 2007-08-30 2011-05-12 Mitsui Chemical, Inc. Polymeric optical waveguide film

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153940A (ja) * 1994-11-25 1996-06-11 Kanegafuchi Chem Ind Co Ltd フレキシブル回路基板
JP2001102700A (ja) * 1999-07-27 2001-04-13 Sanyo Electric Co Ltd フレキシブルプリント基板及びフレキシブルプリント基板を有する携帯電話端末
JP2006313389A (ja) * 2001-12-28 2006-11-16 Hitachi Chem Co Ltd ポリマー光導波路フィルム
JP2005156882A (ja) 2003-11-25 2005-06-16 Kyocera Corp ポリマ光導波路フィルム
JP2006024584A (ja) * 2004-07-06 2006-01-26 Sumitomo Electric Printed Circuit Inc フレキシブルプリント基板
JP2006038962A (ja) * 2004-07-22 2006-02-09 Nitto Denko Corp 保護層付き光導波路
JP2006284925A (ja) 2005-03-31 2006-10-19 Mitsui Chemicals Inc フレキシブル光電気混載基板およびこれを用いた電子機器
WO2007004575A1 (ja) * 2005-06-30 2007-01-11 Mitsui Chemicals, Inc. 光導波路フィルムおよび光電気混載フィルム
JP2007233360A (ja) * 2006-02-03 2007-09-13 Toray Ind Inc 光デバイス
JP2007212899A (ja) * 2006-02-10 2007-08-23 Omron Corp 光伝送路、光伝送モジュール、および電子機器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2189825A4 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010044408A1 (ja) * 2008-10-16 2010-04-22 オムロン株式会社 接着方法、接着構造、光学モジュールの製造方法および光学モジュール
JP2010095633A (ja) * 2008-10-16 2010-04-30 Omron Corp 接着方法、接着構造、光学モジュールの製造方法および光学モジュール
US8575636B2 (en) 2008-10-16 2013-11-05 Omron Corporation Adhesion structure of light-transmitting member and light-blocking members, method of manufacturing optical module including light-transmitting member and light-blocking members, and optical module
JP2011128237A (ja) * 2009-12-15 2011-06-30 Sumitomo Bakelite Co Ltd 光電気混載基板および電子機器
JP2011058005A (ja) * 2010-12-07 2011-03-24 Omron Corp 接着方法、接着構造、光学モジュールの製造方法および光学モジュール

Also Published As

Publication number Publication date
KR20100032448A (ko) 2010-03-25
EP2189825A1 (en) 2010-05-26
CN101784927A (zh) 2010-07-21
KR101173830B1 (ko) 2012-08-16
KR101125438B1 (ko) 2012-03-27
KR20120005559A (ko) 2012-01-16
US20120020609A1 (en) 2012-01-26
EP2189825A4 (en) 2012-07-18
JP2009075365A (ja) 2009-04-09

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