AU2003271966A1 - Method and apparatus for depositing material for an electronic device - Google Patents
Method and apparatus for depositing material for an electronic deviceInfo
- Publication number
- AU2003271966A1 AU2003271966A1 AU2003271966A AU2003271966A AU2003271966A1 AU 2003271966 A1 AU2003271966 A1 AU 2003271966A1 AU 2003271966 A AU2003271966 A AU 2003271966A AU 2003271966 A AU2003271966 A AU 2003271966A AU 2003271966 A1 AU2003271966 A1 AU 2003271966A1
- Authority
- AU
- Australia
- Prior art keywords
- electronic device
- depositing material
- depositing
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000151 deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0224109.9A GB0224109D0 (en) | 2002-10-16 | 2002-10-16 | Deposition apparatus and methods |
GB0224109.9 | 2002-10-16 | ||
PCT/GB2003/004482 WO2004036701A2 (en) | 2002-10-16 | 2003-10-14 | Method and apparatus for depositing material for an electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003271966A1 true AU2003271966A1 (en) | 2004-05-04 |
AU2003271966A8 AU2003271966A8 (en) | 2004-05-04 |
Family
ID=9946046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003271966A Abandoned AU2003271966A1 (en) | 2002-10-16 | 2003-10-14 | Method and apparatus for depositing material for an electronic device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006504233A (en) |
AU (1) | AU2003271966A1 (en) |
GB (1) | GB0224109D0 (en) |
WO (1) | WO2004036701A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0622784D0 (en) * | 2006-11-15 | 2006-12-27 | Cambridge Display Technology O | Droplet volume control |
DE102008030712A1 (en) | 2008-06-27 | 2009-12-31 | Construction Research & Technology Gmbh | Time-delayed superabsorbent polymers |
JP2013214500A (en) * | 2012-03-09 | 2013-10-17 | Nitto Denko Corp | Vapor deposition data processing device, and apparatus and method for manufacturing organic el device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3115549B2 (en) * | 1996-09-30 | 2000-12-11 | キヤノン株式会社 | INK JET RECORDING APPARATUS, RECORDING METHOD, ASSISTANT MEMBER, INK JET HEAD, AND WARP CONTROL METHOD |
DE19842379A1 (en) * | 1998-09-16 | 2000-05-11 | Tron Elektronik Gmbh F | Circuit board layers, especially solder-stop lacquer, solder paste, etch-resist lacquer or printed layers, are produced by line printing a two-dimensional pixel structure derived from layer structure-defining data |
JP3876684B2 (en) * | 2000-12-21 | 2007-02-07 | セイコーエプソン株式会社 | Color filter manufacturing method, color filter manufacturing device, liquid crystal device manufacturing method, liquid crystal device manufacturing device, EL device manufacturing method, EL device manufacturing device, material ejection method, head control device, electronic apparatus |
JP2002273869A (en) * | 2001-01-15 | 2002-09-25 | Seiko Epson Corp | Discharge method and its apparatus, electro-optic device, method and apparatus for manufacturing the device, color filter, method and apparatus for manufacturing the filter, device with substrate, and method and apparatus for manufacturing the device |
-
2002
- 2002-10-16 GB GBGB0224109.9A patent/GB0224109D0/en not_active Ceased
-
2003
- 2003-10-14 AU AU2003271966A patent/AU2003271966A1/en not_active Abandoned
- 2003-10-14 JP JP2004544477A patent/JP2006504233A/en active Pending
- 2003-10-14 WO PCT/GB2003/004482 patent/WO2004036701A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
GB0224109D0 (en) | 2002-11-27 |
JP2006504233A (en) | 2006-02-02 |
WO2004036701A3 (en) | 2004-06-24 |
AU2003271966A8 (en) | 2004-05-04 |
WO2004036701A2 (en) | 2004-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |