JP2006009131A - 基板処理方法及び装置 - Google Patents

基板処理方法及び装置 Download PDF

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Publication number
JP2006009131A
JP2006009131A JP2004192061A JP2004192061A JP2006009131A JP 2006009131 A JP2006009131 A JP 2006009131A JP 2004192061 A JP2004192061 A JP 2004192061A JP 2004192061 A JP2004192061 A JP 2004192061A JP 2006009131 A JP2006009131 A JP 2006009131A
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JP
Japan
Prior art keywords
substrate
wiring
catalyst
unit
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004192061A
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English (en)
Japanese (ja)
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JP2006009131A5 (enExample
Inventor
Chikaaki O
新明 王
Daisuke Takagi
大輔 高木
Akihiko Tashiro
昭彦 田代
Yukiko Nishioka
由紀子 西岡
Yukio Fukunaga
由紀夫 福永
Akira Fukunaga
明 福永
Akira Owatari
晃 尾渡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2004192061A priority Critical patent/JP2006009131A/ja
Priority to PCT/JP2005/001167 priority patent/WO2005071138A1/ja
Priority to EP05704220A priority patent/EP1717344A4/en
Priority to US11/039,967 priority patent/US7285492B2/en
Publication of JP2006009131A publication Critical patent/JP2006009131A/ja
Publication of JP2006009131A5 publication Critical patent/JP2006009131A5/ja
Priority to US11/896,071 priority patent/US20080000776A1/en
Priority to US12/685,820 priority patent/US20100105154A1/en
Pending legal-status Critical Current

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JP2004192061A 2004-01-23 2004-06-29 基板処理方法及び装置 Pending JP2006009131A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004192061A JP2006009131A (ja) 2004-06-29 2004-06-29 基板処理方法及び装置
PCT/JP2005/001167 WO2005071138A1 (ja) 2004-01-23 2005-01-21 基板処理方法及び触媒処理液及び基板処理装置
EP05704220A EP1717344A4 (en) 2004-01-23 2005-01-21 PROCESS FOR PROCESSING A SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING DEVICE
US11/039,967 US7285492B2 (en) 2004-01-23 2005-01-24 Method for processing substrate
US11/896,071 US20080000776A1 (en) 2004-01-23 2007-08-29 Method and apparatus for processing substrate
US12/685,820 US20100105154A1 (en) 2004-01-23 2010-01-12 Method and apparatus for processing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004192061A JP2006009131A (ja) 2004-06-29 2004-06-29 基板処理方法及び装置

Publications (2)

Publication Number Publication Date
JP2006009131A true JP2006009131A (ja) 2006-01-12
JP2006009131A5 JP2006009131A5 (enExample) 2007-07-26

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ID=35776691

Family Applications (1)

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JP2004192061A Pending JP2006009131A (ja) 2004-01-23 2004-06-29 基板処理方法及び装置

Country Status (1)

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JP (1) JP2006009131A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008001697A1 (fr) * 2006-06-26 2008-01-03 Tokyo Electron Limited Procédé et appareil de traitement de substrats
JP2008038215A (ja) * 2006-08-08 2008-02-21 Ebara Corp 基板処理方法及び基板処理装置
KR101061931B1 (ko) 2006-10-06 2011-09-02 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 장치 및 기록 매체
JP2018103559A (ja) * 2016-12-28 2018-07-05 エスアイアイ・プリンテック株式会社 溝構造のめっき方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003193246A (ja) * 2001-12-25 2003-07-09 Ebara Corp 無電解めっきの前処理方法及び前処理液
JP2003224128A (ja) * 2002-01-30 2003-08-08 Ebara Corp 配線形成方法及び装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003193246A (ja) * 2001-12-25 2003-07-09 Ebara Corp 無電解めっきの前処理方法及び前処理液
JP2003224128A (ja) * 2002-01-30 2003-08-08 Ebara Corp 配線形成方法及び装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008001697A1 (fr) * 2006-06-26 2008-01-03 Tokyo Electron Limited Procédé et appareil de traitement de substrats
WO2008001698A1 (fr) * 2006-06-26 2008-01-03 Tokyo Electron Limited Procédé et appareil de traitement de substrats
JPWO2008001698A1 (ja) * 2006-06-26 2009-11-26 東京エレクトロン株式会社 基板処理方法および基板処理装置
JPWO2008001697A1 (ja) * 2006-06-26 2009-11-26 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP4740330B2 (ja) * 2006-06-26 2011-08-03 東京エレクトロン株式会社 基板処理方法および基板処理装置
US8062955B2 (en) 2006-06-26 2011-11-22 Tokyo Electron Limited Substrate processing method and substrate processing apparatus
JP2008038215A (ja) * 2006-08-08 2008-02-21 Ebara Corp 基板処理方法及び基板処理装置
KR101061931B1 (ko) 2006-10-06 2011-09-02 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 장치 및 기록 매체
JP2018103559A (ja) * 2016-12-28 2018-07-05 エスアイアイ・プリンテック株式会社 溝構造のめっき方法

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