JP2006278519A5 - - Google Patents

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Publication number
JP2006278519A5
JP2006278519A5 JP2005092595A JP2005092595A JP2006278519A5 JP 2006278519 A5 JP2006278519 A5 JP 2006278519A5 JP 2005092595 A JP2005092595 A JP 2005092595A JP 2005092595 A JP2005092595 A JP 2005092595A JP 2006278519 A5 JP2006278519 A5 JP 2006278519A5
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JP
Japan
Prior art keywords
semiconductor device
manufacturing
semiconductor element
stacked
kpa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005092595A
Other languages
English (en)
Japanese (ja)
Other versions
JP4612450B2 (ja
JP2006278519A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005092595A external-priority patent/JP4612450B2/ja
Priority to JP2005092595A priority Critical patent/JP4612450B2/ja
Priority to TW095107613A priority patent/TW200727446A/zh
Priority to KR1020060027518A priority patent/KR100796884B1/ko
Priority to CNB2006100584978A priority patent/CN100440464C/zh
Priority to US11/390,285 priority patent/US7615413B2/en
Publication of JP2006278519A publication Critical patent/JP2006278519A/ja
Publication of JP2006278519A5 publication Critical patent/JP2006278519A5/ja
Priority to US12/585,547 priority patent/US7785926B2/en
Publication of JP4612450B2 publication Critical patent/JP4612450B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005092595A 2005-03-28 2005-03-28 積層型半導体装置の製造方法 Expired - Fee Related JP4612450B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005092595A JP4612450B2 (ja) 2005-03-28 2005-03-28 積層型半導体装置の製造方法
TW095107613A TW200727446A (en) 2005-03-28 2006-03-07 Stack type semiconductor device manufacturing method and stack type electronic component manufacturing method
KR1020060027518A KR100796884B1 (ko) 2005-03-28 2006-03-27 적층형 반도체 장치의 제조 방법 및 적층형 전자 부품의제조 방법
US11/390,285 US7615413B2 (en) 2005-03-28 2006-03-28 Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
CNB2006100584978A CN100440464C (zh) 2005-03-28 2006-03-28 层叠型半导体器件以及层叠型电子部件的制造方法
US12/585,547 US7785926B2 (en) 2005-03-28 2009-09-17 Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005092595A JP4612450B2 (ja) 2005-03-28 2005-03-28 積層型半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006278519A JP2006278519A (ja) 2006-10-12
JP2006278519A5 true JP2006278519A5 (enExample) 2007-06-14
JP4612450B2 JP4612450B2 (ja) 2011-01-12

Family

ID=37030623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005092595A Expired - Fee Related JP4612450B2 (ja) 2005-03-28 2005-03-28 積層型半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP4612450B2 (enExample)
CN (1) CN100440464C (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5680330B2 (ja) * 2010-04-23 2015-03-04 株式会社東芝 半導体装置の製造方法
TWI393494B (zh) 2010-06-11 2013-04-11 欣興電子股份有限公司 具有線路的基板條及其製造方法
CN102315202B (zh) * 2010-07-02 2016-03-09 欣兴电子股份有限公司 具有线路的基板条及其制造方法
JP5384443B2 (ja) * 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
JP2013098240A (ja) * 2011-10-28 2013-05-20 Toshiba Corp 記憶装置、半導体装置及び半導体装置の製造方法
JP6220706B2 (ja) * 2014-03-14 2017-10-25 リンテック株式会社 シート貼付装置および貼付方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288455A (ja) * 1995-04-11 1996-11-01 Oki Electric Ind Co Ltd 半導体装置およびその製造方法
JP3913481B2 (ja) * 2001-01-24 2007-05-09 シャープ株式会社 半導体装置および半導体装置の製造方法
JP2003041209A (ja) * 2001-07-30 2003-02-13 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造方法
JP3912223B2 (ja) * 2002-08-09 2007-05-09 富士通株式会社 半導体装置及びその製造方法
JP3966808B2 (ja) * 2002-12-03 2007-08-29 古河電気工業株式会社 粘接着テープ
JP2004193363A (ja) * 2002-12-11 2004-07-08 Fujitsu Ltd 半導体装置及びその製造方法
JP4316253B2 (ja) * 2003-02-18 2009-08-19 リンテック株式会社 ウエハダイシング・接着用シートおよび半導体装置の製造方法
JP2005327789A (ja) * 2004-05-12 2005-11-24 Sharp Corp ダイシング・ダイボンド兼用粘接着シートおよびこれを用いた半導体装置の製造方法

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