TWI394865B - 電漿處理裝置及用以從基板上所選定的區域中移除異質材料之方法 - Google Patents

電漿處理裝置及用以從基板上所選定的區域中移除異質材料之方法 Download PDF

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Publication number
TWI394865B
TWI394865B TW094141008A TW94141008A TWI394865B TW I394865 B TWI394865 B TW I394865B TW 094141008 A TW094141008 A TW 094141008A TW 94141008 A TW94141008 A TW 94141008A TW I394865 B TWI394865 B TW I394865B
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TW
Taiwan
Prior art keywords
substrate
mask
plasma
upper frame
concave surfaces
Prior art date
Application number
TW094141008A
Other languages
English (en)
Chinese (zh)
Other versions
TW200632138A (en
Inventor
康崔夏弗 羅柏特Ｓ
蓋堤 詹姆士Ｄ
泰勒 詹姆士Ｓ
Original Assignee
能多順股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 能多順股份有限公司 filed Critical 能多順股份有限公司
Publication of TW200632138A publication Critical patent/TW200632138A/zh
Application granted granted Critical
Publication of TWI394865B publication Critical patent/TWI394865B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cleaning In General (AREA)
TW094141008A 2004-12-03 2005-11-22 電漿處理裝置及用以從基板上所選定的區域中移除異質材料之方法 TWI394865B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/003,062 US7635418B2 (en) 2004-12-03 2004-12-03 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

Publications (2)

Publication Number Publication Date
TW200632138A TW200632138A (en) 2006-09-16
TWI394865B true TWI394865B (zh) 2013-05-01

Family

ID=36572886

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141008A TWI394865B (zh) 2004-12-03 2005-11-22 電漿處理裝置及用以從基板上所選定的區域中移除異質材料之方法

Country Status (5)

Country Link
US (2) US7635418B2 (enExample)
JP (1) JP5301765B2 (enExample)
CN (1) CN100468615C (enExample)
SG (1) SG122896A1 (enExample)
TW (1) TWI394865B (enExample)

Cited By (1)

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CN109136836A (zh) * 2018-10-12 2019-01-04 京东方科技集团股份有限公司 掩膜板、晶圆、蒸镀装置及蒸镀方法

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US7842223B2 (en) * 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate
US20060201910A1 (en) * 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate
DE102008064046A1 (de) * 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
DE102008064047A1 (de) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Sensorelement und Trägerelement zur Herstellung eines Sensors
US8627835B2 (en) * 2011-04-13 2014-01-14 Intermolecular, Inc. In-situ cleaning assembly
US10983721B2 (en) * 2018-07-13 2021-04-20 Fungible, Inc. Deterministic finite automata node construction and memory mapping for regular expression accelerator
US11636154B2 (en) 2019-09-26 2023-04-25 Fungible, Inc. Data flow graph-driven analytics platform using data processing units having hardware accelerators
US11263190B2 (en) 2019-09-26 2022-03-01 Fungible, Inc. Data ingestion and storage by data processing unit having stream-processing hardware accelerators
US11636115B2 (en) 2019-09-26 2023-04-25 Fungible, Inc. Query processing using data processing units having DFA/NFA hardware accelerators
US11934964B2 (en) 2020-03-20 2024-03-19 Microsoft Technology Licensing, Llc Finite automata global counter in a data flow graph-driven analytics platform having analytics hardware accelerators

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US7842223B2 (en) * 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate
US20060201910A1 (en) * 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate
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US4599970A (en) * 1985-03-11 1986-07-15 Rca Corporation Apparatus for coating a selected area of the surface of an object
US20020032940A1 (en) * 1997-09-09 2002-03-21 Oki Electric Industry Co., Ltd. Method for polishing leads for semiconductor packages
US20010012681A1 (en) * 1998-02-27 2001-08-09 Wensel Richard W. Method and apparatus for removing contaminants on electronic devices
US20030101932A1 (en) * 2001-12-05 2003-06-05 Samsung Nec Mobile Display Co., Ltd. Tension mask assembly for use in vacuum deposition of thin film of organic electroluminescent device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109136836A (zh) * 2018-10-12 2019-01-04 京东方科技集团股份有限公司 掩膜板、晶圆、蒸镀装置及蒸镀方法

Also Published As

Publication number Publication date
US20060118239A1 (en) 2006-06-08
CN1815685A (zh) 2006-08-09
CN100468615C (zh) 2009-03-11
SG122896A1 (en) 2006-06-29
US8329590B2 (en) 2012-12-11
JP2006203174A (ja) 2006-08-03
US20100075505A1 (en) 2010-03-25
TW200632138A (en) 2006-09-16
JP5301765B2 (ja) 2013-09-25
US7635418B2 (en) 2009-12-22

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