JP2006203007A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 56
- 150000002500 ions Chemical class 0.000 claims abstract description 15
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- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 21
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Abstract
【解決手段】 トレンチ11内に均一に厚いシリコン酸化膜3を形成させた後、Arなどのイオンを斜めイオン注入によるシャドーイングを利用してトレンチ側壁のシリコン酸化膜に選択的に注入ダメージ領域31を導入する。シリコン酸化膜3の湿式エッチング時において、イオン注入時にシャドーイングされたダメージ未導入部分よりもダメージ導入部分でエッチングレートが増大する現象を利用して、トレンチ11内の注入ダメージ領域31のシリコン酸化膜を選択的に除去し、トレンチ底部およびトレンチ底部に近いトレンチ側壁の部分的領域に残留酸化膜33を形成する。これにより、バーズビークが発生することなしに、トレンチ側壁下部と底部に相対的に厚い酸化膜を形成した半導体装置が作成できる。
【選択図】 図2
Description
このTLPM10は、p-型の半導体基板1の表面を掘り下げてトレンチ11を形成し、そのトレンチ11の側壁部分および底面部分にnドレイン領域12が形成され、底面にはnプラグ領域13が形成されている。また、n+ソース領域14はトレンチ11上部のpオフセット領域15内に形成されている。
この方法では、トレンチ100底部へのイオン注入を避けるように斜めイオン注入を行って、トレンチ側壁部のシリコンのみにN+(窒素イオン)が導入される(同図(a)に示す窒素の斜め注入工程参照)。ここで、トレンチ側壁部には窒素ドープドシリコン、もしくはシリコン窒化膜からなる耐酸化マスク領域101が形成される。その結果、同図(b)に示す状態で耐酸化マスク領域101が分布する。つぎに、熱酸化処理を行うときに、N+が導入されたトレンチ側壁の耐酸化マスク領域101では絶縁層の成長速度が低下することを利用すれば、トレンチ底部の酸化膜102の厚みが、トレンチ側壁に形成される酸化膜(図示せず)の厚みよりも相対的に大きく形成できる(同図(c)参照)。
プレーナプロセスでは、同図(a)に示すように、シリコンウエハ110の表面に部分的に窒素ドープシリコン膜、あるいはシリコン窒化膜(Si3N4)が耐酸化マスク111として配置され、その下には薄く形成されたシリコン酸化膜112が設けられる。つぎに、同図(b)に示すようにシリコン酸化膜112の選択酸化が行われる。このとき、シリコンウエハ110が熱酸化されるために、同図(b)に示すLOCOS酸化膜113が形成される。すなわち、このときの侵食作用によって、シリコンウエハ110の主面でシリコン酸化膜112が成長・拡大して、耐酸化マスク111がシリコンウエハ110の表面からいくらか持ち上げられるために、LOCOS酸化膜113が耐酸化マスク111の端部でバーズビーク(birds' beak)と呼ばれる「鳥のくちばし」形状になる。
このエッチングレートの特性図は非特許文献1に示されているものである。アルゴンイオン注入によってダメージが導入されたシリコン酸化膜の湿式エッチングレートは、深さ方向に分布して、そのドーズ量によっては、浅い位置と深い位置にエッチングレートの極大値を持つ場合がある。実線は浅い位置でのエッチングレートの極大値が表され、点線は深い位置でのエッチングレートの極大値が表されている。なお、横軸はAr注入ドーズ量D、縦軸はエッチングレートREである。すなわち、酸化膜のエッチングレートはAr注入ドーズ量が大きいほど、つまり酸化膜中に導入されるダメージ量が大きいほど大きい。また、酸化膜中のAr分布やダメージ分布は注入エネルギー/注入ドーズ量によって可変であるため、用途により注入エネルギー/注入ドーズ量を調整することにより、湿式エッチング後に残留させる酸化膜の膜厚や膜質等を制御させることができる。
このTLPMは、p-型半導体基板1の表面を掘り下げてトレンチ11を形成し、そのトレンチ11の側壁部分および底面部分にnドレイン領域12が形成され、底面にはnプラグ領域13が形成されている。また、n+ソース領域14は半導体基板のトレンチ11上部のpオフセット領域15内に形成されている。図9の従来のTLPMと異なるのは、トレンチ11の側壁面のうち、少なくともゲート酸化膜18が付着した部分に張出し部を含まないフラットな形状となっていることである。
図7のTLPMとの違いは、ゲート電極19とnドレイン領域12との間に設けられるゲート酸化膜18の厚さだけである。図7のものは、トレンチ11の底部だけでなくトレンチ側壁の下部にも酸化膜が残留して形成される残留酸化膜33を利用しているのに対し、図8のものは、図6(b)に示す残留酸化膜36を利用してゲート酸化膜18が形成されている。
2 エッチングマスク
3 シリコン酸化膜
10 TLPM(トレンチ横型パワーMOSFET)
11 トレンチ
12 nドレイン領域
13 nプラグ領域
14 n+ソース領域
15 pオフセット領域
16 ソース電極
17 ドレイン電極
18 ゲート酸化膜
19 ゲート電極
20 ドレイン接続導体
21 ソース接続導体
22 絶縁膜
31 注入ダメージ領域
Claims (11)
- 半導体基板にトレンチを形成し、前記トレンチの底部とトレンチ側壁にそれぞれゲート絶縁層を形成する半導体装置の製造方法において、
前記トレンチの底部と前記トレンチ側壁にそれぞれ所定の厚さでゲート絶縁膜を形成する絶縁膜形成工程と、
前記トレンチ側壁に形成された前記ゲート絶縁膜のうち前記トレンチの開口部に近いものの一部を除去して、その膜厚を選択的に低減する膜厚低減工程と、
を備えたこと特徴とする半導体装置の製造方法。 - 前記ゲート絶縁膜は、シリコン酸化膜であることを特徴とする請求項1記載の半導体装置の製造方法。
- 前記絶縁膜形成工程では、減圧化学気相成長法(LP−CVD)によって高温酸化膜(HTO)を形成することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記絶縁膜形成工程では、減圧化学気相成長法(LP−CVD)によってTEOS膜を形成することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記膜厚低減工程は、
前記ゲート絶縁膜に部分的に注入ダメージ領域を導入する第1のステップと、
前記第1のステップで導入された前記注入ダメージ領域から前記ゲート絶縁膜を選択的に除去する第2のステップと、
から構成されていることを特徴とする請求項1記載の半導体装置の製造方法。 - 前記第1のステップでは、
前記トレンチの底部と前記トレンチ側壁の表面にそれぞれ所定の厚さで形成されたシリコン酸化膜に対して、第1の注入種を所定の入射角度で照射することにより、前記トレンチ側壁全体に、あるいは前記トレンチ側壁のうち前記トレンチの開口部に近い領域にのみ部分的に前記注入ダメージ領域を導入したことを特徴とする請求項5記載の半導体装置の製造方法。 - 前記第2のステップでは、
前記第1の注入種に対する前記注入ダメージ領域とそれ以外の領域でのエッチングレートの差を利用して、前記トレンチ内の底部における前記シリコン酸化膜、あるいは前記トレンチ内の底部およびその近傍の側壁面における前記シリコン酸化膜が厚く残留するようにエッチングして除去することを特徴とする請求項6記載の半導体装置の製造方法。 - 前記第2のステップでは、
フッ酸系水溶液を用いた湿式エッチングにより前記シリコン酸化膜のエッチングを行うことを特徴とする請求項6記載の半導体装置の製造方法。 - 前記第1の注入種が不活性ガスのイオンであることを特徴とする請求項6記載の半導体装置の製造方法。
- 前記第1の注入種がアルゴンイオンを含む希ガス原子のイオンであることを特徴とする請求項6記載の半導体装置の製造方法。
- 前記第1の注入種がハロゲン原子のイオンであることを特徴とする請求項6記載の半導体装置の製造方法。
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