JP2019054106A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 174
- 239000012535 impurity Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
なお、図面は模式的または概念的なものであり、各部分の厚みと幅との関係、部分間の大きさの比率などは、必ずしも現実のものと同一とは限らない。また、同じ部分を表す場合であっても、図面により互いの寸法や比率が異なって表される場合もある。
また、本願明細書と各図において、既に説明したものと同様の要素には同一の符号を付して詳細な説明は適宜省略する。
以下の説明において、n+、n、n−及びp+、p、p−の表記は、各導電形における不純物濃度の相対的な高低を表す。すなわち、「+」が付されている表記は、「+」および「−」のいずれも付されていない表記よりも不純物濃度が相対的に高く、「−」が付されている表記は、いずれも付されていない表記よりも不純物濃度が相対的に低いことを示す。
以下で説明する実施形態は、各半導体領域のp形とn形を反転させて実施してもよい。
半導体装置1は、例えば、LDMOS(laterally diffused metal oxide semiconductor)である。図1に表したように、実施形態に係る半導体装置1は、半導体領域11(第1半導体領域)、p形(第1導電形の一例)ベース領域12(第2半導体領域)、n+形(第2導電形の一例)ソース領域13(第3半導体領域)、n形ドリフト領域14(第4半導体領域)、ゲート電極20、ソース電極21(第1電極)、およびドレイン電極22(第2電極)を有する。
図2では、図1に表したゲート電極20および第2絶縁部32近傍が拡大して表されている。
ソース電極21に対してドレイン電極22に正の電圧が印加された状態で、ゲート電極20に閾値以上の電圧が印加されると、p形ベース領域12のゲート絶縁層20s近傍にチャネル(反転層)が形成され、半導体装置1がオン状態となる。電子は、このチャネルを通ってソース電極21からドレイン電極22へ流れる。その後、ゲート電極20に印加される電圧が閾値よりも低くなると、p形ベース領域12におけるチャネルが消滅し、半導体装置1がオフ状態になる。
半導体領域11、p形ベース領域12、n+形ソース領域13、n形ドリフト領域14、n+形ドレイン領域15、およびp+形バックゲート領域16は、例えば、半導体材料として、シリコン、炭化シリコン、窒化ガリウム、またはガリウムヒ素を含む。半導体材料としてシリコンが用いられる場合、n形不純物として、ヒ素、リン、またはアンチモンを用いることができる。p形不純物として、ボロンを用いることができる。
図3〜図5は、実施形態に係る半導体装置1の製造工程を表す工程断面図である。
まず、p−形の半導体層11aを用意する。半導体層11aは、n−形でも良い。半導体層11aは、例えば、半導体基板の一部である。または、半導体層11aは、半導体基板の上に半導体材料をエピタキシャル成長させることで形成されても良い。
図6は、参考例に係る半導体装置100を表す断面図である。
参考例に係る半導体装置100は、p形ベース領域112、n+形ソース領域113、n形ドリフト領域114、n+形ドレイン領域115、ゲート電極120、ゲート絶縁層120s、ソース電極121、ドレイン電極122、および絶縁部132を有する。
また、各半導体領域における不純物濃度については、例えば、SIMS(二次イオン質量分析法)により測定することが可能である。
Claims (6)
- 第1半導体領域と、
前記第1半導体領域の一部の上に設けられた第1導電形の第2半導体領域と、
前記第2半導体領域の一部の上に設けられた第2導電形の第3半導体領域と、
前記第1半導体領域の他の一部の上に設けられた第2導電形の第4半導体領域であって、
前記第1半導体領域から前記第2半導体領域に向かう第1方向と交差する第2方向において前記第2半導体領域と並ぶ第1部分と、
前記第3半導体領域よりも上方に位置する第2部分と、
を有する前記第4半導体領域と、
前記第2半導体領域の他の一部、前記第3半導体領域の一部、および前記第1部分の上にゲート絶縁層を介して設けられたゲート電極と、
前記第3半導体領域の他の一部の上に設けられ、前記第3半導体領域と電気的に接続された第1電極と、
前記第2部分の上に設けられ、前記第4半導体領域と電気的に接続された第2電極と、
を備えた半導体装置。 - 前記第2部分の上に設けられた第1導電形の第5半導体領域と、
前記ゲート電極の上に設けられた第1絶縁部と、
をさらに備え、
前記第5半導体領域における第1導電形のキャリア濃度は、前記第2部分における第1導電形のキャリア濃度よりも高く、
前記第5半導体領域は、前記第2方向において前記第1絶縁部と並ぶ請求項1記載の半導体装置。 - 前記第2方向において、前記ゲート電極と前記第2部分との間に設けられた第2絶縁部をさらに備え、
前記第2絶縁部の前記第2方向における長さは、前記ゲート絶縁層の前記第1方向における長さよりも長い請求項1または2に記載の半導体装置。 - 前記第2絶縁部の下端は、湾曲している請求項3記載の半導体装置。
- 前記ゲート電極の前記第1方向における長さは、前記ゲート電極の前記第2方向における長さよりも長い請求項1〜4のいずれか1つに記載の半導体装置。
- 前記ゲート電極は、前記第2方向において、前記第1電極と前記第2部分との間に位置する請求項1〜5のいずれか1つに記載の半導体装置。
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