JP5301765B2 - 基板上の選択領域から異質な材料を除去するプラズマ処理装置及び方法 - Google Patents

基板上の選択領域から異質な材料を除去するプラズマ処理装置及び方法 Download PDF

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Publication number
JP5301765B2
JP5301765B2 JP2005349156A JP2005349156A JP5301765B2 JP 5301765 B2 JP5301765 B2 JP 5301765B2 JP 2005349156 A JP2005349156 A JP 2005349156A JP 2005349156 A JP2005349156 A JP 2005349156A JP 5301765 B2 JP5301765 B2 JP 5301765B2
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Japan
Prior art keywords
substrate
shield assembly
plasma
mask
upper frame
Prior art date
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Expired - Fee Related
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JP2005349156A
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English (en)
Japanese (ja)
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JP2006203174A (ja
JP2006203174A5 (enExample
Inventor
エス．コンドラショフ ロバート
ディー． ゲッティ ジェームズ
エス． タイラー ジェームス
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Nordson Corp
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Nordson Corp
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Publication of JP2006203174A5 publication Critical patent/JP2006203174A5/ja
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Publication of JP5301765B2 publication Critical patent/JP5301765B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cleaning In General (AREA)
JP2005349156A 2004-12-03 2005-12-02 基板上の選択領域から異質な材料を除去するプラズマ処理装置及び方法 Expired - Fee Related JP5301765B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/003,062 2004-12-03
US11/003,062 US7635418B2 (en) 2004-12-03 2004-12-03 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

Publications (3)

Publication Number Publication Date
JP2006203174A JP2006203174A (ja) 2006-08-03
JP2006203174A5 JP2006203174A5 (enExample) 2009-02-12
JP5301765B2 true JP5301765B2 (ja) 2013-09-25

Family

ID=36572886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005349156A Expired - Fee Related JP5301765B2 (ja) 2004-12-03 2005-12-02 基板上の選択領域から異質な材料を除去するプラズマ処理装置及び方法

Country Status (5)

Country Link
US (2) US7635418B2 (enExample)
JP (1) JP5301765B2 (enExample)
CN (1) CN100468615C (enExample)
SG (1) SG122896A1 (enExample)
TW (1) TWI394865B (enExample)

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US7842223B2 (en) * 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate
US20060201910A1 (en) * 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate
DE102008064046A1 (de) * 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
DE102008064047A1 (de) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Sensorelement und Trägerelement zur Herstellung eines Sensors
US8627835B2 (en) * 2011-04-13 2014-01-14 Intermolecular, Inc. In-situ cleaning assembly
US10983721B2 (en) * 2018-07-13 2021-04-20 Fungible, Inc. Deterministic finite automata node construction and memory mapping for regular expression accelerator
CN109136836A (zh) * 2018-10-12 2019-01-04 京东方科技集团股份有限公司 掩膜板、晶圆、蒸镀装置及蒸镀方法
US11636154B2 (en) 2019-09-26 2023-04-25 Fungible, Inc. Data flow graph-driven analytics platform using data processing units having hardware accelerators
US11263190B2 (en) 2019-09-26 2022-03-01 Fungible, Inc. Data ingestion and storage by data processing unit having stream-processing hardware accelerators
US11636115B2 (en) 2019-09-26 2023-04-25 Fungible, Inc. Query processing using data processing units having DFA/NFA hardware accelerators
US11934964B2 (en) 2020-03-20 2024-03-19 Microsoft Technology Licensing, Llc Finite automata global counter in a data flow graph-driven analytics platform having analytics hardware accelerators

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US7635418B2 (en) 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US7842223B2 (en) * 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate
US20060201910A1 (en) * 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate
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Also Published As

Publication number Publication date
US20060118239A1 (en) 2006-06-08
CN1815685A (zh) 2006-08-09
CN100468615C (zh) 2009-03-11
TWI394865B (zh) 2013-05-01
SG122896A1 (en) 2006-06-29
US8329590B2 (en) 2012-12-11
JP2006203174A (ja) 2006-08-03
US20100075505A1 (en) 2010-03-25
TW200632138A (en) 2006-09-16
US7635418B2 (en) 2009-12-22

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