JP2006203174A5 - - Google Patents

Download PDF

Info

Publication number
JP2006203174A5
JP2006203174A5 JP2005349156A JP2005349156A JP2006203174A5 JP 2006203174 A5 JP2006203174 A5 JP 2006203174A5 JP 2005349156 A JP2005349156 A JP 2005349156A JP 2005349156 A JP2005349156 A JP 2005349156A JP 2006203174 A5 JP2006203174 A5 JP 2006203174A5
Authority
JP
Japan
Prior art keywords
substrate
shield assembly
processing system
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005349156A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006203174A (ja
JP5301765B2 (ja
Filing date
Publication date
Priority claimed from US11/003,062 external-priority patent/US7635418B2/en
Application filed filed Critical
Publication of JP2006203174A publication Critical patent/JP2006203174A/ja
Publication of JP2006203174A5 publication Critical patent/JP2006203174A5/ja
Application granted granted Critical
Publication of JP5301765B2 publication Critical patent/JP5301765B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005349156A 2004-12-03 2005-12-02 基板上の選択領域から異質な材料を除去するプラズマ処理装置及び方法 Expired - Fee Related JP5301765B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/003,062 2004-12-03
US11/003,062 US7635418B2 (en) 2004-12-03 2004-12-03 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

Publications (3)

Publication Number Publication Date
JP2006203174A JP2006203174A (ja) 2006-08-03
JP2006203174A5 true JP2006203174A5 (enExample) 2009-02-12
JP5301765B2 JP5301765B2 (ja) 2013-09-25

Family

ID=36572886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005349156A Expired - Fee Related JP5301765B2 (ja) 2004-12-03 2005-12-02 基板上の選択領域から異質な材料を除去するプラズマ処理装置及び方法

Country Status (5)

Country Link
US (2) US7635418B2 (enExample)
JP (1) JP5301765B2 (enExample)
CN (1) CN100468615C (enExample)
SG (1) SG122896A1 (enExample)
TW (1) TWI394865B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7635418B2 (en) * 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US7842223B2 (en) * 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate
US20060201910A1 (en) * 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate
DE102008064046A1 (de) * 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
DE102008064047A1 (de) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Sensorelement und Trägerelement zur Herstellung eines Sensors
US8627835B2 (en) * 2011-04-13 2014-01-14 Intermolecular, Inc. In-situ cleaning assembly
US10983721B2 (en) * 2018-07-13 2021-04-20 Fungible, Inc. Deterministic finite automata node construction and memory mapping for regular expression accelerator
CN109136836A (zh) * 2018-10-12 2019-01-04 京东方科技集团股份有限公司 掩膜板、晶圆、蒸镀装置及蒸镀方法
US11636154B2 (en) 2019-09-26 2023-04-25 Fungible, Inc. Data flow graph-driven analytics platform using data processing units having hardware accelerators
US11263190B2 (en) 2019-09-26 2022-03-01 Fungible, Inc. Data ingestion and storage by data processing unit having stream-processing hardware accelerators
US11636115B2 (en) 2019-09-26 2023-04-25 Fungible, Inc. Query processing using data processing units having DFA/NFA hardware accelerators
US11934964B2 (en) 2020-03-20 2024-03-19 Microsoft Technology Licensing, Llc Finite automata global counter in a data flow graph-driven analytics platform having analytics hardware accelerators

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59220934A (ja) * 1983-05-31 1984-12-12 Toshiba Corp 樹脂封止型半導体装置の製造方法
US4534921A (en) * 1984-03-06 1985-08-13 Asm Fico Tooling, B.V. Method and apparatus for mold cleaning by reverse sputtering
US4599970A (en) * 1985-03-11 1986-07-15 Rca Corporation Apparatus for coating a selected area of the surface of an object
JPS63500062A (ja) 1985-06-11 1988-01-07 アメリカン テレフオン アンド テレグラフ カムパニ− リ−ドフレ−ムのばり取り
JPH0643923B2 (ja) * 1986-01-16 1994-06-08 東芝セラミツクス株式会社 溶融金属の連続測温計
US5208067A (en) * 1986-04-14 1993-05-04 International Business Machines Corporation Surface modification of organic materials to improve adhesion
WO1991008095A2 (en) * 1989-11-24 1991-06-13 Asm Fico Tooling B.V. Single-strip moulding apparatus
JPH06285868A (ja) * 1993-03-30 1994-10-11 Bridgestone Corp 加硫金型の清浄方法
US5961860A (en) * 1995-06-01 1999-10-05 National University Of Singapore Pulse laser induced removal of mold flash on integrated circuit packages
US6498074B2 (en) * 1996-10-29 2002-12-24 Tru-Si Technologies, Inc. Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
JPH1177512A (ja) * 1997-09-09 1999-03-23 Oki Electric Ind Co Ltd 表面実装パッケージのリード端子自動研磨方法及びその自動研磨装置
US6230719B1 (en) * 1998-02-27 2001-05-15 Micron Technology, Inc. Apparatus for removing contaminants on electronic devices
US6082375A (en) * 1998-05-21 2000-07-04 Micron Technology, Inc. Method of processing internal surfaces of a chemical vapor deposition reactor
SG84519A1 (en) * 1998-12-07 2001-11-20 Advanced Systems Automation Method and apparatus for removal of mold flash
JP3400770B2 (ja) * 1999-11-16 2003-04-28 松下電器産業株式会社 エッチング方法、半導体装置及びその製造方法
US6489178B2 (en) 2000-01-26 2002-12-03 Texas Instruments Incorporated Method of fabricating a molded package for micromechanical devices
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
US6439869B1 (en) * 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US6450074B1 (en) * 2000-09-01 2002-09-17 Awea Mechantronic Co., Ltd. Assembly for binding and locating an added head of numerical machine tool
US20020031622A1 (en) * 2000-09-08 2002-03-14 Ippel Scott C. Plastic substrate for information devices and method for making same
JP2002184795A (ja) * 2000-12-14 2002-06-28 Hitachi Ltd 半導体装置の製造方法
US6629880B1 (en) * 2000-12-14 2003-10-07 National Semiconductor Corporation Rotary mechanical buffing method for deflashing of molded integrated circuit packages
US6732913B2 (en) 2001-04-26 2004-05-11 Advanpack Solutions Pte Ltd. Method for forming a wafer level chip scale package, and package formed thereby
US6815362B1 (en) * 2001-05-04 2004-11-09 Lam Research Corporation End point determination of process residues in wafer-less auto clean process using optical emission spectroscopy
US20030005943A1 (en) * 2001-05-04 2003-01-09 Lam Research Corporation High pressure wafer-less auto clean for etch applications
US20040235303A1 (en) * 2001-05-04 2004-11-25 Lam Research Corporation Endpoint determination of process residues in wafer-less auto clean process using optical emission spectroscopy
WO2002090615A1 (en) * 2001-05-04 2002-11-14 Lam Research Corporation Duo-step plasma cleaning of chamber residues
KR100490534B1 (ko) * 2001-12-05 2005-05-17 삼성에스디아이 주식회사 유기 전자 발광 소자의 박막 증착용 마스크 프레임 조립체
SG109495A1 (en) 2002-04-16 2005-03-30 Micron Technology Inc Semiconductor packages with leadfame grid arrays and components and methods for making the same
DE10237084A1 (de) 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements
US6750082B2 (en) * 2002-09-13 2004-06-15 Advanpack Solutions Pte. Ltd. Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip
US20040244423A1 (en) * 2003-03-28 2004-12-09 Hoya Corporation Method of manufacturing an optical glass element
US20040220066A1 (en) * 2003-05-01 2004-11-04 Rohm And Haas Electronic Materials, L.L.C. Stripper
CN1875454A (zh) * 2003-10-28 2006-12-06 诺信公司 等离子处理系统和等离子处理工艺
EP1761947B1 (en) * 2004-06-29 2015-02-25 Unaxis USA Inc. Method for reducing aspect ratio dependent etching in time division multiplexed etch processes
US7635418B2 (en) 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US7842223B2 (en) * 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate
US20060201910A1 (en) * 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate
US20070052132A1 (en) * 2005-09-02 2007-03-08 Gutierrez Roman C Method and system for cleaning molded items
US7572675B2 (en) * 2006-01-24 2009-08-11 Asm Technology Singapore Pte Ltd. Mold flash removal process for electronic devices
DE102006016200A1 (de) * 2006-04-06 2007-10-11 Krauss-Maffei Kunststofftechnik Gmbh Verfahren und Vorrichtung zur Herstellung von mehrkomponentigen Kunststoff-Formteilen

Similar Documents

Publication Publication Date Title
JP5537975B2 (ja) プラズマ加工システムにおいて使用する磁気クリップ及び基板ホルダー
JP2002289583A5 (enExample)
TW200644118A (en) Plasma processor
KR20110049880A (ko) 정전 척 및 진공 처리 장치
JP4889562B2 (ja) 接合装置および接合方法
CN103165494A (zh) 一种清洁晶片背面聚合物的装置和方法
JP4469006B2 (ja) 表示用基板の製造方法
JP2000357683A5 (enExample)
TWI394865B (zh) 電漿處理裝置及用以從基板上所選定的區域中移除異質材料之方法
KR100595418B1 (ko) 알루미늄 플라즈마 챔버 및 그 제조 방법
CN104986967B (zh) 一种熔石英表面处理的装置及方法
WO2018198198A1 (ja) ワーク搬送装置及びワーク搬送方法
JP3977935B2 (ja) プラズマ処理方法及び装置
JP3625003B2 (ja) 液晶表示基板
JPS63136525A (ja) ドライエツチング装置
JP2003068724A5 (enExample)
JPH11154599A (ja) プラズマ処理装置
KR930001646Y1 (ko) 반응성 이온 에칭장치
CN118847594A (zh) 微通道板表面的清洗方法
JP2000223440A5 (ja) スパッタリング装置、処理チャンバー及び基板処理装置
JP4546900B2 (ja) 常圧プラズマ処理装置のステージ構造
CN118782459A (zh) 芯片镀金层的等离子清洗方法、芯片封装方法及封装结构
JP2003311145A (ja) プラズマ処理装置
JPS5960272A (ja) 放射線検出器の製作方法
CN120533293A (zh) 基于大幅面吸附平台的合金电阻激光除胶设备及加工方法