WO2018163394A1 - 部品実装機 - Google Patents
部品実装機 Download PDFInfo
- Publication number
- WO2018163394A1 WO2018163394A1 PCT/JP2017/009653 JP2017009653W WO2018163394A1 WO 2018163394 A1 WO2018163394 A1 WO 2018163394A1 JP 2017009653 W JP2017009653 W JP 2017009653W WO 2018163394 A1 WO2018163394 A1 WO 2018163394A1
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- WIPO (PCT)
- Prior art keywords
- component
- load
- substrate
- nozzle
- speed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Definitions
- This specification discloses a component mounting machine.
- Patent Document 1 proposes such a component mounting machine that controls the speed at which a component collides with the surface of a substrate to suppress the impact force to a specified value or less.
- the component mounting machine disclosed in Patent Document 1 measures the actually generated impact force with a pressure sensor, analyzes the correlation between the collision speed and the collision force from the measured data, and determines the subsequent collision speed based on the relationship. is doing.
- the hardness characteristic when the nozzle contacts the substrate is not taken into consideration. Even at the same collision speed, the peak load increases if the substrate, components, and nozzles are hard, and the peak load decreases if they are soft. In the above-described component mounter, since such hardness characteristics are not taken into consideration, the determined collision speed may not always be an appropriate speed.
- This disclosure has been made in order to solve the above-described problem, and its main purpose is to easily obtain hardness characteristics when the component holder comes into contact with the substrate.
- the component mounter of the present disclosure is A component supply device for supplying components; A substrate holding device for holding the substrate; A head for holding the component holder in a vertically movable manner; A load detector for detecting a load applied to the component holder; A head moving device for moving the head between the component supply device and the substrate holding device; Based on the load information detected by the load detector when the head is controlled so that the component holder contacts the substrate, a hardness characteristic when the component holder contacts the substrate is obtained.
- a control device It is equipped with.
- the hardness characteristic when the component holder contacts the substrate is obtained based on the load information detected by the load detector when the head is controlled so that the component holder contacts the substrate. .
- substrate can be calculated
- the component holder is in contact with the board means that the component holder that is not holding the component is in direct contact with the board, and that the component holder that holds the component is indirectly connected to the board via the component. Including contact with
- FIG. The perspective view of the component mounting machine 10.
- FIG. Explanatory drawing of the mounting head 18.
- FIG. FIG. Explanatory drawing which shows the electrical connection of the controller 78.
- FIG. The flowchart of a component mounting process routine.
- FIG. The graph which shows an example of reaction force aging data.
- the graph which shows the correspondence of reaction force aging data at the time of low speed VL, and a hardness characteristic.
- the graph which shows the correspondence of reaction force aging data at the time of medium speed VM, and a hardness characteristic.
- the table which shows the correspondence of the hardness characteristic, reaction force increase rate, and peak reaction force of low speed VL, medium speed VM, and high speed VH.
- FIG. 1 is a perspective view of the component mounting machine 10
- FIG. 2 is an explanatory diagram of the mounting head 18
- FIG. 3 is a sectional view of the nozzle 42
- FIG. 4 is an external explanatory diagram of the nozzle 42
- FIG. It is explanatory drawing shown.
- the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.
- the component mounter 10 includes a board transfer unit 12, a mounting head 18, a nozzle 42, a mark camera 64, a parts camera 66, a component supply unit 70, and a controller that executes various controls. 78 (see FIG. 5).
- the substrate transport unit 12 transports the substrate S from the left to the right by conveyor belts 16 and 16 (only one is shown in FIG. 1) attached to the pair of front and rear support plates 14 and 14, respectively.
- the substrate transport unit 12 fixes the substrate S by lifting the substrate S from below with the support pins 17 disposed below the substrate S, and releases the support of the substrate S by lowering the support pins 17.
- the mounting head 18 is movable on the XY plane. Specifically, the mounting head 18 moves in the left-right direction as the X-axis slider 20 moves in the left-right direction along the guide rails 22, 22, and the Y-axis slider 24 moves along the guide rails 26, 26. Move in the front-rear direction as it moves in the front-rear direction. As shown in FIG. 2, the mounting head 18 includes a support cylinder 19 that supports the nozzle holder 30 so that the nozzle holder 30 can be rotated and moved up and down.
- the nozzle holder 30 is a member extending in the vertical direction, has a rotation transmission gear 30a and a flange 30b in the upper part, and holds the nozzle 42 in the lower part.
- the rotation transmission gear 30 a meshes with the drive gear 32 of the nozzle rotation motor 31. Therefore, when the nozzle rotation motor 31 rotates, the nozzle holder 30 rotates along with the rotation.
- the flange 30b is sandwiched between an upper piece and a lower piece of the first engagement portion 33a provided on the first arm 33 extending in the vertical direction.
- the first arm 33 is connected to the mover of the first linear motor 34.
- the stator of the first linear motor 34 is fixed to the mounting head 18. Therefore, when the mover of the first linear motor 34 moves up and down, the first arm 33 moves up and down along the guide member 35 that guides the movement in the up and down direction.
- the sandwiched flange 30b and by extension the nozzle holder 30 moves up and down.
- a pair of inverted J-shaped guide grooves 30c are provided on the lower end side surface of the nozzle holder 30 at positions facing each other.
- an upper annular protrusion 30 d and a lower annular protrusion 30 e are provided on the side surface of the nozzle holder 30 with a gap therebetween.
- the nozzle holder 30 is covered with a lock sleeve 36. Since the diameter of the upper opening of the lock sleeve 36 is smaller than the diameter of the upper annular protrusion 30 d and the lower annular protrusion 30 e of the nozzle holder 30, the lock sleeve 36 can move up and down without falling off the nozzle holder 30. Yes.
- a lock spring 37 is disposed between the upper end surface of the lock sleeve 36 and the upper annular protrusion 30 d of the nozzle holder 30.
- the nozzle 42 uses pressure to adsorb the component P at the nozzle tip or release the component P adsorbed at the nozzle tip.
- the nozzle 42 is elastically supported via a nozzle spring 46 on the upper end surface of a nozzle sleeve 44 that is a nozzle fixture.
- the nozzle 42 has an air passage 42a extending in the vertical direction inside. A negative pressure or a positive pressure can be supplied to the air passage 42a.
- the nozzle 42 includes a flange 42c that projects horizontally from a position slightly above the suction port 42b that attracts the component P, a spring receiving portion 42d that projects horizontally from the upper end, and a step provided in the middle from the upper end to the flange 42c. Surface 42e.
- a portion of the nozzle 42 from the step surface 42e to the spring receiving portion 42d is a small-diameter shaft portion 42f.
- a pair of elongated holes 42g extending in the vertical direction are provided on the side surface of the shaft portion 42f so as to face each other.
- the nozzle sleeve 44 is attached to the nozzle 42 so as to be able to move up and down relatively with respect to the shaft portion 42 f of the nozzle 42.
- the nozzle sleeve 44 is integrated with a pin 44a penetrating in the diameter direction. The pin 44a is inserted into a pair of long holes 42g of the nozzle 42.
- the nozzle 42 is slidable with respect to the pin 44a in the direction in which the elongated hole 42g extends, that is, in the vertical direction.
- the nozzle spring 46 is disposed between the upper end surface of the nozzle sleeve 44 and the spring receiving portion 42 d of the nozzle 42.
- the nozzle sleeve 44 is detachably fixed to the guide groove 30c of the nozzle holder 30 with the nozzle 42 elastically supported.
- the pin 44 a provided on the nozzle sleeve 44 is fixed in a state of being sandwiched between the terminal end of the guide groove 30 c and the lower end of the lock sleeve 36 urged downward by the lock spring 37.
- the pin 44a of the nozzle sleeve 44 is moved upward along the guide groove 30c (see FIG. 4) of the nozzle holder 30. . Then, the pin 44 a hits the lower end of the lock sleeve 36.
- the stator of the second linear motor 50 is fixed to the lower end of the first arm 33.
- a second arm 51 is connected to the mover of the second linear motor 50.
- the second arm 51 includes a second engagement portion 52 formed of a cam follower at the tip of the arm and a load cell 53 that detects a load in the middle of the arm.
- the second engaging portion 52 is disposed at a position facing the upper surface of the flange 42 c of the nozzle 42.
- the mark camera 64 is installed at the lower end of the X-axis slider 20 so that the imaging direction faces the substrate S, and can move as the mounting head 18 moves.
- the mark camera 64 captures a substrate positioning reference mark (not shown) provided on the substrate S and outputs the obtained image to the controller 78.
- the parts camera 66 is installed between the component supply unit 70 and the substrate transport unit 12 so that the imaging direction is upward at the approximate center of the length in the left-right direction.
- the parts camera 66 images the parts adsorbed by the nozzles 42 that pass above, and outputs an image obtained by the imaging to the controller 78.
- the component supply unit 70 includes a reel 72 and a feeder 74.
- the reel 72 is wound with a tape formed so that the concave portions containing the components are arranged along the longitudinal direction.
- the feeder 74 sends out the tape component wound around the reel 72 to a predetermined component supply position.
- the tape wound around the reel 72 has a film covering the component, but the film is peeled off when reaching the component supply position. Therefore, the components arranged at the component supply position are in a state where they can be adsorbed by the nozzle 42.
- the controller 78 is configured as a microprocessor centered on a CPU 78a, and includes a ROM 78b that stores processing programs, an HDD 78c that stores various data, a RAM 78d that is used as a work area, and the like.
- the controller 78 is connected to an input device 78e such as a mouse and a keyboard and a display device 78f such as a liquid crystal display.
- the controller 78 is connected so as to be capable of bidirectional communication with a feeder controller 77 and a management computer 80 built in the feeder 74.
- the controller 78 includes a substrate transport unit 12, an X-axis slider 20, a Y-axis slider 24, a nozzle rotation motor 31, first and second linear motors 34 and 50, a pressure adjustment device 43 for the nozzle 42, a mark camera 64, It is connected so that a control signal can be output to the parts camera 66.
- the controller 78 is connected to be able to receive a detection signal from the load cell 53 and an image signal from the mark camera 64 or the parts camera 66. For example, the controller 78 recognizes the position (coordinates) of the substrate S by processing the image of the substrate S imaged by the mark camera 64 and recognizing the position of the reference mark. Further, the controller 78 determines whether or not a component is attracted to the nozzle 42 based on an image captured by the parts camera 66 and determines the shape, size, suction position, and the like of the component.
- the management computer 80 includes a personal computer main body 82, an input device 84, and a display 86, and can input signals from the input device 84 operated by an operator. An image can be output.
- Production job data is stored in the memory of the PC main body 82. In the production job data, it is determined which component P is mounted on the substrate S in each component mounting machine 10 in what order, and how many substrates S are mounted.
- FIG. 6 is a flowchart of a component mounting process routine.
- the component mounting processing routine program is stored in the HDD 78 c of the controller 78.
- the CPU 78a of the controller 78 first moves the nozzle 42 to the feeder 74 (step S110). Specifically, the CPU 78 a controls the X-axis and Y-axis sliders 20 and 24 to move the nozzle 42 to the component supply position of the feeder 74 that supplies a predetermined component P in the component supply unit 70.
- the CPU 78a attracts the component P to the tip of the nozzle 42 (step S120). Specifically, the CPU 78a moves the nozzle holder 30 downward by lowering the mover of the first linear motor 34. Concurrently, the CPU 78a moves the nozzle 42 to the lowermost end with respect to the nozzle holder 30 by lowering the mover of the second linear motor 50 before the tip of the nozzle 42 contacts the component P. Thereafter, when the CPU 78a determines that the tip of the nozzle 42 has contacted the component P based on the detection signal from the load cell 53, the CPU 78a controls the movable element of the second linear motor 50 so that the reaction force becomes equal to the set pressing force. To do.
- the CPU 78a controls the pressure adjusting device 43 so that a negative pressure is supplied to the suction port 42b when the tip of the nozzle 42 contacts the component P. As a result, the component P is attracted to the tip of the nozzle 42.
- the CPU 78a images the part P by the parts camera 66 (step S130). Specifically, the CPU 78a controls the second linear motor 50 so that the second engaging portion 52 of the second arm 51 is separated above the flange 42c, and the component P is at a predetermined height. The first linear motor 34 is controlled. In parallel with this, the CPU 78a controls the X-axis and Y-axis sliders 20 and 24 so that the center position of the nozzle 42 coincides with a predetermined reference point of the imaging region of the parts camera 66, and the center of the nozzle 42 is controlled. The part P is imaged by the parts camera 66 when the position coincides with the reference point. The CPU 78a analyzes the captured image to grasp the position of the component P with respect to the reference point.
- the CPU 78a moves the nozzle 42 onto the substrate S (step S140). Specifically, the CPU 78a controls the X-axis and Y-axis sliders 20 and 24 to move the nozzle 42 above a predetermined component mounting position on the substrate S where the component P is mounted.
- the CPU 78a mounts the component P at a predetermined component mounting position on the substrate S (step S150). Specifically, the CPU 78a controls the nozzle rotation motor 31 so that the posture of the component P becomes a predetermined posture based on the captured image. The CPU 78a moves the nozzle holder 30 downward by lowering the mover of the first linear motor 34. Then, the CPU 78a stops the mover of the first linear motor 34 and moves the mover of the second linear motor 50 at a constant speed before the component P adsorbed on the tip of the nozzle 42 contacts the substrate S. Lower.
- the CPU 78a determines that the component P has contacted the substrate S based on the detection signal from the load cell 53, the CPU 78a controls the movable element of the second linear motor 50 so that the reaction force becomes equal to the set pressing force. Thereby, it is possible to prevent the component P from being damaged by the collision with the substrate S. Further, the CPU 78a controls the pressure adjusting device 43 so that the positive pressure is supplied to the tip of the nozzle 42 when the component P contacts the substrate S. As a result, the component P is mounted at a predetermined component mounting position on the substrate S.
- step S160 the CPU 78a determines whether or not the mounting of the component to be mounted on the substrate S is completed (step S160), and if not completed, the processing after step S110 is executed for the next component P and completed. If so, this routine ends.
- FIG. 7 is a flowchart of the component trial hitting routine.
- the part trial hitting routine program is stored in the HDD 78 c of the controller 78. Since steps S210 to S240 of the component trial placement routine are the same as steps S110 to S140 of the component mounting processing routine, only step S250 and subsequent steps will be described below. Note that the component trial driving routine is usually performed for one substrate S.
- step S250 the CPU 78a of the controller 78 causes the component P to be mounted at a predetermined component mounting position on the substrate S. Specifically, the CPU 78a controls the nozzle rotation motor 31 so that the posture of the component P becomes a predetermined posture based on the captured image.
- the CPU 78a moves the nozzle holder 30 downward by lowering the mover of the first linear motor 34. In parallel with this, the CPU 78a lowers the nozzle 42 relative to the nozzle holder 30 by lowering the mover of the second linear motor 50 before the component P attracted to the tip of the nozzle 42 contacts the substrate S. Move to the lowest end (see FIG. 8A).
- the nozzle lowering speed of the nozzle 42 (speed of approaching the substrate S) is set to a predetermined low speed VL.
- the CPU 78a determines that the component P has contacted the substrate S based on the detection signal from the load cell 53, the CPU 78a controls the mover of the second linear motor 50 so that the reaction force becomes equal to the set pressing force ( (Refer to FIG. 8B).
- the reaction force load applied to the substrate S
- this embodiment employs a high-frequency control system with a short cycle for executing the anti-substrate impact mitigation process. Therefore, reaction force can be suppressed.
- the CPU 78a further controls the peak reaction force after the component P collides with the substrate S to be a preset load (set load). Further, the CPU 78a detects the reaction force after the collision with the load cell 53 over time, and based on the reaction force aging data (load information, load aging data) indicating the change over time of the obtained reaction force, the reaction force increase rate ( Load increase rate) is calculated, and the hardness characteristic when the component P contacts the substrate S is obtained based on the reaction force increase rate.
- An example of reaction force aging data is shown in FIG.
- the reaction force increase rate is expressed as C / T, where T is the time from when the component P collides with the substrate S until the reaction force reaches its peak, and C is the peak value of the reaction force.
- the hardness characteristic is determined by three characteristics: the hardness of the substrate S, the hardness of the nozzle 42, and the hardness of the component P held by the nozzle 42.
- the HDD 78c stores a correspondence relationship between reaction force aging data and hardness characteristics for each reference load (a reference value of a load applied to the substrate S).
- the reference load is 1N, 2N, and 3N.
- the hardness characteristic is divided into a plurality of stages. Here, it is assumed that the hardness characteristic is divided into five stages H1 to H5, and is determined so as to become harder as it progresses from H1 to H5.
- Such correspondence is stored for each preset nozzle lowering speed (here, low speed VL, medium speed VM, and high speed VH).
- 10 to 12 are graphs showing the correspondence between the reaction force aging data and the hardness characteristics for each nozzle descending speed.
- FIG. 10 is a graph showing the correspondence between the reaction force aging data and the hardness characteristics when the nozzle lowering speed is the low speed VL.
- the correspondence relationship at the low speed VL is stored for each reference load.
- the low speed VL is set to a speed that can be controlled by the impact relaxation treatment for the substrate so that the peak reaction force becomes the reference load regardless of the stage of the hardness characteristic.
- FIG. 11 is a graph showing the correspondence between reaction force aging data and hardness characteristics when the nozzle lowering speed is medium speed VM.
- the correspondence relationship of the medium speed VM is also stored for each reference load. At medium speed VM, the peak reaction force may exceed the reference load even if the anti-substrate impact mitigation process is executed depending on the hardness characteristic stage.
- FIG. 12 is a graph showing the correspondence between reaction force aging data and hardness characteristics when the nozzle lowering speed is high speed VH.
- the correspondence relationship of the high-speed VH is also stored for each reference load. When the high-speed VH is used, the peak reaction force exceeds the reference load even if the anti-substrate impact mitigation process is executed with more hardness characteristics than the medium-speed VM.
- the CPU 78a determines the current set load (the load applied to the substrate S) from the correspondence relationship of the low speed VL stored in the HDD 78c. That match or can be substituted.
- the set load is set by the operator. For example, if the set load is 1N, the corresponding relationship of the set load 1N is selected at the low speed VL, the reaction force increase rate of each of the hardness characteristics H1 to H5 is obtained from the corresponding relationship, and these and the reaction force increase rate calculated this time To determine the hardness characteristics.
- the hardness characteristic is determined to be H3.
- the hardness property may be determined as H2, but here Then, the hardness characteristic is determined to be H3. This is because it is preferable to determine the hardness characteristics to be harder in order to avoid damage to the component P.
- the CPU 78a sets the nozzle lowering speed based on the determined hardness characteristic and the set load.
- the determined hardness characteristic is H3 and the set load is 1N will be described as an example. Further, it is assumed that the operator also sets an allowable range for the set load.
- the allowable range is 20%, the peak reaction force is allowable even at the high speed VH. Since it is within the range, the nozzle lowering speed is set to the high speed VH.
- the allowable range is 10%, the high speed VH is outside the allowable range and the medium speed VM is within the allowable range, so the nozzle lowering speed is set to the medium speed VM.
- step S250 the CPU 78a determines whether or not the mounting of the component to be mounted on the substrate S has been completed (step S260). If not completed, the CPU 78a executes the processing from step S210 on for the next component P, If completed, this routine is terminated.
- the nozzle lowering speed for mounting the component P is set for each predetermined component mounting position of the substrate S. For this reason, in the component mounting processing routine executed after the component trial driving routine, the component P can be mounted at the set nozzle lowering speed for each component mounting position.
- the component supply unit 70 corresponds to a component supply device
- the substrate transport unit 12 corresponds to a substrate holding device
- the mounting head 18 corresponds to a head
- the load cell 53 corresponds to a load detector
- the slider 24 corresponds to a head moving device
- the controller 78 corresponds to a control device.
- the nozzle 42 corresponds to a component holder
- the HDD 78c corresponds to a storage device.
- the nozzle sleeve 44, the nozzle spring 46, the second linear motor 50, the second arm 51, and the second engaging portion 52 correspond to an impact mitigating mechanism.
- the nozzle 42 contacts the substrate S via the component P
- the nozzle The hardness characteristic when 42 contacts the substrate S via the component P can be easily obtained.
- the CPU 78a calculates a reaction force increase rate based on the reaction force aging data, and obtains a hardness characteristic based on the reaction force increase rate. Specifically, the hardness characteristic corresponding to the calculated reaction force increase rate is obtained using the correspondence relationship between the reaction force aging data stored in the HDD 78c and the hardness characteristic. Therefore, the hardness characteristic can be obtained with high accuracy.
- the CPU 78a selects one that matches or can replace the set load from a plurality of reference loads, and obtains the hardness characteristic using the correspondence relationship of the selected reference loads. Therefore, the hardness characteristic can be obtained with high accuracy.
- the nozzle lowering speed is set based on the hardness characteristics and a preset load, the nozzle lowering speed commensurate with them, for example, the nozzle lowering speed at which the part P is not damaged is set. be able to. Further, since the nozzle lowering speed is set to a speed close to the upper limit of the set allowable load load range, the time required for component mounting can be shortened.
- the CPU 78a sets the nozzle lowering speed for each component mounting position on the board S, the nozzle lowering speed can be set more appropriately. For example, even if it is the same board
- the CPU 78a obtains a hardness characteristic using reaction force aging data when the nozzle 42 contacts the substrate S via the component P at a predetermined low speed VL, and based on the obtained hardness characteristic, the nozzle 42 Is set to a low speed VL or a medium speed VM or a high speed VH that is faster than the low speed VL. For example, if the hardness characteristic is soft, there is no problem even if the nozzle lowering speed is set to the high speed VH, but if the hardness characteristic is hard, the part P may be damaged if the nozzle lowering speed is not set to the low speed VL. is there.
- the nozzle lowering speed can be set in consideration of such matters.
- the CPU 78a controls the second engaging portion 52 of the second arm 51 so as to cancel the reaction force generated when the nozzle 42 contacts the substrate S via the component P. Therefore, even if the nozzle descending speed of the nozzle 42 is high to some extent, the component P held by the nozzle 42 can be prevented from being broken by an impact when it contacts the substrate S.
- the nozzle 42 holding the component P indirectly contacts the substrate S via the component P as a case where the nozzle 42 contacts the substrate S
- the nozzle 42 not holding the component P may be in direct contact with the substrate S. Even in that case, the same effect as the above-described embodiment can be obtained.
- the part trial hitting routine may be performed without a part.
- hardness characteristics and nozzle lowering speed may be determined as follows. That is, even if a load that can be substituted for the set load 1.1N is selected from a plurality of reference loads 1N, 2N, and 3N, the hardness characteristics and the nozzle lowering speed are obtained using the correspondence relationship of the selected reference loads. Good.
- the hardness characteristic and the nozzle lowering speed may be determined using the correspondence relationship of the reference load 1N closest to the set load 1.1N.
- the nozzle lowering speed may be determined using the correspondence relationship of the reference load 2N closest to the set load 1.1N with a value larger than the set load 1.1N in order to safely avoid the damage of the component P or the like.
- the hardness characteristic is obtained from the calculated reaction force increase rate using the correspondence relationship between the reaction force aging data (reaction force versus time graph) and the hardness characteristic.
- the hardness characteristic may be obtained using a table in which the correspondence relationship between the hardness characteristic, the reaction force increase rate, and the peak reaction force is determined in advance. Even in that case, the same effect as the above-described embodiment can be obtained.
- the peak reaction force is used when determining the nozzle lowering speed, but the peak reaction force is not essential when determining the hardness characteristics.
- the nozzle 42 is exemplified as the component holder.
- the present invention is not particularly limited thereto, and for example, a chuck that holds and holds the component P may be used. Even in that case, the same effect as the above-described embodiment can be obtained.
- the hardness characteristic is a parameter that depends not only on the hardness of the substrate S but also on the hardness of the component P and the hardness of the nozzle 42.
- the hardness of the component P and the hardness of the nozzle 42 are determined in advance.
- the obtained hardness characteristic may be corrected based on the hardness of the component P or the hardness of the nozzle 42 to calculate the hardness of the substrate S, and the hardness of the substrate S may be used. .
- the hardness characteristic corresponding to the reaction force increase rate is obtained, but instead, the hardness characteristic corresponding to the time-dependent data is obtained by using the correspondence relationship between the time-dependent data and the hardness characteristic. You may make it ask. In this way, without calculating an index such as a reaction force increase rate, the temporal characteristics stored in advance can be compared with the temporal data actually detected, and the hardness characteristic can be obtained from the similarity.
- C / T is used as the load increase rate.
- a time required to reach a predetermined load before the peak of the time-lapse data may be used.
- the load value (reaction force value) when a predetermined time elapses after contacting S may be used, or the time until the peak is reached may be used.
- the load cell 53 is exemplified as the load detector.
- the controller 78 (or current monitoring unit) detects the load by monitoring the load current of the second linear motor 50. Also good.
- the component mounter 10 may transmit the nozzle lowering speed to the management computer 80 after determining the nozzle lowering speed.
- the management computer 80 may simulate the production time based on the received nozzle lowering speed and notify the operator of the production time. In this way, the user can grasp the production time and review the production plan.
- the component mounter of the present disclosure may be configured as follows.
- the load information may be time-lapse data representing a change with time of the load.
- time-lapse data representing a change with time of the load.
- the control device calculates a load increase rate per time when the load rises based on the load information, and obtains the hardness characteristic based on the load increase rate. May be.
- the load increase rate increases as the hardness of the contacting objects increases. Therefore, the hardness characteristic can be obtained with high accuracy by using the load increase rate.
- the component mounter of the present disclosure includes a storage device that stores a correspondence relationship between the load increase rate and the hardness characteristic, and the control device has the hardness characteristic corresponding to the load increase rate, You may make it obtain
- the load information is time-lapse data representing a change over time of the load, and includes a storage device that stores a correspondence relationship between the time-lapse data and the hardness characteristic
- the control device includes:
- the hardness characteristic corresponding to the time-lapse data may be obtained using the correspondence relationship stored in the storage device.
- the storage device stores the correspondence relationship for each reference value of the load applied to the board, and the control device uses the component holder as a predetermined information as the load information.
- the reference value is used as the correspondence relationship.
- One that matches or substitutes for the preset load may be selected, and the correspondence relationship of the selected reference values may be used.
- the relationship between the load increase rate and the hardness characteristic changes depending on the load applied to the substrate. Therefore, it is preferable to obtain a hardness characteristic with high accuracy by selecting a reference value that matches or can be replaced with a preset load and using a correspondence relationship between the selected reference values.
- the control device may set an approach speed at which the component holder approaches the board based on the hardness characteristic. In this way, it is possible to set an approach speed corresponding to the hardness characteristic.
- the control device may set the approach speed based on the hardness characteristic and a preset load. In this way, it is possible to set an approach speed commensurate with the hardness characteristics and a preset load.
- the approach speed it may be set to a speed close to the upper limit of the allowable range of the load. In this way, the time required for component mounting can be shortened.
- the said control apparatus may set the said approach speed for every component mounting point on the said board
- the control device obtains the hardness characteristic using the load information detected by the load detector when the component holder contacts the substrate at a predetermined low speed.
- the approach speed at which the component holder approaches the substrate may be set to the low speed or a speed higher than the low speed based on the obtained hardness characteristic.
- the head includes an impact relaxation mechanism that reduces an impact when the component holder contacts the substrate, and the control device includes the component holder that contacts the substrate.
- the impact mitigating mechanism may be controlled so as to cancel the reaction force that is sometimes generated. By doing so, even if the approach speed of the component holder is high to some extent, it is possible to prevent the component held by the component holder from being broken by an impact when contacting the substrate.
- the present invention can be used for a component mounting machine or a component mounting system incorporating a component mounting machine.
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Abstract
Description
部品を供給する部品供給装置と、
基板を保持する基板保持装置と、
部品保持具を昇降可能に保持するヘッドと、
前記部品保持具に加わる荷重を検出する荷重検出器と、
前記部品供給装置と前記基板保持装置との間で前記ヘッドを移動させるヘッド移動装置と、
前記部品保持具が前記基板に接触するように前記ヘッドを制御したときの前記荷重検出器によって検出される荷重情報に基づいて、前記部品保持具が前記基板に接触するときの硬さ特性を求める制御装置と、
を備えたものである。
Claims (12)
- 部品を供給する部品供給装置と、
基板を保持する基板保持装置と、
部品保持具を昇降可能に保持するヘッドと、
前記部品保持具に加わる荷重を検出する荷重検出器と、
前記部品供給装置と前記基板保持装置との間で前記ヘッドを移動させるヘッド移動装置と、
前記部品保持具が前記基板に接触するように前記ヘッドを制御したときの前記荷重検出器によって検出される荷重情報に基づいて、前記部品保持具が前記基板に接触するときの硬さ特性を求める制御装置と、
を備えた部品実装機。 - 前記荷重情報は、前記荷重の経時変化を表す経時データである、
請求項1に記載の部品実装機。 - 前記制御装置は、前記荷重情報に基づいて前記荷重が立ち上がる際の時間あたりの荷重増加率を算出し、前記荷重増加率に基づいて前記硬さ特性を求める、
請求項1又は2に記載の部品実装機。 - 請求項3に記載の部品実装機であって、
前記荷重増加率と前記硬さ特性との対応関係を記憶する記憶装置
を備え、
前記制御装置は、前記荷重増加率に対応する前記硬さ特性を、前記記憶装置に記憶された前記対応関係を用いて求める、
部品実装機。 - 請求項1に記載の部品実装機であって、
前記荷重情報は、前記荷重の経時変化を表す経時データであり、
前記経時データと前記硬さ特性との対応関係を記憶する記憶装置
を備え、
前記制御装置は、前記経時データに対応する前記硬さ特性を、前記記憶装置に記憶された前記対応関係を用いて求める、
部品実装機。 - 前記記憶装置は、前記基板に加わる負荷荷重の基準値ごとに前記対応関係を記憶しており、
前記制御装置は、前記荷重情報として、前記部品保持具が所定の低速度で前記基板に接触して予め設定された負荷荷重が前記基板に加わるように前記ヘッドを制御したときの前記荷重検出器によって検出される荷重情報を用い、前記対応関係として、前記基準値の中から前記予め設定された負荷荷重と一致するもの又は代替し得るものを選出し、選出した前記基準値の対応関係を用いる、
請求項4又は5に記載の部品実装機。 - 前記制御装置は、前記硬さ特性に基づいて、前記部品保持具が前記基板に接近する接近速度を設定する、
請求項1~6のいずれか1項に記載の部品実装機。 - 前記制御装置は、前記硬さ特性と予め設定された負荷荷重とに基づいて、前記接近速度を設定する、
請求項7に記載の部品実装機。 - 前記制御装置は、前記接近速度を設定するにあたり、前記負荷荷重の許容範囲の上限に近い速度に設定する、
請求項8に記載の部品実装機。 - 前記制御装置は、前記基板上の部品装着位置ごとに前記接近速度を設定する、
請求項7~9のいずれか1項に記載の部品実装機。 - 前記制御装置は、前記部品保持具が所定の低速度で前記基板に接触したときの前記荷重検出器によって検出される前記荷重情報を用いて前記硬さ特性を求め、求めた前記硬さ特性に基づいて、前記部品保持具が前記基板に接近する接近速度を前記低速度または前記低速度よりも速い速度に設定する、
請求項1~10のいずれか1項に記載の部品実装機。 - 前記ヘッドは、前記部品保持具が前記基板に接触したときの衝撃を緩和する衝撃緩和機構を有し、
前記制御装置は、前記部品保持具が前記基板に接触したときに発生する反力を打ち消すように前記衝撃緩和機構を制御する、
請求項1~11のいずれか1項に記載の部品実装機。
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EP3595425A1 (en) | 2020-01-15 |
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