JP2006070252A5 - - Google Patents

Download PDF

Info

Publication number
JP2006070252A5
JP2006070252A5 JP2005218644A JP2005218644A JP2006070252A5 JP 2006070252 A5 JP2006070252 A5 JP 2006070252A5 JP 2005218644 A JP2005218644 A JP 2005218644A JP 2005218644 A JP2005218644 A JP 2005218644A JP 2006070252 A5 JP2006070252 A5 JP 2006070252A5
Authority
JP
Japan
Prior art keywords
methyl
pentene
resin composition
poly
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005218644A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006070252A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005218644A priority Critical patent/JP2006070252A/ja
Priority claimed from JP2005218644A external-priority patent/JP2006070252A/ja
Publication of JP2006070252A publication Critical patent/JP2006070252A/ja
Publication of JP2006070252A5 publication Critical patent/JP2006070252A5/ja
Withdrawn legal-status Critical Current

Links

JP2005218644A 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 Withdrawn JP2006070252A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005218644A JP2006070252A (ja) 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004227209 2004-08-03
JP2005218644A JP2006070252A (ja) 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠

Publications (2)

Publication Number Publication Date
JP2006070252A JP2006070252A (ja) 2006-03-16
JP2006070252A5 true JP2006070252A5 (enrdf_load_stackoverflow) 2008-09-04

Family

ID=36151199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005218644A Withdrawn JP2006070252A (ja) 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠

Country Status (1)

Country Link
JP (1) JP2006070252A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5047575B2 (ja) * 2006-09-29 2012-10-10 三井化学株式会社 表面保護フィルム
CN102089379B (zh) 2008-08-01 2013-05-01 三井化学株式会社 聚4-甲基-1-戊烯树脂组合物、含其的膜、微多孔膜、电池用隔膜及锂离子电池
JP5684986B2 (ja) * 2010-01-08 2015-03-18 三井化学株式会社 樹脂組成物、およびその成形フィルム
JP5489729B2 (ja) * 2010-01-08 2014-05-14 三井化学株式会社 樹脂組成物、およびそれを含むフィルム
JP2012153775A (ja) * 2011-01-25 2012-08-16 Mitsui Chemicals Inc フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法
JP5871734B2 (ja) * 2011-07-07 2016-03-01 三井化学株式会社 表面保護フィルム
US9902847B2 (en) 2011-12-27 2018-02-27 Mitsui Chemicals, Inc. 4-methyl-1-pentene (co)polymer composition, and film and hollow molded product composed of the composition
JP5840064B2 (ja) * 2012-04-25 2016-01-06 三井化学株式会社 組成物、フィルム、前記フィルムの製造方法
CN105451954A (zh) 2013-09-10 2016-03-30 旭化成化学株式会社 离型膜、成型体的制造方法、半导体部件和反射器部件
JP5920497B2 (ja) * 2014-03-31 2016-05-18 大日本印刷株式会社 半導体発光装置及び光半導体実装用基板
JP7144180B2 (ja) * 2018-04-24 2022-09-29 三井化学株式会社 積層体および離型紙
JP2019183175A (ja) * 2019-08-01 2019-10-24 ダイキン工業株式会社 離型フィルム

Similar Documents

Publication Publication Date Title
JP2006070252A5 (enrdf_load_stackoverflow)
NZ590864A (en) Compositions comprising very low density polyethylene, ethylene acrylic acid copolymer and thermoplastic starch
WO2011087587A3 (en) Flame retardant polyamide composition, method, and article
WO2008114634A1 (ja) 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法
WO2010014630A3 (en) Crystallized thermoplastic polyhydroxyalkanoate compounds
JP2009502329A5 (enrdf_load_stackoverflow)
DE602007013096D1 (de) Verbesserte heterophasische polypropylencopolymere mit hohem schmelzfluss
WO2010123314A2 (ko) 새로운 에폭시 수지 및 이를 포함하는 에폭시 수지 조성물
JP2013169685A5 (enrdf_load_stackoverflow)
WO2007027862A3 (en) Soft polymer compositions having improved high temperature properties
WO2009043850A3 (en) Heat-processable thermally conductive polymer composition
WO2008140835A8 (en) Polymeric material and its manufacture and use
MY157414A (en) Epoxy resin composition and semiconductor device
EP1914271A3 (en) Room temperature-curable heat-conductive silicone rubber composition
JP2016504212A5 (enrdf_load_stackoverflow)
JP2009512749A5 (enrdf_load_stackoverflow)
JP2014040593A5 (enrdf_load_stackoverflow)
JP2011529978A5 (enrdf_load_stackoverflow)
WO2007079101A3 (en) Compositions comprising novel compounds and electronic devices made with such compositions
TW200740948A (en) Releasing resin composition, and molded article and laminate thereof
MX2020002452A (es) Composiciones y peliculas de multiples capas para envase recerrable.
JP2006091847A5 (enrdf_load_stackoverflow)
BRPI0519319A2 (pt) composiÇço polimÉrica multimodal, seus usos e processo de produÇço, filme compreendendo a mesma, material multicamada e processo de produÇço do mesmo
JP2010539260A5 (enrdf_load_stackoverflow)
TW200520598A (en) Thick film compositions for use in electroluminescent applications