JP2004300576A5 - - Google Patents
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- Publication number
- JP2004300576A5 JP2004300576A5 JP2004075363A JP2004075363A JP2004300576A5 JP 2004300576 A5 JP2004300576 A5 JP 2004300576A5 JP 2004075363 A JP2004075363 A JP 2004075363A JP 2004075363 A JP2004075363 A JP 2004075363A JP 2004300576 A5 JP2004300576 A5 JP 2004300576A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plating
- pretreatment
- substrate processing
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims description 112
- 238000007747 plating Methods 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 45
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000007788 liquid Substances 0.000 claims description 34
- 238000012545 processing Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 29
- 238000007772 electroless plating Methods 0.000 claims description 23
- 238000003672 processing method Methods 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 16
- 239000012535 impurity Substances 0.000 claims description 15
- 239000000243 solution Substances 0.000 claims description 14
- 238000002203 pretreatment Methods 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 9
- 238000007781 pre-processing Methods 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 4
- 230000003197 catalytic effect Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000012805 post-processing Methods 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 238000000746 purification Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004075363A JP2004300576A (ja) | 2003-03-20 | 2004-03-16 | 基板処理方法及び基板処理装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003078485 | 2003-03-20 | ||
| JP2004075363A JP2004300576A (ja) | 2003-03-20 | 2004-03-16 | 基板処理方法及び基板処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007028541A Division JP2007126756A (ja) | 2003-03-20 | 2007-02-07 | 無電解めっき装置及び無電解めっき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004300576A JP2004300576A (ja) | 2004-10-28 |
| JP2004300576A5 true JP2004300576A5 (enExample) | 2006-07-20 |
Family
ID=33421955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004075363A Withdrawn JP2004300576A (ja) | 2003-03-20 | 2004-03-16 | 基板処理方法及び基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004300576A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005105322A1 (ja) * | 2004-04-28 | 2008-03-13 | 株式会社荏原製作所 | 基板処理ユニット及び基板処理装置 |
| JP2006241580A (ja) * | 2005-03-07 | 2006-09-14 | Ebara Corp | 基板処理方法及び基板処理装置 |
| CN101410953B (zh) | 2006-03-27 | 2011-04-13 | 东京毅力科创株式会社 | 基板处理方法和装置、半导体装置的制造方法 |
| JP2008038215A (ja) * | 2006-08-08 | 2008-02-21 | Ebara Corp | 基板処理方法及び基板処理装置 |
| US9048088B2 (en) * | 2008-03-28 | 2015-06-02 | Lam Research Corporation | Processes and solutions for substrate cleaning and electroless deposition |
| TWI645913B (zh) * | 2016-11-10 | 2019-01-01 | 辛耘企業股份有限公司 | 液體製程裝置 |
| CN111180369A (zh) * | 2020-02-20 | 2020-05-19 | 天津中环领先材料技术有限公司 | 一种半导体抛光片清洗设备及清洗方法 |
| JP7542391B2 (ja) * | 2020-10-09 | 2024-08-30 | 株式会社荏原製作所 | めっき方法 |
| TW202417685A (zh) * | 2022-06-28 | 2024-05-01 | 日商東京威力科創股份有限公司 | 基板液處理方法及基板液處理裝置 |
-
2004
- 2004-03-16 JP JP2004075363A patent/JP2004300576A/ja not_active Withdrawn
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