JP2005536579A5 - - Google Patents

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Publication number
JP2005536579A5
JP2005536579A5 JP2004514799A JP2004514799A JP2005536579A5 JP 2005536579 A5 JP2005536579 A5 JP 2005536579A5 JP 2004514799 A JP2004514799 A JP 2004514799A JP 2004514799 A JP2004514799 A JP 2004514799A JP 2005536579 A5 JP2005536579 A5 JP 2005536579A5
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JP
Japan
Prior art keywords
metal
component
polymer
necessary
formula
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Application number
JP2004514799A
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English (en)
Japanese (ja)
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JP2005536579A (ja
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Priority claimed from DE2002127362 external-priority patent/DE10227362A1/de
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Publication of JP2005536579A publication Critical patent/JP2005536579A/ja
Publication of JP2005536579A5 publication Critical patent/JP2005536579A5/ja
Withdrawn legal-status Critical Current

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JP2004514799A 2002-06-19 2003-06-18 金属表面及びプラスチック表面の処理用錯生成剤 Withdrawn JP2005536579A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002127362 DE10227362A1 (de) 2002-06-19 2002-06-19 Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen
PCT/EP2003/006491 WO2004001099A2 (de) 2002-06-19 2003-06-18 Komplexbildner für die behandlung von metall- und kunststoffoberflächen

Publications (2)

Publication Number Publication Date
JP2005536579A JP2005536579A (ja) 2005-12-02
JP2005536579A5 true JP2005536579A5 (https=) 2006-08-03

Family

ID=29719255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004514799A Withdrawn JP2005536579A (ja) 2002-06-19 2003-06-18 金属表面及びプラスチック表面の処理用錯生成剤

Country Status (7)

Country Link
US (1) US20050209117A1 (https=)
EP (1) EP1525247A2 (https=)
JP (1) JP2005536579A (https=)
AU (1) AU2003246562A1 (https=)
CA (1) CA2489916A1 (https=)
DE (1) DE10227362A1 (https=)
WO (1) WO2004001099A2 (https=)

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US9536731B2 (en) * 2013-10-25 2017-01-03 International Business Machines Corporation Wet clean process for removing CxHyFz etch residue
KR102115548B1 (ko) * 2013-12-16 2020-05-26 삼성전자주식회사 유기물 세정 조성물 및 이를 이용하는 반도체 장치의 제조 방법
EP3130458B1 (en) * 2014-03-18 2019-07-17 Kuraray Co., Ltd. Electronic device
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US20160355939A1 (en) * 2015-06-05 2016-12-08 Lam Research Corporation Polarization stabilizer additive for electroplating
DE102016210289A1 (de) * 2016-06-10 2017-12-14 Henkel Ag & Co. Kgaa Verfahren zur reinigenden Vorbehandlung von durch Schweißen zusammengefügten eisenhaltigen Bauteilen
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JP2022533004A (ja) 2019-04-29 2022-07-21 エコラボ ユーエスエー インコーポレイティド 酸素化芳香族アミンおよび酸化防止剤としての使用
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DE102019119472A1 (de) * 2019-07-18 2021-01-21 voestalpine eifeler Coating GmbH Verfahren zum entschichten von werkstücken
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CN112457517B (zh) * 2020-11-20 2022-09-30 山西凝固力新型材料股份有限公司 一种用于酚醛树脂泡沫填充材料的酸固化剂及其制备方法
US20230203695A1 (en) * 2021-12-29 2023-06-29 Basf Se Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent
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