AU2003256510A1 - Temperature controlling apparatus and method for an electronic device under test - Google Patents

Temperature controlling apparatus and method for an electronic device under test

Info

Publication number
AU2003256510A1
AU2003256510A1 AU2003256510A AU2003256510A AU2003256510A1 AU 2003256510 A1 AU2003256510 A1 AU 2003256510A1 AU 2003256510 A AU2003256510 A AU 2003256510A AU 2003256510 A AU2003256510 A AU 2003256510A AU 2003256510 A1 AU2003256510 A1 AU 2003256510A1
Authority
AU
Australia
Prior art keywords
electronic device
under test
device under
controlling apparatus
temperature controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003256510A
Inventor
Charles R. Schmidt
Ian G. Spearing
Lewis S. Wayburn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kryotech Inc
Original Assignee
Kryotech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kryotech Inc filed Critical Kryotech Inc
Publication of AU2003256510A1 publication Critical patent/AU2003256510A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/37—Capillary tubes

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2003256510A 2002-07-16 2003-07-11 Temperature controlling apparatus and method for an electronic device under test Abandoned AU2003256510A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/196,354 2002-07-16
US10/196,354 US7100389B1 (en) 2002-07-16 2002-07-16 Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
PCT/US2003/021802 WO2004008053A1 (en) 2002-07-16 2003-07-11 Temperature controlling apparatus and method for an electronic device under test

Publications (1)

Publication Number Publication Date
AU2003256510A1 true AU2003256510A1 (en) 2004-02-02

Family

ID=30115057

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003256510A Abandoned AU2003256510A1 (en) 2002-07-16 2003-07-11 Temperature controlling apparatus and method for an electronic device under test

Country Status (3)

Country Link
US (1) US7100389B1 (en)
AU (1) AU2003256510A1 (en)
WO (1) WO2004008053A1 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1923771B1 (en) 2003-11-07 2015-05-20 Asetek A/S Cooling system for a computer system
US20060290370A1 (en) * 2004-02-27 2006-12-28 Wells-Cti, Llc, An Oregon Limited Liability Company Temperature control in ic sockets
US7352200B2 (en) * 2005-01-12 2008-04-01 International Business Machines Corporation Functional and stress testing of LGA devices
CN101228495B (en) 2005-05-06 2013-03-13 阿塞泰克公司 Cooling system for computer system
US7605581B2 (en) * 2005-06-16 2009-10-20 Delta Design, Inc. Apparatus and method for controlling die force in a semiconductor device testing assembly
US20070240870A1 (en) * 2006-04-18 2007-10-18 Daytona Control Co., Ltd. Temperature control apparatus
US7870800B2 (en) * 2006-05-15 2011-01-18 Centipede Systems, Inc. Apparatus including a fluid coupler interfaced to a test head
US7562617B2 (en) 2006-05-15 2009-07-21 Centipede Systems, Inc. Mounting apparatus
JP2008159762A (en) * 2006-12-22 2008-07-10 Espec Corp Heating medium supply device and temperature control apparatus
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
KR101047832B1 (en) * 2007-07-30 2011-07-08 가부시키가이샤 아드반테스트 Temperature control device and temperature control method for electronic devices
US9322578B2 (en) * 2007-09-10 2016-04-26 Whirlpool Corporation Quick thaw/quick chill refrigerated compartment
KR100996197B1 (en) * 2007-09-14 2010-11-24 가부시키가이샤 아드반테스트 Advanced thermal control interface
US8274300B2 (en) * 2008-01-18 2012-09-25 Kes Systems & Service (1993) Pte Ltd. Thermal control unit for semiconductor testing
US8844612B2 (en) * 2008-10-29 2014-09-30 Advantest Corporation Thermal controller for electronic devices
US9500701B2 (en) * 2010-03-17 2016-11-22 Delta Design, Inc. Alignment mechanism
US8899389B2 (en) 2011-05-19 2014-12-02 Honeywell International Inc. Thermally-conductive vibration isolators and spacecraft isolation systems employing the same
GB201118339D0 (en) * 2011-10-24 2011-12-07 Cambridge Reactor Design Ltd Heating and cooling apparatus
US9709622B2 (en) * 2013-03-15 2017-07-18 Sensata Technologies, Inc. Direct injection phase change temperature control system
JP2014215062A (en) * 2013-04-23 2014-11-17 セイコーエプソン株式会社 Handler and inspection device
US10481555B2 (en) * 2015-01-07 2019-11-19 Preciflex Sa System and method of force displacement insensitive to temperature changes
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
US9921265B2 (en) * 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
CN108731814B (en) * 2017-04-21 2021-06-18 富泰华工业（深圳）有限公司 Mainboard analysis device and method
US10731903B2 (en) * 2017-05-01 2020-08-04 Temptronic Corporation System and method for device under test cooling using digital scroll compressor
JP7244747B2 (en) * 2019-02-28 2023-03-23 富士通株式会社 Liquid immersion tank and liquid immersion cooling device
US11454666B2 (en) 2020-04-20 2022-09-27 Aem Singapore Pte Ltd Thermal test head for an integrated circuit device
JP7143491B1 (en) * 2021-07-21 2022-09-28 株式会社アドバンテスト Test carrier and electronic component test equipment

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138692A (en) 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4246959A (en) * 1978-10-26 1981-01-27 The Garrett Corporation Method and apparatus for isolation of external loads in a heat exchanger manifold system
US4561040A (en) 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
JPS61220359A (en) 1985-03-26 1986-09-30 Hitachi Ltd Cooling structure of semiconductor module
US4777561A (en) * 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
US4920574A (en) 1985-10-04 1990-04-24 Fujitsu Limited Cooling system for an electronic circuit device
US4759403A (en) * 1986-04-30 1988-07-26 International Business Machines Corp. Hydraulic manifold for water cooling of multi-chip electric modules
US4789023A (en) * 1987-07-28 1988-12-06 Grant Frederic F Vibration isolating heat sink
US4951740A (en) 1988-06-27 1990-08-28 Texas A & M University System Bellows heat pipe for thermal control of electronic components
US4909313A (en) * 1988-09-30 1990-03-20 The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration Pressurized bellows flat contact heat exchanger interface
US5198753A (en) 1990-06-29 1993-03-30 Digital Equipment Corporation Integrated circuit test fixture and method
US5325052A (en) 1990-11-30 1994-06-28 Tokyo Electron Yamanashi Limited Probe apparatus
US5196785A (en) 1990-12-12 1993-03-23 Hewlett-Packard Company Tape automated bonding test apparatus for thermal, mechanical and electrical coupling
US5164661A (en) 1991-05-31 1992-11-17 Ej Systems, Inc. Thermal control system for a semi-conductor burn-in
US5206791A (en) * 1992-02-07 1993-04-27 Digital Equipment Corporation Bellows heat pipe apparatus for cooling systems
US5511799A (en) * 1993-06-07 1996-04-30 Applied Materials, Inc. Sealing device useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential
KR970005686B1 (en) * 1994-04-28 1997-04-18 한국베리안 주식회사 Thermal treatment process of thin layer in semiconductor device
US5463872A (en) * 1994-09-08 1995-11-07 International Business Machines Corporation High performance thermal interface for low temperature electronic modules
US5847293A (en) 1995-12-04 1998-12-08 Aetrium Incorporated Test handler for DUT's
US5977785A (en) 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
US5847366A (en) 1996-06-18 1998-12-08 Intel Corporation Apparatus and method for controlling the temperature of an integrated circuit under test
US6392431B1 (en) * 1996-10-23 2002-05-21 Aetrium, Inc. Flexibly suspended heat exchange head for a DUT
US6147506A (en) 1997-04-29 2000-11-14 International Business Machines Corporation Wafer test fixture using a biasing bladder and methodology
SG67501A1 (en) 1997-05-12 1999-09-21 Advantest Corp Semiconductor device testing apparatus
DE69842191D1 (en) 1997-11-05 2011-05-05 Tokyo Electron Ltd Wafer holder
US5944093A (en) 1997-12-30 1999-08-31 Intel Corporation Pickup chuck with an integral heat pipe
US6049217A (en) 1997-12-30 2000-04-11 Intel Corporation Thermally enhanced test contactor
US6173760B1 (en) 1998-08-04 2001-01-16 International Business Machines Corporation Co-axial bellows liquid heatsink for high power module test
US6163163A (en) 1998-09-14 2000-12-19 Semitest, Inc. Semiconductor material characterizing method and apparatus
US6058010A (en) * 1998-11-06 2000-05-02 International Business Machines Corporation Enhanced test head liquid cooled cold plate
US6552901B2 (en) * 1998-12-22 2003-04-22 James Hildebrandt Apparatus and system for cooling electronic circuitry, heat sinks, and related components
US6307394B1 (en) 1999-01-13 2001-10-23 Micron Technology, Inc. Test carrier with variable force applying mechanism for testing semiconductor components
JP3054141B1 (en) 1999-03-31 2000-06-19 エム・シー・エレクトロニクス株式会社 IC device temperature control device and inspection device
US6184504B1 (en) 1999-04-13 2001-02-06 Silicon Thermal, Inc. Temperature control system for electronic devices
JP2001284416A (en) * 2000-03-30 2001-10-12 Nagase & Co Ltd Low temperature test device
US6424141B1 (en) * 2000-07-13 2002-07-23 The Micromanipulator Company, Inc. Wafer probe station
US6543246B2 (en) * 2001-07-24 2003-04-08 Kryotech, Inc. Integrated circuit cooling apparatus

Also Published As

Publication number Publication date
US7100389B1 (en) 2006-09-05
WO2004008053A1 (en) 2004-01-22

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase