JP2005243845A - 基板処理方法及び基板処理装置 - Google Patents

基板処理方法及び基板処理装置 Download PDF

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Publication number
JP2005243845A
JP2005243845A JP2004050407A JP2004050407A JP2005243845A JP 2005243845 A JP2005243845 A JP 2005243845A JP 2004050407 A JP2004050407 A JP 2004050407A JP 2004050407 A JP2004050407 A JP 2004050407A JP 2005243845 A JP2005243845 A JP 2005243845A
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Japan
Prior art keywords
substrate
plating
wiring
protective film
processing
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Pending
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JP2004050407A
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Japanese (ja)
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JP2005243845A5 (enExample
Inventor
Daisuke Takagi
大輔 高木
Chikaaki O
新明 王
Akihiko Tashiro
昭彦 田代
Yukio Fukunaga
由紀夫 福永
Akira Fukunaga
明 福永
Tadashi Shimoyama
正 下山
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Ebara Corp
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Ebara Corp
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Priority to JP2004050407A priority Critical patent/JP2005243845A/ja
Publication of JP2005243845A publication Critical patent/JP2005243845A/ja
Publication of JP2005243845A5 publication Critical patent/JP2005243845A5/ja
Pending legal-status Critical Current

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  • Chemically Coating (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004050407A 2004-02-25 2004-02-25 基板処理方法及び基板処理装置 Pending JP2005243845A (ja)

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JP2004050407A JP2005243845A (ja) 2004-02-25 2004-02-25 基板処理方法及び基板処理装置

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JP2004050407A JP2005243845A (ja) 2004-02-25 2004-02-25 基板処理方法及び基板処理装置

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JP2005243845A true JP2005243845A (ja) 2005-09-08
JP2005243845A5 JP2005243845A5 (enExample) 2007-04-12

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JP2004050407A Pending JP2005243845A (ja) 2004-02-25 2004-02-25 基板処理方法及び基板処理装置

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250915A (ja) * 2006-03-16 2007-09-27 Ebara Corp 基板処理方法および基板処理装置
JP2008038215A (ja) * 2006-08-08 2008-02-21 Ebara Corp 基板処理方法及び基板処理装置
JP2009533552A (ja) * 2006-04-12 2009-09-17 チバ ホールディング インコーポレーテッド 金属被覆粒子の処理方法
US9721915B2 (en) 2014-04-16 2017-08-01 Mitsubishi Electric Corporation Semiconductor device
WO2025142557A1 (ja) * 2023-12-27 2025-07-03 東京エレクトロン株式会社 基板処理方法および基板処理システム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250915A (ja) * 2006-03-16 2007-09-27 Ebara Corp 基板処理方法および基板処理装置
JP2009533552A (ja) * 2006-04-12 2009-09-17 チバ ホールディング インコーポレーテッド 金属被覆粒子の処理方法
JP2008038215A (ja) * 2006-08-08 2008-02-21 Ebara Corp 基板処理方法及び基板処理装置
US9721915B2 (en) 2014-04-16 2017-08-01 Mitsubishi Electric Corporation Semiconductor device
WO2025142557A1 (ja) * 2023-12-27 2025-07-03 東京エレクトロン株式会社 基板処理方法および基板処理システム

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