JP2006070252A - ポリ4−メチル−1−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 - Google Patents
ポリ4−メチル−1−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 Download PDFInfo
- Publication number
- JP2006070252A JP2006070252A JP2005218644A JP2005218644A JP2006070252A JP 2006070252 A JP2006070252 A JP 2006070252A JP 2005218644 A JP2005218644 A JP 2005218644A JP 2005218644 A JP2005218644 A JP 2005218644A JP 2006070252 A JP2006070252 A JP 2006070252A
- Authority
- JP
- Japan
- Prior art keywords
- methyl
- pentene
- film
- resin composition
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 title claims abstract description 145
- 239000011342 resin composition Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title abstract description 35
- 238000000465 moulding Methods 0.000 claims abstract description 34
- 230000000903 blocking effect Effects 0.000 claims abstract description 12
- 238000002425 crystallisation Methods 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- 229920000642 polymer Polymers 0.000 claims description 82
- 150000001336 alkenes Chemical class 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 239000008393 encapsulating agent Substances 0.000 claims description 10
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 8
- 229920001519 homopolymer Polymers 0.000 claims description 7
- 229920001577 copolymer Polymers 0.000 abstract description 4
- 230000008025 crystallization Effects 0.000 abstract description 2
- 230000003578 releasing effect Effects 0.000 abstract 3
- 238000006116 polymerization reaction Methods 0.000 description 38
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 24
- 239000008188 pellet Substances 0.000 description 20
- 239000003054 catalyst Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000007787 solid Substances 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 9
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 8
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 4
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- 239000011954 Ziegler–Natta catalyst Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000012968 metallocene catalyst Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 3
- RGHIYOCUMCUWAQ-UHFFFAOYSA-N 3,3-bis(methoxymethyl)-2,5-dimethylhexane Chemical compound COCC(COC)(CC(C)C)C(C)C RGHIYOCUMCUWAQ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229940069096 dodecene Drugs 0.000 description 3
- -1 ethylene, propylene, 1-butene Chemical class 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000012456 homogeneous solution Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- 239000002530 phenolic antioxidant Substances 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000004736 wide-angle X-ray diffraction Methods 0.000 description 3
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 2
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- IMRKOERSTLKEAO-UHFFFAOYSA-N 4-methyldec-1-ene Chemical compound CCCCCCC(C)CC=C IMRKOERSTLKEAO-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000005464 sample preparation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000011949 solid catalyst Substances 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005218644A JP2006070252A (ja) | 2004-08-03 | 2005-07-28 | ポリ4−メチル−1−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004227209 | 2004-08-03 | ||
JP2005218644A JP2006070252A (ja) | 2004-08-03 | 2005-07-28 | ポリ4−メチル−1−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 |
Publications (2)
Publication Number | Publication Date |
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JP2006070252A true JP2006070252A (ja) | 2006-03-16 |
JP2006070252A5 JP2006070252A5 (enrdf_load_stackoverflow) | 2008-09-04 |
Family
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JP2005218644A Withdrawn JP2006070252A (ja) | 2004-08-03 | 2005-07-28 | ポリ4−メチル−1−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 |
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JP (1) | JP2006070252A (enrdf_load_stackoverflow) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008081709A (ja) * | 2006-09-29 | 2008-04-10 | Mitsui Chemical Fabro Inc | 表面保護フィルム |
WO2010013467A1 (ja) | 2008-08-01 | 2010-02-04 | 三井化学株式会社 | ポリ4-メチル-1-ペンテン樹脂組成物、それを含むフィルム、微多孔フィルム、電池用セパレータおよびリチウムイオン電池 |
JP2011140593A (ja) * | 2010-01-08 | 2011-07-21 | Mitsui Chemicals Inc | 樹脂組成物、およびその成形フィルム |
JP2011140594A (ja) * | 2010-01-08 | 2011-07-21 | Mitsui Chemicals Inc | 樹脂組成物、およびそれを含むフィルム |
JP2012153775A (ja) * | 2011-01-25 | 2012-08-16 | Mitsui Chemicals Inc | フィルム、前記フィルムの製造方法及びそれを用いたledパッケージの製造方法 |
JP2013032005A (ja) * | 2011-07-07 | 2013-02-14 | Mitsui Chemicals Inc | 表面保護フィルム |
JP2013227421A (ja) * | 2012-04-25 | 2013-11-07 | Mitsui Chemicals Inc | 組成物、フィルム、前記フィルムの製造方法 |
WO2015037426A1 (ja) | 2013-09-10 | 2015-03-19 | 旭化成ケミカルズ株式会社 | 離型フィルム、成型体の製造方法、半導体部品及びリフレクター部品 |
EP2799488A4 (en) * | 2011-12-27 | 2015-04-01 | Mitsui Chemicals Inc | 4-METHYL-1-PENTEN (CO) POLYMER COMPOSITION AND FOIL AND HOLLOW MOLDING BODIES FROM THE 4-METHYL-1-PENTEN (CO) POLYMER COMPOSITION |
JP2015201623A (ja) * | 2014-03-31 | 2015-11-12 | 大日本印刷株式会社 | 半導体発光装置及び光半導体実装用基板 |
JP2019183175A (ja) * | 2019-08-01 | 2019-10-24 | ダイキン工業株式会社 | 離型フィルム |
JP2019188680A (ja) * | 2018-04-24 | 2019-10-31 | 三井化学株式会社 | 積層体および離型紙 |
-
2005
- 2005-07-28 JP JP2005218644A patent/JP2006070252A/ja not_active Withdrawn
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008081709A (ja) * | 2006-09-29 | 2008-04-10 | Mitsui Chemical Fabro Inc | 表面保護フィルム |
JP5501233B2 (ja) * | 2008-08-01 | 2014-05-21 | 三井化学株式会社 | ポリ4−メチル−1−ペンテン樹脂組成物、それを含むフィルム、微多孔フィルム、電池用セパレータおよびリチウムイオン電池 |
WO2010013467A1 (ja) | 2008-08-01 | 2010-02-04 | 三井化学株式会社 | ポリ4-メチル-1-ペンテン樹脂組成物、それを含むフィルム、微多孔フィルム、電池用セパレータおよびリチウムイオン電池 |
US8211981B2 (en) | 2008-08-01 | 2012-07-03 | Mitsui Chemicals, Inc. | Poly(4-methyl-1-pentene) resin composition, film containing same, microporous film, battery separator and lithium ion battery |
JP2011140594A (ja) * | 2010-01-08 | 2011-07-21 | Mitsui Chemicals Inc | 樹脂組成物、およびそれを含むフィルム |
JP2011140593A (ja) * | 2010-01-08 | 2011-07-21 | Mitsui Chemicals Inc | 樹脂組成物、およびその成形フィルム |
JP2012153775A (ja) * | 2011-01-25 | 2012-08-16 | Mitsui Chemicals Inc | フィルム、前記フィルムの製造方法及びそれを用いたledパッケージの製造方法 |
JP2013032005A (ja) * | 2011-07-07 | 2013-02-14 | Mitsui Chemicals Inc | 表面保護フィルム |
EP2799488A4 (en) * | 2011-12-27 | 2015-04-01 | Mitsui Chemicals Inc | 4-METHYL-1-PENTEN (CO) POLYMER COMPOSITION AND FOIL AND HOLLOW MOLDING BODIES FROM THE 4-METHYL-1-PENTEN (CO) POLYMER COMPOSITION |
TWI550007B (zh) * | 2011-12-27 | 2016-09-21 | Mitsui Chemicals Inc | 4-methyl-1-pentene (co) polymer composition, a film composed of the composition and a hollow molded body |
US9902847B2 (en) | 2011-12-27 | 2018-02-27 | Mitsui Chemicals, Inc. | 4-methyl-1-pentene (co)polymer composition, and film and hollow molded product composed of the composition |
JP2013227421A (ja) * | 2012-04-25 | 2013-11-07 | Mitsui Chemicals Inc | 組成物、フィルム、前記フィルムの製造方法 |
WO2015037426A1 (ja) | 2013-09-10 | 2015-03-19 | 旭化成ケミカルズ株式会社 | 離型フィルム、成型体の製造方法、半導体部品及びリフレクター部品 |
JP2015201623A (ja) * | 2014-03-31 | 2015-11-12 | 大日本印刷株式会社 | 半導体発光装置及び光半導体実装用基板 |
CN106133929A (zh) * | 2014-03-31 | 2016-11-16 | 大日本印刷株式会社 | 半导体发光装置及光半导体安装用基板 |
JP2019188680A (ja) * | 2018-04-24 | 2019-10-31 | 三井化学株式会社 | 積層体および離型紙 |
JP7144180B2 (ja) | 2018-04-24 | 2022-09-29 | 三井化学株式会社 | 積層体および離型紙 |
JP2019183175A (ja) * | 2019-08-01 | 2019-10-24 | ダイキン工業株式会社 | 離型フィルム |
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