TW200624208A - Method of controlling contact load in electronic component mounting apparatus - Google Patents

Method of controlling contact load in electronic component mounting apparatus

Info

Publication number
TW200624208A
TW200624208A TW094129462A TW94129462A TW200624208A TW 200624208 A TW200624208 A TW 200624208A TW 094129462 A TW094129462 A TW 094129462A TW 94129462 A TW94129462 A TW 94129462A TW 200624208 A TW200624208 A TW 200624208A
Authority
TW
Taiwan
Prior art keywords
contact load
head
load
electronic component
moving down
Prior art date
Application number
TW094129462A
Other languages
English (en)
Inventor
Shuichi Hirata
Yasuharu Ueno
Makoto Morikawa
Hiroyuki Yoshida
Noriaki Yoshida
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200624208A publication Critical patent/TW200624208A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
TW094129462A 2004-09-01 2005-08-29 Method of controlling contact load in electronic component mounting apparatus TW200624208A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004254532A JP4359545B2 (ja) 2004-09-01 2004-09-01 電子部品実装装置のコンタクト荷重制御方法

Publications (1)

Publication Number Publication Date
TW200624208A true TW200624208A (en) 2006-07-16

Family

ID=35501043

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129462A TW200624208A (en) 2004-09-01 2005-08-29 Method of controlling contact load in electronic component mounting apparatus

Country Status (8)

Country Link
US (2) US7513036B2 (zh)
EP (1) EP1799388B1 (zh)
JP (1) JP4359545B2 (zh)
KR (1) KR20080011358A (zh)
CN (1) CN100509236C (zh)
DE (1) DE602005014493D1 (zh)
TW (1) TW200624208A (zh)
WO (1) WO2006025595A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4359545B2 (ja) * 2004-09-01 2009-11-04 パナソニック株式会社 電子部品実装装置のコンタクト荷重制御方法
JP4522826B2 (ja) * 2004-11-17 2010-08-11 Ｊｕｋｉ株式会社 電子部品圧着装置
US9207673B2 (en) * 2008-12-04 2015-12-08 Crown Equipment Corporation Finger-mounted apparatus for remotely controlling a materials handling vehicle
US9122276B2 (en) 2006-09-14 2015-09-01 Crown Equipment Corporation Wearable wireless remote control device for use with a materials handling vehicle
US8970363B2 (en) * 2006-09-14 2015-03-03 Crown Equipment Corporation Wrist/arm/hand mounted device for remotely controlling a materials handling vehicle
US9645968B2 (en) * 2006-09-14 2017-05-09 Crown Equipment Corporation Multiple zone sensing for materials handling vehicles
JP4708449B2 (ja) * 2008-03-19 2011-06-22 ヤマハ発動機株式会社 ヘッド駆動制御方法および表面実装装置
JP5024209B2 (ja) * 2008-07-17 2012-09-12 パナソニック株式会社 搭載ヘッド及び部品実装機
JP4973614B2 (ja) * 2008-07-17 2012-07-11 パナソニック株式会社 搭載ヘッド及び部品実装機
US9522817B2 (en) 2008-12-04 2016-12-20 Crown Equipment Corporation Sensor configuration for a materials handling vehicle
JP5774971B2 (ja) 2011-11-25 2015-09-09 ヤマハ発動機株式会社 表面実装装置およびヘッド駆動制御方法
DE102012213651B3 (de) * 2012-08-02 2013-08-01 Keiper Gmbh & Co. Kg Haltevorrichtung und Verfahren zum Betrieb einer Haltevorrichtung
WO2014080472A1 (ja) * 2012-11-21 2014-05-30 富士機械製造株式会社 電子回路部品装着ヘッド
WO2015146442A1 (ja) * 2014-03-28 2015-10-01 アスリートＦａ株式会社 電子部品接合装置および電子部品接合方法
CN110383969B (zh) * 2017-03-10 2021-03-12 株式会社富士 元件安装机
US11134595B2 (en) 2018-09-05 2021-09-28 Assembleon B.V. Compliant die attach systems having spring-driven bond tools
US11641121B2 (en) 2019-02-01 2023-05-02 Crown Equipment Corporation On-board charging station for a remote control device
EP3918588A1 (en) 2019-02-01 2021-12-08 Crown Equipment Corporation On-board charging station for a remote control device
CN116057491A (zh) 2020-08-11 2023-05-02 克朗设备公司 远程控制设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927320A (en) * 1988-02-09 1990-05-22 Cascade Corporation Automatic load push-pull slipsheet handler
US6233497B1 (en) * 1997-09-18 2001-05-15 Mitsubishi Denki Kabushiki Kaisha Contact detecting method and an apparatus for the same
JP2001051018A (ja) * 1999-08-17 2001-02-23 Nec Machinery Corp Ｉｃ試験装置
JP2003008196A (ja) * 2001-06-27 2003-01-10 Matsushita Electric Ind Co Ltd 電子部品の実装方法及び実装装置
US7153186B2 (en) * 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
JP4359545B2 (ja) * 2004-09-01 2009-11-04 パナソニック株式会社 電子部品実装装置のコンタクト荷重制御方法

Also Published As

Publication number Publication date
CN1905981A (zh) 2007-01-31
EP1799388A1 (en) 2007-06-27
EP1799388B1 (en) 2009-05-13
US20070056157A1 (en) 2007-03-15
US20090151149A1 (en) 2009-06-18
JP4359545B2 (ja) 2009-11-04
CN100509236C (zh) 2009-07-08
KR20080011358A (ko) 2008-02-04
DE602005014493D1 (de) 2009-06-25
US7513036B2 (en) 2009-04-07
JP2006073745A (ja) 2006-03-16
WO2006025595A1 (en) 2006-03-09

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