JP2006073745A - 電子部品実装装置のコンタクト荷重制御方法 - Google Patents
電子部品実装装置のコンタクト荷重制御方法 Download PDFInfo
- Publication number
- JP2006073745A JP2006073745A JP2004254532A JP2004254532A JP2006073745A JP 2006073745 A JP2006073745 A JP 2006073745A JP 2004254532 A JP2004254532 A JP 2004254532A JP 2004254532 A JP2004254532 A JP 2004254532A JP 2006073745 A JP2006073745 A JP 2006073745A
- Authority
- JP
- Japan
- Prior art keywords
- load
- contact
- electronic component
- predetermined amount
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 65
- 230000008569 process Effects 0.000 claims abstract description 39
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 abstract description 22
- 239000000126 substance Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/755—Cooling means
- H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49137—Different components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】 電子部品と基板がコンタクトすることのない位置に設定された低速下降開始位置までヘッドを高速にて下降動作した後、所定のコンタクト設定荷重を検出するまで低速にて下降動作する低速下降動作工程において、所定量だけ下降動作する下降動作工程と、下降動作後に現在荷重を検出する荷重検出工程と、現在荷重がコンタクト設定荷重に達したか否かを判定する工程とを有し、現在荷重がコンタクト設定荷重に達するまで下降動作工程と荷重検出工程とを繰り返すようにした。
【選択図】 図3
Description
8 ロードセル
14 昇降駆動部
16 モータ
18 モータ制御部
Claims (6)
- 電子部品と基板がコンタクトすることのない位置に設定された低速下降開始位置までヘッドを高速にて下降動作した後、所定のコンタクト設定荷重を検出するまで低速にて下降動作する低速下降動作工程において、所定量だけ下降動作する下降動作工程と、下降動作後に現在荷重を検出する荷重検出工程と、現在荷重がコンタクト設定荷重に達したか否かを判定する工程とを有し、現在荷重がコンタクト設定荷重に達するまで下降動作工程と荷重検出工程とを繰り返すことを特徴とする電子部品実装装置のコンタクト荷重制御方法。
- 下降動作工程終了後、所定時間経過後に荷重検出工程に移行することを特徴とする請求項1記載の電子部品実装装置のコンタクト荷重制御方法。
- 下降動作工程における下降動作の所定量は、コンタクト設定荷重に応じて可変設定することを特徴とする請求項1又は2記載の電子部品実装装置のコンタクト荷重制御方法。
- 下降動作工程における下降動作の所定量を、現在荷重が0である間は第1の所定量に設定し、現在荷重が0を越えた後は第1の所定量より小さい第2の所定量に設定することを特徴とする請求項1〜3の何れかに記載の電子部品実装装置のコンタクト荷重制御方法。
- 第2の所定量を、検出した現在荷重とコンタクト設定荷重との差に応じて可変設定することを特徴とする請求項4記載の電子部品実装装置のコンタクト荷重制御方法。
- 現在荷重が0を越えた後、荷重検出工程で検出した現在荷重が前回検出した荷重と同じ場合は、異なるまで荷重検出工程を繰り返すことを特徴とする請求項1〜5の何れかに記載の電子部品実装装置のコンタクト荷重制御方法。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004254532A JP4359545B2 (ja) | 2004-09-01 | 2004-09-01 | 電子部品実装装置のコンタクト荷重制御方法 |
TW094129462A TW200624208A (en) | 2004-09-01 | 2005-08-29 | Method of controlling contact load in electronic component mounting apparatus |
DE602005014493T DE602005014493D1 (de) | 2004-09-01 | 2005-08-31 | Verfahren zur steuerung von kontaktlast in einer vorrichtung zum montieren elektronischer bauteile |
CNB2005800018911A CN100509236C (zh) | 2004-09-01 | 2005-08-31 | 控制电子组件装配装置中接触载荷的方法 |
PCT/JP2005/016376 WO2006025595A1 (en) | 2004-09-01 | 2005-08-31 | Method of controlling contact load in electronic component mounting apparatus |
US10/596,218 US7513036B2 (en) | 2004-09-01 | 2005-08-31 | Method of controlling contact load in electronic component mounting apparatus |
KR1020067011943A KR20080011358A (ko) | 2004-09-01 | 2005-08-31 | 전자부품 실장장치의 접촉하중 제어방법 |
EP05782142A EP1799388B1 (en) | 2004-09-01 | 2005-08-31 | Method of controlling contact load in electronic component mounting apparatus |
US12/389,542 US20090151149A1 (en) | 2004-09-01 | 2009-02-20 | Method of controlling contact load in electronic component mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004254532A JP4359545B2 (ja) | 2004-09-01 | 2004-09-01 | 電子部品実装装置のコンタクト荷重制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006073745A true JP2006073745A (ja) | 2006-03-16 |
JP4359545B2 JP4359545B2 (ja) | 2009-11-04 |
Family
ID=35501043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004254532A Expired - Fee Related JP4359545B2 (ja) | 2004-09-01 | 2004-09-01 | 電子部品実装装置のコンタクト荷重制御方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US7513036B2 (ja) |
EP (1) | EP1799388B1 (ja) |
JP (1) | JP4359545B2 (ja) |
KR (1) | KR20080011358A (ja) |
CN (1) | CN100509236C (ja) |
DE (1) | DE602005014493D1 (ja) |
TW (1) | TW200624208A (ja) |
WO (1) | WO2006025595A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006147702A (ja) * | 2004-11-17 | 2006-06-08 | Juki Corp | 電子部品圧着装置 |
JP2009231303A (ja) * | 2008-03-19 | 2009-10-08 | Yamaha Motor Co Ltd | ヘッド駆動制御方法および表面実装装置 |
JP2010027752A (ja) * | 2008-07-17 | 2010-02-04 | Panasonic Corp | 搭載ヘッド及び部品実装機 |
JP2010027751A (ja) * | 2008-07-17 | 2010-02-04 | Panasonic Corp | 搭載ヘッド及び部品実装機 |
KR101397506B1 (ko) | 2011-11-25 | 2014-05-20 | 야마하하쓰도키 가부시키가이샤 | 표면 실장 장치 및 헤드 구동 제어 방법 |
WO2014080472A1 (ja) * | 2012-11-21 | 2014-05-30 | 富士機械製造株式会社 | 電子回路部品装着ヘッド |
WO2018163394A1 (ja) * | 2017-03-10 | 2018-09-13 | 株式会社Fuji | 部品実装機 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4359545B2 (ja) * | 2004-09-01 | 2009-11-04 | パナソニック株式会社 | 電子部品実装装置のコンタクト荷重制御方法 |
US9645968B2 (en) * | 2006-09-14 | 2017-05-09 | Crown Equipment Corporation | Multiple zone sensing for materials handling vehicles |
US9122276B2 (en) | 2006-09-14 | 2015-09-01 | Crown Equipment Corporation | Wearable wireless remote control device for use with a materials handling vehicle |
US9207673B2 (en) * | 2008-12-04 | 2015-12-08 | Crown Equipment Corporation | Finger-mounted apparatus for remotely controlling a materials handling vehicle |
US8970363B2 (en) | 2006-09-14 | 2015-03-03 | Crown Equipment Corporation | Wrist/arm/hand mounted device for remotely controlling a materials handling vehicle |
US9522817B2 (en) | 2008-12-04 | 2016-12-20 | Crown Equipment Corporation | Sensor configuration for a materials handling vehicle |
DE102012213651B3 (de) * | 2012-08-02 | 2013-08-01 | Keiper Gmbh & Co. Kg | Haltevorrichtung und Verfahren zum Betrieb einer Haltevorrichtung |
CN105230138B (zh) * | 2014-03-28 | 2019-07-30 | 爱立发株式会社 | 电子部件接合装置和电子部件接合方法 |
US11134595B2 (en) | 2018-09-05 | 2021-09-28 | Assembleon B.V. | Compliant die attach systems having spring-driven bond tools |
EP4269157A3 (en) | 2019-02-01 | 2023-12-20 | Crown Equipment Corporation | On-board charging station for a remote control device |
US11641121B2 (en) | 2019-02-01 | 2023-05-02 | Crown Equipment Corporation | On-board charging station for a remote control device |
EP4196857A1 (en) | 2020-08-11 | 2023-06-21 | Crown Equipment Corporation | Remote control device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4927320A (en) * | 1988-02-09 | 1990-05-22 | Cascade Corporation | Automatic load push-pull slipsheet handler |
US6233497B1 (en) * | 1997-09-18 | 2001-05-15 | Mitsubishi Denki Kabushiki Kaisha | Contact detecting method and an apparatus for the same |
JP2001051018A (ja) * | 1999-08-17 | 2001-02-23 | Nec Machinery Corp | Ic試験装置 |
JP2003008196A (ja) | 2001-06-27 | 2003-01-10 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法及び実装装置 |
US7153186B2 (en) * | 2002-09-13 | 2006-12-26 | Towa Intercon Technology, Inc. | Jet singulation |
JP4359545B2 (ja) * | 2004-09-01 | 2009-11-04 | パナソニック株式会社 | 電子部品実装装置のコンタクト荷重制御方法 |
-
2004
- 2004-09-01 JP JP2004254532A patent/JP4359545B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-29 TW TW094129462A patent/TW200624208A/zh unknown
- 2005-08-31 EP EP05782142A patent/EP1799388B1/en not_active Expired - Fee Related
- 2005-08-31 DE DE602005014493T patent/DE602005014493D1/de active Active
- 2005-08-31 US US10/596,218 patent/US7513036B2/en not_active Expired - Fee Related
- 2005-08-31 KR KR1020067011943A patent/KR20080011358A/ko not_active Application Discontinuation
- 2005-08-31 WO PCT/JP2005/016376 patent/WO2006025595A1/en active Application Filing
- 2005-08-31 CN CNB2005800018911A patent/CN100509236C/zh active Active
-
2009
- 2009-02-20 US US12/389,542 patent/US20090151149A1/en not_active Abandoned
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006147702A (ja) * | 2004-11-17 | 2006-06-08 | Juki Corp | 電子部品圧着装置 |
JP4522826B2 (ja) * | 2004-11-17 | 2010-08-11 | Juki株式会社 | 電子部品圧着装置 |
JP2009231303A (ja) * | 2008-03-19 | 2009-10-08 | Yamaha Motor Co Ltd | ヘッド駆動制御方法および表面実装装置 |
JP4708449B2 (ja) * | 2008-03-19 | 2011-06-22 | ヤマハ発動機株式会社 | ヘッド駆動制御方法および表面実装装置 |
JP2010027752A (ja) * | 2008-07-17 | 2010-02-04 | Panasonic Corp | 搭載ヘッド及び部品実装機 |
JP2010027751A (ja) * | 2008-07-17 | 2010-02-04 | Panasonic Corp | 搭載ヘッド及び部品実装機 |
KR101397506B1 (ko) | 2011-11-25 | 2014-05-20 | 야마하하쓰도키 가부시키가이샤 | 표면 실장 장치 및 헤드 구동 제어 방법 |
WO2014080472A1 (ja) * | 2012-11-21 | 2014-05-30 | 富士機械製造株式会社 | 電子回路部品装着ヘッド |
JPWO2014080472A1 (ja) * | 2012-11-21 | 2017-01-05 | 富士機械製造株式会社 | 電子回路部品装着ヘッド |
WO2018163394A1 (ja) * | 2017-03-10 | 2018-09-13 | 株式会社Fuji | 部品実装機 |
JPWO2018163394A1 (ja) * | 2017-03-10 | 2019-11-21 | 株式会社Fuji | 部品実装機 |
Also Published As
Publication number | Publication date |
---|---|
WO2006025595A1 (en) | 2006-03-09 |
KR20080011358A (ko) | 2008-02-04 |
JP4359545B2 (ja) | 2009-11-04 |
US20090151149A1 (en) | 2009-06-18 |
US20070056157A1 (en) | 2007-03-15 |
DE602005014493D1 (de) | 2009-06-25 |
TW200624208A (en) | 2006-07-16 |
EP1799388B1 (en) | 2009-05-13 |
CN100509236C (zh) | 2009-07-08 |
CN1905981A (zh) | 2007-01-31 |
EP1799388A1 (en) | 2007-06-27 |
US7513036B2 (en) | 2009-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4359545B2 (ja) | 電子部品実装装置のコンタクト荷重制御方法 | |
JP2014123731A (ja) | 基板上に半導体チップを実装するための熱圧着ボンディング方法および装置 | |
JP2003059973A (ja) | 電子部品圧着装置および電子部品圧着方法 | |
JPH09153525A (ja) | ボンディング装置およびボンディング方法 | |
JPH11297749A (ja) | フリップチップボンディング装置及びフリップチップボンディング方法 | |
JP2011151179A (ja) | ボンディング装置 | |
JP5797368B2 (ja) | 半導体チップのボンディング装置及びボンディング方法 | |
KR101591125B1 (ko) | 칩 실장 장치 | |
JP2008251727A (ja) | 電子部品の実装装置 | |
JP3449139B2 (ja) | チップの圧着装置 | |
JPH05109840A (ja) | インナリ−ドボンデイング装置 | |
JP2011124411A (ja) | 電子部品実装方法および電子部品実装装置 | |
JP7108489B2 (ja) | はんだ付け装置 | |
JP3449140B2 (ja) | チップの圧着方法 | |
JP6636567B2 (ja) | チップ実装装置 | |
JP2014143442A (ja) | チップ実装装置 | |
JP2002164646A (ja) | 半田付け、取り外し装置 | |
JP3567898B2 (ja) | チップの圧着装置 | |
JP3606214B2 (ja) | チップの圧着方法 | |
JP3567897B2 (ja) | チップの圧着装置 | |
JP6345819B2 (ja) | チップ実装装置 | |
WO2022030006A1 (ja) | 半導体装置の製造装置および製造方法 | |
JP3567896B2 (ja) | チップの圧着装置 | |
JPH10163272A (ja) | フリップチップのボンディング装置 | |
JP3060852B2 (ja) | ワイヤボンディング方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061030 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20090526 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090714 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090810 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120814 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4359545 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130814 Year of fee payment: 4 |
|
LAPS | Cancellation because of no payment of annual fees |