JP2006190972A - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP2006190972A
JP2006190972A JP2005300261A JP2005300261A JP2006190972A JP 2006190972 A JP2006190972 A JP 2006190972A JP 2005300261 A JP2005300261 A JP 2005300261A JP 2005300261 A JP2005300261 A JP 2005300261A JP 2006190972 A JP2006190972 A JP 2006190972A
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JP
Japan
Prior art keywords
power
semiconductor device
power semiconductor
terminal
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005300261A
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English (en)
Japanese (ja)
Other versions
JP2006190972A5 (enExample
Inventor
Naoki Yoshimatsu
直樹 吉松
Takanobu Yoshida
貴信 吉田
Toshiaki Shinohara
利彰 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2005300261A priority Critical patent/JP2006190972A/ja
Priority to DE102005057981A priority patent/DE102005057981A1/de
Priority to US11/295,442 priority patent/US7656016B2/en
Publication of JP2006190972A publication Critical patent/JP2006190972A/ja
Publication of JP2006190972A5 publication Critical patent/JP2006190972A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2005300261A 2004-12-08 2005-10-14 電力用半導体装置 Pending JP2006190972A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005300261A JP2006190972A (ja) 2004-12-08 2005-10-14 電力用半導体装置
DE102005057981A DE102005057981A1 (de) 2004-12-08 2005-12-05 Leistungshalbleitervorrichtung
US11/295,442 US7656016B2 (en) 2004-12-08 2005-12-07 Power semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004354826 2004-12-08
JP2005300261A JP2006190972A (ja) 2004-12-08 2005-10-14 電力用半導体装置

Publications (2)

Publication Number Publication Date
JP2006190972A true JP2006190972A (ja) 2006-07-20
JP2006190972A5 JP2006190972A5 (enExample) 2008-01-10

Family

ID=36500367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005300261A Pending JP2006190972A (ja) 2004-12-08 2005-10-14 電力用半導体装置

Country Status (3)

Country Link
US (1) US7656016B2 (enExample)
JP (1) JP2006190972A (enExample)
DE (1) DE102005057981A1 (enExample)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129806A (ja) * 2008-11-28 2010-06-10 Mitsubishi Electric Corp 電力用半導体装置および製造方法
JP2010172147A (ja) * 2009-01-26 2010-08-05 Denso Corp 電力変換装置
JP2010200433A (ja) * 2009-02-24 2010-09-09 Denso Corp 電力変換装置
JP2010232334A (ja) * 2009-03-26 2010-10-14 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2010258308A (ja) * 2009-04-27 2010-11-11 Sharp Corp 半導体装置およびコネクタ
JP2011035351A (ja) * 2009-08-06 2011-02-17 Denso Corp 半導体冷却器
JP2011109740A (ja) * 2009-11-13 2011-06-02 Hitachi Automotive Systems Ltd 電力変換装置
JP2011222563A (ja) * 2010-04-02 2011-11-04 Toyota Central R&D Labs Inc パワーモジュール
JP2013012642A (ja) * 2011-06-30 2013-01-17 Meidensha Corp パワー半導体モジュール
JP2013080843A (ja) * 2011-10-04 2013-05-02 Denso Corp 半導体モジュール及びその配設構造
JP2013179261A (ja) * 2012-01-31 2013-09-09 Aisin Aw Co Ltd スイッチング素子ユニット
WO2015111211A1 (ja) 2014-01-27 2015-07-30 株式会社日立製作所 パワーモジュール及びその製造方法
KR20150133004A (ko) * 2014-05-19 2015-11-27 한온시스템 주식회사 전기소자 냉각용 열교환기 제조방법
KR20150132973A (ko) * 2014-05-19 2015-11-27 한온시스템 주식회사 전기소자 냉각용 열교환기
JP2017060291A (ja) * 2015-09-16 2017-03-23 富士電機株式会社 電力変換装置
CN109285817A (zh) * 2017-07-19 2019-01-29 比亚迪股份有限公司 半导体装置及具有其的车辆
WO2023068057A1 (ja) * 2021-10-22 2023-04-27 日立Astemo株式会社 電力変換装置

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4575034B2 (ja) * 2004-06-03 2010-11-04 株式会社東芝 インバータ装置
JP4293246B2 (ja) * 2007-02-19 2009-07-08 株式会社日立製作所 電力変換装置
US7965508B2 (en) * 2007-03-27 2011-06-21 Denso Corporation Cooling device for electronic component and power converter equipped with the same
US7911806B2 (en) * 2007-09-28 2011-03-22 Hitachi, Ltd Method and apparatus for reducing EMI emissions from a power inverter
US9064737B2 (en) * 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module
JP4819071B2 (ja) * 2008-02-06 2011-11-16 本田技研工業株式会社 電気車両及び車両用ｄｃ／ｄｃコンバータの冷却方法
US7911792B2 (en) * 2008-03-11 2011-03-22 Ford Global Technologies Llc Direct dipping cooled power module and packaging
JP5319979B2 (ja) * 2008-07-28 2013-10-16 株式会社ケーヒン バスバーを有する端子
JP5473733B2 (ja) * 2010-04-02 2014-04-16 株式会社日立製作所 パワー半導体モジュール
JP5062302B2 (ja) 2010-06-29 2012-10-31 株式会社デンソー 冷却器への電子部品内蔵配線基板の取付構造及びその取付方法
DE102011075921B8 (de) * 2011-05-16 2014-08-07 Infineon Technologies Ag Mittels Klemmkeil und Gegenkeil elektrisch anschließbares Leistungshalbleitermodul und Leistungshalbleitermodulsystem mit einem solchen Leistungshalbleitermodul
EP2648495B1 (en) * 2012-04-04 2015-02-25 Inmotion Technologies AB Switched power converter
CN202799522U (zh) * 2012-07-28 2013-03-13 中山大洋电机制造有限公司 一种电机控制器结构
US8897014B2 (en) * 2012-09-04 2014-11-25 General Electric Company Mechanical layout for half-bridge power module that is optimized for low inductance
EP4293714A3 (en) 2012-09-20 2024-02-28 Rohm Co., Ltd. Power semiconductor device module
JP2014222745A (ja) * 2013-05-14 2014-11-27 富士通株式会社 冷却構造体、基板ユニット、システム基板体及び電子機器
DE112014004189T5 (de) * 2013-09-12 2016-06-02 Hanon Systems Wärmetauscher zum Kühlen eines elektrischen Bauteils
KR101988992B1 (ko) * 2013-09-27 2019-06-13 한온시스템 주식회사 전기소자 냉각용 열교환기
TWI539894B (zh) * 2014-11-28 2016-06-21 財團法人工業技術研究院 功率模組
JP6409556B2 (ja) * 2014-12-19 2018-10-24 富士通株式会社 冷却機構付き基板及び電子機器
US10448545B2 (en) * 2015-03-10 2019-10-15 Hanon Systems Heat exchanger for cooling electrical element
US10037977B2 (en) * 2015-08-19 2018-07-31 Ford Global Technologies, Llc Power electronics system
KR102356681B1 (ko) * 2015-10-08 2022-02-07 현대모비스 주식회사 직접냉각유로를 갖는 전력반도체 냉각 장치
KR102443261B1 (ko) * 2015-10-08 2022-09-13 현대모비스 주식회사 직접냉각유로를 갖는 전력반도체 양면 냉각 장치
US10132400B2 (en) 2016-01-19 2018-11-20 Ford Global Technologies, Llc Differential mounting system
FR3049159B1 (fr) * 2016-03-15 2019-10-25 Institut Vedecom Module d’electronique de puissance refroidi, moteur et vehicule integrant un tel module
US20170336152A1 (en) * 2016-05-20 2017-11-23 Hyundai Motor Company Double-sided cooler for cooling both sides of electronic component
KR102440583B1 (ko) * 2016-11-22 2022-09-05 현대자동차 주식회사 파워 유닛, 및 이를 구비한 전력변환장치
US10607919B2 (en) 2017-04-28 2020-03-31 Semiconductor Components Industries, Llc Semiconductor package having junction cooling pipes embedded in substrates
KR102325110B1 (ko) * 2017-05-31 2021-11-11 한온시스템 주식회사 전기소자 냉각용 열교환기
DE102018112601A1 (de) * 2017-05-31 2018-12-06 Hanon Systems Elektroelement-Kühlungsmodul
US10483028B2 (en) * 2017-12-18 2019-11-19 Deere & Company Electrical assembly having cavities for coolant
US11052740B2 (en) 2018-06-05 2021-07-06 Ford Global Technologies, Llc Power supply device
US10377217B1 (en) 2018-06-05 2019-08-13 Ford Global Technologies, Llc Power supply device
CN109524375A (zh) * 2018-11-29 2019-03-26 徐州华琅自动化设备有限公司 一种电动车控制器mos管散热装置
US11495881B1 (en) * 2018-12-10 2022-11-08 Ball Aerospace & Technologies Corp. Antenna system with integrated electromagnetic interference shielded heat sink
US11135936B2 (en) 2019-03-06 2021-10-05 Fermata, LLC Methods for using temperature data to protect electric vehicle battery health during use of bidirectional charger
US11958372B2 (en) * 2019-11-26 2024-04-16 Fermata Energy Llc Device for bi-directional power conversion and charging for use with electric vehicles
EP3962257A4 (en) * 2020-05-28 2022-07-13 Hangzhou Dareruohan Technology Co., Ltd. HEAT DISSIPATION DEVICE AND HEAT DISSIPATION AND HEATER SYSTEM
DE112021002397T5 (de) 2020-10-14 2023-02-09 Rohm Co., Ltd. Halbleitermodul
DE212021000239U1 (de) 2020-10-14 2022-06-07 Rohm Co., Ltd. Halbleitermodul
DE202021004377U1 (de) 2020-10-14 2024-01-05 Rohm Co., Ltd. Halbleitermodul
CN116034465A (zh) 2020-10-14 2023-04-28 罗姆股份有限公司 半导体模块
FR3117729B1 (fr) * 2020-12-14 2023-12-29 Valeo Systemes Thermiques Système de traitement thermique d’un élément électrique et/ou électronique
US12101916B2 (en) * 2021-05-26 2024-09-24 Ferrari S.P.A. Compact electronic power converter to control at least one electric motor of a vehicle
US11856687B2 (en) * 2021-12-21 2023-12-26 Semikron Elektronik Gmbh & Co. Kg Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
US12484187B2 (en) * 2023-06-28 2025-11-25 Hyundai Motor Company Cooling apparatus for power module
DE102023213051A1 (de) * 2023-12-20 2025-06-26 Zf Friedrichshafen Ag Baugruppe mit Leistungsmodul und Kühler, Inverter und Kraftfahrzeug

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130557U (enExample) * 1988-03-01 1989-09-05
JPH05110215A (ja) * 1991-10-14 1993-04-30 Okuma Mach Works Ltd パワー配線基板
JPH05206688A (ja) * 1992-01-24 1993-08-13 Toshiba Corp 半導体装置とその面実装方法
JPH0794669A (ja) * 1993-09-20 1995-04-07 Toshiba Corp 半導体パッケ−ジモジュ−ル
JP2001100474A (ja) * 1999-09-29 2001-04-13 Kyocera Mita Corp 画像形成装置の底面構造
JP2001284525A (ja) * 2000-03-30 2001-10-12 Denso Corp 半導体チップおよび半導体装置
JP2001308266A (ja) * 2000-04-21 2001-11-02 Denso Corp 半導体モジュール装置
JP2003031765A (ja) * 2001-07-17 2003-01-31 Hitachi Ltd パワーモジュールおよびインバータ
JP2003088098A (ja) * 2001-09-13 2003-03-20 Toshiba Elevator Co Ltd 電力変換装置
JP2003243591A (ja) * 2002-02-22 2003-08-29 Sanyo Electric Co Ltd 電子装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2160001C2 (de) * 1971-12-03 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiteranordnung, insbesondere Thyristorbaugruppe
US4192565A (en) * 1976-10-28 1980-03-11 Richard Gianni Multi-level socket for an integrated circuit
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
CA1227886A (en) 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
US4878106A (en) * 1986-12-02 1989-10-31 Anton Piller Gmbh & Co. Kg Semiconductor circuit packages for use in high power applications and method of making the same
US5060112A (en) 1990-04-02 1991-10-22 Cocconi Alan G Electrical component assembly with heat sink
JPH0624279A (ja) 1992-05-12 1994-02-01 Nippondenso Co Ltd 電気自動車用冷却装置
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
JPH07335783A (ja) * 1994-06-13 1995-12-22 Fujitsu Ltd 半導体装置及び半導体装置ユニット
US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
KR0179803B1 (ko) * 1995-12-29 1999-03-20 문정환 리드노출형 반도체 패키지
JP4085536B2 (ja) * 1998-11-09 2008-05-14 株式会社日本自動車部品総合研究所 電気機器およびその製造方法並びに圧接型半導体装置
JP3547333B2 (ja) * 1999-02-22 2004-07-28 株式会社日立産機システム 電力変換装置
US6442033B1 (en) * 1999-09-24 2002-08-27 Virginia Tech Intellectual Properties, Inc. Low-cost 3D flip-chip packaging technology for integrated power electronics modules
US6232151B1 (en) * 1999-11-01 2001-05-15 General Electric Company Power electronic module packaging
EP1742265B1 (en) * 2000-04-19 2013-08-07 Denso Corporation Coolant cooled type semiconductor device
FR2809281B1 (fr) 2000-05-22 2002-07-12 Alstom Dispositif electronique de puissance
JP2002216860A (ja) 2001-01-18 2002-08-02 Ngk Insulators Ltd 冷却ジャケット付き電気部品
JP3627738B2 (ja) * 2001-12-27 2005-03-09 株式会社デンソー 半導体装置
US6635970B2 (en) * 2002-02-06 2003-10-21 International Business Machines Corporation Power distribution design method for stacked flip-chip packages
JP2003333702A (ja) 2002-05-16 2003-11-21 Mitsubishi Heavy Ind Ltd 電動機の制御装置
JP3669971B2 (ja) 2002-05-21 2005-07-13 三菱電機株式会社 半導体モジュール
JP3736527B2 (ja) 2002-12-27 2006-01-18 日産自動車株式会社 インバータ装置のパワーモジュール設置構造
US6870271B2 (en) * 2003-01-29 2005-03-22 Sun Microsystems, Inc. Integrated circuit assembly module that supports capacitive communication between semiconductor dies
JP4210908B2 (ja) 2003-02-19 2009-01-21 株式会社デンソー 半導体モジュール
JP4120876B2 (ja) 2003-05-26 2008-07-16 株式会社デンソー 半導体装置
TWI283467B (en) * 2003-12-31 2007-07-01 Advanced Semiconductor Eng Multi-chip package structure

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130557U (enExample) * 1988-03-01 1989-09-05
JPH05110215A (ja) * 1991-10-14 1993-04-30 Okuma Mach Works Ltd パワー配線基板
JPH05206688A (ja) * 1992-01-24 1993-08-13 Toshiba Corp 半導体装置とその面実装方法
JPH0794669A (ja) * 1993-09-20 1995-04-07 Toshiba Corp 半導体パッケ−ジモジュ−ル
JP2001100474A (ja) * 1999-09-29 2001-04-13 Kyocera Mita Corp 画像形成装置の底面構造
JP2001284525A (ja) * 2000-03-30 2001-10-12 Denso Corp 半導体チップおよび半導体装置
JP2001308266A (ja) * 2000-04-21 2001-11-02 Denso Corp 半導体モジュール装置
JP2003031765A (ja) * 2001-07-17 2003-01-31 Hitachi Ltd パワーモジュールおよびインバータ
JP2003088098A (ja) * 2001-09-13 2003-03-20 Toshiba Elevator Co Ltd 電力変換装置
JP2003243591A (ja) * 2002-02-22 2003-08-29 Sanyo Electric Co Ltd 電子装置

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129806A (ja) * 2008-11-28 2010-06-10 Mitsubishi Electric Corp 電力用半導体装置および製造方法
JP2010172147A (ja) * 2009-01-26 2010-08-05 Denso Corp 電力変換装置
JP2010200433A (ja) * 2009-02-24 2010-09-09 Denso Corp 電力変換装置
US8338944B2 (en) 2009-03-26 2012-12-25 Mitsubishi Electric Corporation Semiconductor device, semiconductor module, radiating fin and fitting portions
JP2010232334A (ja) * 2009-03-26 2010-10-14 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2010258308A (ja) * 2009-04-27 2010-11-11 Sharp Corp 半導体装置およびコネクタ
US8608388B2 (en) 2009-04-27 2013-12-17 Sharp Kabushiki Kaisha Semiconductor device and connector
JP2011035351A (ja) * 2009-08-06 2011-02-17 Denso Corp 半導体冷却器
JP2011109740A (ja) * 2009-11-13 2011-06-02 Hitachi Automotive Systems Ltd 電力変換装置
US8526189B2 (en) 2010-04-02 2013-09-03 Kabushiki Kaisha Toyota Chuo Kenkyusho Power module
JP2011222563A (ja) * 2010-04-02 2011-11-04 Toyota Central R&D Labs Inc パワーモジュール
JP2013012642A (ja) * 2011-06-30 2013-01-17 Meidensha Corp パワー半導体モジュール
JP2013080843A (ja) * 2011-10-04 2013-05-02 Denso Corp 半導体モジュール及びその配設構造
JP2013179261A (ja) * 2012-01-31 2013-09-09 Aisin Aw Co Ltd スイッチング素子ユニット
US9177948B2 (en) 2012-01-31 2015-11-03 Aisin Aw Co., Ltd. Switching element unit
WO2015111211A1 (ja) 2014-01-27 2015-07-30 株式会社日立製作所 パワーモジュール及びその製造方法
US10080313B2 (en) 2014-01-27 2018-09-18 Hitachi, Ltd. Power module and method for manufacturing the same
KR20150133004A (ko) * 2014-05-19 2015-11-27 한온시스템 주식회사 전기소자 냉각용 열교환기 제조방법
KR20150132973A (ko) * 2014-05-19 2015-11-27 한온시스템 주식회사 전기소자 냉각용 열교환기
KR102089630B1 (ko) * 2014-05-19 2020-03-16 한온시스템 주식회사 전기소자 냉각용 열교환기 제조방법
KR102089628B1 (ko) * 2014-05-19 2020-03-16 한온시스템 주식회사 전기소자 냉각용 열교환기
JP2017060291A (ja) * 2015-09-16 2017-03-23 富士電機株式会社 電力変換装置
CN109285817A (zh) * 2017-07-19 2019-01-29 比亚迪股份有限公司 半导体装置及具有其的车辆
WO2023068057A1 (ja) * 2021-10-22 2023-04-27 日立Astemo株式会社 電力変換装置
JP2023062905A (ja) * 2021-10-22 2023-05-09 日立Astemo株式会社 電力変換装置
JP7705779B2 (ja) 2021-10-22 2025-07-10 Ａｓｔｅｍｏ株式会社 電力変換装置

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