JP2006054284A - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP2006054284A
JP2006054284A JP2004234110A JP2004234110A JP2006054284A JP 2006054284 A JP2006054284 A JP 2006054284A JP 2004234110 A JP2004234110 A JP 2004234110A JP 2004234110 A JP2004234110 A JP 2004234110A JP 2006054284 A JP2006054284 A JP 2006054284A
Authority
JP
Japan
Prior art keywords
chamber
processing
vacuum
substrate
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004234110A
Other languages
English (en)
Japanese (ja)
Inventor
Tatsuhiro Taguchi
竜大 田口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP2004234110A priority Critical patent/JP2006054284A/ja
Priority to KR1020050062054A priority patent/KR100619448B1/ko
Priority to TW094124828A priority patent/TWI309224B/zh
Priority to CNB200510087362XA priority patent/CN100424814C/zh
Publication of JP2006054284A publication Critical patent/JP2006054284A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2004234110A 2004-08-11 2004-08-11 真空処理装置 Pending JP2006054284A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004234110A JP2006054284A (ja) 2004-08-11 2004-08-11 真空処理装置
KR1020050062054A KR100619448B1 (ko) 2004-08-11 2005-07-11 진공처리장치
TW094124828A TWI309224B (en) 2004-08-11 2005-07-22 Vacuum treatment apparatus
CNB200510087362XA CN100424814C (zh) 2004-08-11 2005-07-28 真空处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004234110A JP2006054284A (ja) 2004-08-11 2004-08-11 真空処理装置

Publications (1)

Publication Number Publication Date
JP2006054284A true JP2006054284A (ja) 2006-02-23

Family

ID=36031569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004234110A Pending JP2006054284A (ja) 2004-08-11 2004-08-11 真空処理装置

Country Status (4)

Country Link
JP (1) JP2006054284A (zh)
KR (1) KR100619448B1 (zh)
CN (1) CN100424814C (zh)
TW (1) TWI309224B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009011166A1 (ja) * 2007-07-13 2009-01-22 Sharp Kabushiki Kaisha 真空処理装置および真空処理方法
WO2009148077A1 (ja) * 2008-06-06 2009-12-10 株式会社アルバック 薄膜太陽電池製造装置
WO2009148081A1 (ja) * 2008-06-06 2009-12-10 株式会社アルバック 薄膜太陽電池製造装置
CN101882565A (zh) * 2010-06-03 2010-11-10 北京北方微电子基地设备工艺研究中心有限责任公司 一种在线处理设备
KR101071344B1 (ko) 2009-07-22 2011-10-07 세메스 주식회사 기판 처리 장치 및 방법
JP2011216516A (ja) * 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2014072366A (ja) * 2012-09-28 2014-04-21 Tdk Corp 成膜処理装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101234696B1 (ko) * 2008-02-28 2013-02-19 가부시키가이샤 알박 반송 장치, 진공처리 장치 및 반송 방법
KR101487382B1 (ko) * 2008-10-22 2015-01-29 주식회사 원익아이피에스 인라인 반도체 제조시스템
KR20110000309A (ko) * 2009-06-26 2011-01-03 주식회사 미뉴타텍 기판 진공성형 장치 및 진공성형 방법
JP5835722B2 (ja) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー 自動順位付け多方向直列型処理装置
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
KR102019779B1 (ko) * 2011-11-15 2019-09-09 세메스 주식회사 기판 처리 장치
KR102514121B1 (ko) 2021-03-08 2023-03-23 송필남 무게중심 조절이 가능한 골프용 퍼터

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717119A (en) * 1971-07-30 1973-02-20 Gen Motors Corp Vacuum processing machine for aluminizing headlamp reflectors
JPH0831506B2 (ja) * 1986-07-17 1996-03-27 松下電器産業株式会社 基板搬送装置
JP2001239144A (ja) * 2000-02-29 2001-09-04 Shimadzu Corp ロードロック式真空装置
JP2002222846A (ja) * 2001-01-26 2002-08-09 Shin Meiwa Ind Co Ltd 真空搬送装置
JP2003229466A (ja) * 2002-02-04 2003-08-15 Seiko Instruments Inc 真空処理装置
JP4277517B2 (ja) * 2002-11-29 2009-06-10 株式会社ニコン 露光装置及び基板搬送装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009011166A1 (ja) * 2007-07-13 2009-01-22 Sharp Kabushiki Kaisha 真空処理装置および真空処理方法
TWI406430B (zh) * 2008-06-06 2013-08-21 Ulvac Inc 薄膜太陽電池製造裝置
WO2009148077A1 (ja) * 2008-06-06 2009-12-10 株式会社アルバック 薄膜太陽電池製造装置
WO2009148081A1 (ja) * 2008-06-06 2009-12-10 株式会社アルバック 薄膜太陽電池製造装置
TWI452713B (zh) * 2008-06-06 2014-09-11 Ulvac Inc 薄膜太陽能電池製造裝置
KR101210533B1 (ko) * 2008-06-06 2012-12-10 가부시키가이샤 아루박 박막 태양 전지 제조 장치
KR101215588B1 (ko) * 2008-06-06 2012-12-26 가부시키가이샤 아루박 박막 태양 전지 제조 장치
JP5186563B2 (ja) * 2008-06-06 2013-04-17 株式会社アルバック 薄膜太陽電池製造装置
KR101071344B1 (ko) 2009-07-22 2011-10-07 세메스 주식회사 기판 처리 장치 및 방법
JP2011216516A (ja) * 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
CN101882565A (zh) * 2010-06-03 2010-11-10 北京北方微电子基地设备工艺研究中心有限责任公司 一种在线处理设备
CN101882565B (zh) * 2010-06-03 2012-04-11 北京北方微电子基地设备工艺研究中心有限责任公司 一种在线处理设备
JP2014072366A (ja) * 2012-09-28 2014-04-21 Tdk Corp 成膜処理装置

Also Published As

Publication number Publication date
KR20060050029A (ko) 2006-05-19
TW200606094A (en) 2006-02-16
TWI309224B (en) 2009-05-01
KR100619448B1 (ko) 2006-09-06
CN1734711A (zh) 2006-02-15
CN100424814C (zh) 2008-10-08

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