JP2005243845A5 - - Google Patents

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Publication number
JP2005243845A5
JP2005243845A5 JP2004050407A JP2004050407A JP2005243845A5 JP 2005243845 A5 JP2005243845 A5 JP 2005243845A5 JP 2004050407 A JP2004050407 A JP 2004050407A JP 2004050407 A JP2004050407 A JP 2004050407A JP 2005243845 A5 JP2005243845 A5 JP 2005243845A5
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JP
Japan
Prior art keywords
substrate
plated
treatment
plasma
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004050407A
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English (en)
Japanese (ja)
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JP2005243845A (ja
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Publication date
Application filed filed Critical
Priority to JP2004050407A priority Critical patent/JP2005243845A/ja
Priority claimed from JP2004050407A external-priority patent/JP2005243845A/ja
Publication of JP2005243845A publication Critical patent/JP2005243845A/ja
Publication of JP2005243845A5 publication Critical patent/JP2005243845A5/ja
Pending legal-status Critical Current

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JP2004050407A 2004-02-25 2004-02-25 基板処理方法及び基板処理装置 Pending JP2005243845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004050407A JP2005243845A (ja) 2004-02-25 2004-02-25 基板処理方法及び基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004050407A JP2005243845A (ja) 2004-02-25 2004-02-25 基板処理方法及び基板処理装置

Publications (2)

Publication Number Publication Date
JP2005243845A JP2005243845A (ja) 2005-09-08
JP2005243845A5 true JP2005243845A5 (enExample) 2007-04-12

Family

ID=35025267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004050407A Pending JP2005243845A (ja) 2004-02-25 2004-02-25 基板処理方法及び基板処理装置

Country Status (1)

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JP (1) JP2005243845A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250915A (ja) * 2006-03-16 2007-09-27 Ebara Corp 基板処理方法および基板処理装置
EP2004873A1 (en) * 2006-04-12 2008-12-24 Ciba Holding Inc. Process for the treatment of metal coated particles
JP2008038215A (ja) * 2006-08-08 2008-02-21 Ebara Corp 基板処理方法及び基板処理装置
WO2015159579A1 (ja) 2014-04-16 2015-10-22 三菱電機株式会社 半導体装置
JP2025103112A (ja) * 2023-12-27 2025-07-09 東京エレクトロン株式会社 基板処理方法および基板処理システム

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