JP2013179261A - スイッチング素子ユニット - Google Patents
スイッチング素子ユニット Download PDFInfo
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- JP2013179261A JP2013179261A JP2012263052A JP2012263052A JP2013179261A JP 2013179261 A JP2013179261 A JP 2013179261A JP 2012263052 A JP2012263052 A JP 2012263052A JP 2012263052 A JP2012263052 A JP 2012263052A JP 2013179261 A JP2013179261 A JP 2013179261A
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- 239000003990 capacitor Substances 0.000 claims abstract description 174
- 238000009499 grossing Methods 0.000 claims abstract description 95
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 description 19
- 239000010419 fine particle Substances 0.000 description 7
- 239000000443 aerosol Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
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Abstract
【解決手段】平滑コンデンサ50の外面に形成された素子配置面S1が、平滑コンデンサ50の電極の間に介在する誘電体部分53と一体的に形成されており、素子配置面S1に、平滑コンデンサ50の端子51,52に電気的に接続される電極であるコンデンサ接続電極P1,P2が形成されている。スイッチング素子10は、当該スイッチング素子10の端子とコンデンサ接続電極P1,P2とが電気的に接続された状態で、素子配置面S1に配置されている。
【選択図】図4
Description
また、サージ電圧の低下に応じてスイッチング素子及び周辺部品に要求される耐電圧性能を低く抑えることができるため、ユニット全体のコストの低減を図ることもできる。
さらに、上記の特徴構成によれば、素子配置面が平滑コンデンサの誘電体部分と一体的に形成されるため、素子配置面を当該誘電体部分と同時に形成して、スイッチング素子ユニットの製造工程の簡素化を図ることができる。
図1〜図3に示すように、スイッチング素子ユニット1は、スイッチング素子10と第一平滑コンデンサ50とを備え、本実施形態では更に、スイッチング素子10に対して電気的に並列に接続されるダイオード素子20を備えている。第一平滑コンデンサ50は、スイッチング素子10に供給される直流電圧の変動を抑制する(すなわち、当該直流電圧を平滑化する)回路部品である。本実施形態では、図7に示すように、回転電機2を駆動する回転電機駆動回路は、インバータ回路91に加えて昇圧回路92を備えており、平滑コンデンサとして第一平滑コンデンサ50に加えて第二平滑コンデンサ60が回転電機駆動回路に備えられている。昇圧回路92は、直流電源3の直流電圧を昇圧するための回路であり、2つのスイッチング素子10、当該2つのスイッチング素子10のそれぞれに電気的に並列に接続された合計2つのダイオード素子20、及びリアクトル82を備えて構成されている。リアクトル82には、スイッチング素子10のスイッチングに応じて断続的にエネルギが蓄積される。直流電源3は、例えば、バッテリ、キャパシタ等により構成される。
次に、スイッチング素子ユニット1が備えるスイッチング素子10により形成される、スイッチング素子直列回路70について説明する。図2及び図3に示すように、本実施形態では、素子配置面S1には2つのスイッチング素子10が配置されている。そして、以下に説明するように、これら2つのスイッチング素子10が電気的に互いに直列に接続されることにより、図7に示すスイッチング素子直列回路70が形成されている。言い換えれば、スイッチング素子直列回路70を形成する2つのスイッチング素子10は、同じ素子配置面S1に配置されている。
最後に、本発明に係るスイッチング素子ユニットの、その他の実施形態について説明する。なお、以下のそれぞれの実施形態で開示される構成は、矛盾が生じない限り、他の実施形態で開示される構成と組み合わせて適用することが可能である。
10:スイッチング素子
10a:上段側スイッチング素子(第一スイッチング素子)
10b:下段側スイッチング素子(第二スイッチング素子)
11:制御端子
20:ダイオード素子
50:第一平滑コンデンサ(平滑コンデンサ)
51:第一端子
52:第二端子
53:誘電体部分
61:第一接続部材
61a:第一部分
61b:第二部分
62:第二接続部材
62a:第一部分
62b:第二部分
70:スイッチング素子直列回路
71:第一端部
72:第二端部
91:インバータ回路(直流交流変換回路)
P1:第一コンデンサ接続電極
P2:第二コンデンサ接続電極
P3:素子間接続電極
P4:制御用電極
S1:素子配置面
S2:第一対向配置面
S3:第二対向配置面
Claims (11)
- スイッチング素子と、当該スイッチング素子に供給される直流電圧の変動を抑制する平滑コンデンサと、を備えたスイッチング素子ユニットであって、
前記平滑コンデンサの外面に形成された素子配置面が、前記平滑コンデンサの電極の間に介在する誘電体部分と、一体的に形成されており、
前記素子配置面に、前記平滑コンデンサの端子に電気的に接続される電極であるコンデンサ接続電極が形成されており、
前記スイッチング素子は、当該スイッチング素子の端子と前記コンデンサ接続電極とが電気的に接続された状態で、前記素子配置面に配置されているスイッチング素子ユニット。 - 前記スイッチング素子は、前記素子配置面に対向する対向配置面を有し、
前記対向配置面と前記素子配置面とが直接又は接合部材を介して当接するように、前記素子配置面に前記スイッチング素子が配置されている請求項1に記載のスイッチング素子ユニット。 - 前記スイッチング素子は、前記対向配置面に、前記直流電圧の供給源に電気的に接続される主端子を備え、
前記主端子が、前記コンデンサ接続電極に電気的に接続されている請求項2に記載のスイッチング素子ユニット。 - 前記スイッチング素子は、前記素子配置面に対向する対向配置面を有し、
前記対向配置面に、前記スイッチング素子の制御用の制御端子が形成され、
前記素子配置面に、前記制御端子に電気的に接続される制御用電極が形成されている請求項1から3のいずれか一項に記載のスイッチング素子ユニット。 - 前記スイッチング素子に対して電気的に並列に接続されるダイオード素子を更に備え、
前記ダイオード素子が、前記素子配置面に配置されている請求項1から4のいずれか一項に記載のスイッチング素子ユニット。 - 前記スイッチング素子の前記素子配置面に対向する対向配置面が、第一対向配置面であり、
前記ダイオード素子は、前記素子配置面に対向する第二対向配置面に、前記コンデンサ接続電極と電気的に接続される端子を備え、
前記第二対向配置面と前記素子配置面とが直接又は接合部材を介して当接するように、前記素子配置面に前記ダイオード素子が配置されている請求項5に記載のスイッチング素子ユニット。 - 電気的に互いに直列に接続されてスイッチング素子直列回路を形成する2つの前記スイッチング素子が、前記素子配置面に配置されており、
前記素子配置面に、前記スイッチング素子直列回路の第一端部と前記平滑コンデンサの第一端子とを電気的に接続する第一コンデンサ接続電極と、前記スイッチング素子直列回路の第二端部と前記平滑コンデンサの第二端子とを電気的に接続する第二コンデンサ接続電極と、2つの前記スイッチング素子間を電気的に接続する素子間接続電極と、が形成されている請求項1から6のいずれか一項に記載のスイッチング素子ユニット。 - 前記素子間接続電極が、前記素子配置面の延在方向における前記第一コンデンサ接続電極と前記第二コンデンサ接続電極との間に配置されている請求項7に記載のスイッチング素子ユニット。
- 前記スイッチング素子直列回路を形成する2つの前記スイッチング素子の内、前記第一端部側に配置されるスイッチング素子が第一スイッチング素子であり、前記第二端部側に配置されるスイッチング素子が第二スイッチング素子であり、
前記第一コンデンサ接続電極と前記第一スイッチング素子とを電気的に接続する第一接続部材と、前記素子間接続電極と前記第二スイッチング素子とを電気的に接続する第二接続部材と、を更に備え、
前記第一接続部材は、前記第一コンデンサ接続電極に直接又は接合部材を介して当接する第一部分と、前記第一スイッチング素子に直接又は接合部材を介して当接する第二部分とを有し、
前記第二接続部材は、前記素子間接続電極に直接又は接合部材を介して当接する第一部分と、前記第二スイッチング素子に直接又は接合部材を介して当接する第二部分とを有する請求項7又は8に記載のスイッチング素子ユニット。 - 直流電圧を交流電圧に変換する直流交流変換回路を構成する6個の前記スイッチング素子が、前記素子配置面に配置されている請求項1から9のいずれか一項に記載のスイッチング素子ユニット。
- 前記誘電体部分がセラミック材料で形成されている請求項1から10のいずれか一項に記載のスイッチング素子ユニット。
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WO2013115395A1 (en) | 2013-08-08 |
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