JP2006009131A5 - - Google Patents
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- Publication number
- JP2006009131A5 JP2006009131A5 JP2004192061A JP2004192061A JP2006009131A5 JP 2006009131 A5 JP2006009131 A5 JP 2006009131A5 JP 2004192061 A JP2004192061 A JP 2004192061A JP 2004192061 A JP2004192061 A JP 2004192061A JP 2006009131 A5 JP2006009131 A5 JP 2006009131A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring
- catalyst
- cleaning
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 118
- 239000003054 catalyst Substances 0.000 claims description 62
- 238000004140 cleaning Methods 0.000 claims description 49
- 238000007772 electroless plating Methods 0.000 claims description 29
- 238000005498 polishing Methods 0.000 claims description 24
- 238000003672 processing method Methods 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000003197 catalytic effect Effects 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 claims description 5
- 238000012805 post-processing Methods 0.000 claims description 5
- 239000002738 chelating agent Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 239000000356 contaminant Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 7
- 238000005201 scrubbing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004192061A JP2006009131A (ja) | 2004-06-29 | 2004-06-29 | 基板処理方法及び装置 |
| PCT/JP2005/001167 WO2005071138A1 (ja) | 2004-01-23 | 2005-01-21 | 基板処理方法及び触媒処理液及び基板処理装置 |
| EP05704220A EP1717344A4 (en) | 2004-01-23 | 2005-01-21 | PROCESS FOR PROCESSING A SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING DEVICE |
| US11/039,967 US7285492B2 (en) | 2004-01-23 | 2005-01-24 | Method for processing substrate |
| US11/896,071 US20080000776A1 (en) | 2004-01-23 | 2007-08-29 | Method and apparatus for processing substrate |
| US12/685,820 US20100105154A1 (en) | 2004-01-23 | 2010-01-12 | Method and apparatus for processing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004192061A JP2006009131A (ja) | 2004-06-29 | 2004-06-29 | 基板処理方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006009131A JP2006009131A (ja) | 2006-01-12 |
| JP2006009131A5 true JP2006009131A5 (enExample) | 2007-07-26 |
Family
ID=35776691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004192061A Pending JP2006009131A (ja) | 2004-01-23 | 2004-06-29 | 基板処理方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006009131A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008001698A1 (fr) * | 2006-06-26 | 2008-01-03 | Tokyo Electron Limited | Procédé et appareil de traitement de substrats |
| JP2008038215A (ja) * | 2006-08-08 | 2008-02-21 | Ebara Corp | 基板処理方法及び基板処理装置 |
| JP5143498B2 (ja) | 2006-10-06 | 2013-02-13 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、プログラムならびに記録媒体 |
| JP7011388B2 (ja) * | 2016-12-28 | 2022-01-26 | エスアイアイ・プリンテック株式会社 | 溝構造のめっき方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3821709B2 (ja) * | 2001-12-25 | 2006-09-13 | 株式会社荏原製作所 | 無電解めっきの前処理方法 |
| JP3812891B2 (ja) * | 2002-01-30 | 2006-08-23 | 株式会社荏原製作所 | 配線形成方法 |
-
2004
- 2004-06-29 JP JP2004192061A patent/JP2006009131A/ja active Pending
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