FR2899600B1 - Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface - Google Patents

Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface

Info

Publication number
FR2899600B1
FR2899600B1 FR0603016A FR0603016A FR2899600B1 FR 2899600 B1 FR2899600 B1 FR 2899600B1 FR 0603016 A FR0603016 A FR 0603016A FR 0603016 A FR0603016 A FR 0603016A FR 2899600 B1 FR2899600 B1 FR 2899600B1
Authority
FR
France
Prior art keywords
conditional
inhibitors
copper
electrolytic deposition
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0603016A
Other languages
English (en)
Other versions
FR2899600A1 (fr
Inventor
Daniel Michelet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TECHNOLOGIES MOLECULAIRES TECM
Original Assignee
TECHNOLOGIES MOLECULAIRES TECM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TECHNOLOGIES MOLECULAIRES TECM filed Critical TECHNOLOGIES MOLECULAIRES TECM
Priority to FR0603016A priority Critical patent/FR2899600B1/fr
Priority to JP2009503610A priority patent/JP2009533548A/ja
Priority to EP07731237A priority patent/EP2007930A1/fr
Priority to PCT/FR2007/000559 priority patent/WO2007118985A1/fr
Priority to US12/294,947 priority patent/US20100243467A1/en
Priority to CNA2007800162790A priority patent/CN101437983A/zh
Publication of FR2899600A1 publication Critical patent/FR2899600A1/fr
Application granted granted Critical
Publication of FR2899600B1 publication Critical patent/FR2899600B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
FR0603016A 2006-04-06 2006-04-06 Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface Expired - Fee Related FR2899600B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR0603016A FR2899600B1 (fr) 2006-04-06 2006-04-06 Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface
JP2009503610A JP2009533548A (ja) 2006-04-06 2007-04-02 表面上の銅電着用界面活性条件抑制剤
EP07731237A EP2007930A1 (fr) 2006-04-06 2007-04-02 Inhibiteurs conditionnels tensioactifs pour le dépot electrolytique du cuivre sur une surface
PCT/FR2007/000559 WO2007118985A1 (fr) 2006-04-06 2007-04-02 Inhibiteurs conditionnels tensioactifs pour le dépot electrolytique du cuivre sur une surface
US12/294,947 US20100243467A1 (en) 2006-04-06 2007-04-02 Surface-active conditional inhibitors for the electroplating of copper on a surface
CNA2007800162790A CN101437983A (zh) 2006-04-06 2007-04-02 用于将铜电沉积在表面上的表面活性的条件性抑制剂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0603016A FR2899600B1 (fr) 2006-04-06 2006-04-06 Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface

Publications (2)

Publication Number Publication Date
FR2899600A1 FR2899600A1 (fr) 2007-10-12
FR2899600B1 true FR2899600B1 (fr) 2008-08-08

Family

ID=37898477

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0603016A Expired - Fee Related FR2899600B1 (fr) 2006-04-06 2006-04-06 Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface

Country Status (6)

Country Link
US (1) US20100243467A1 (fr)
EP (1) EP2007930A1 (fr)
JP (1) JP2009533548A (fr)
CN (1) CN101437983A (fr)
FR (1) FR2899600B1 (fr)
WO (1) WO2007118985A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103270064B (zh) * 2010-12-21 2016-12-07 巴斯夫欧洲公司 包含流平剂的金属电镀用组合物
EP2468927A1 (fr) * 2010-12-21 2012-06-27 Basf Se Composition pour dépôt électrique métallique comportant un agent de nivellement
KR102426521B1 (ko) * 2015-04-20 2022-07-27 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 전해 구리 도금 배쓰 조성물 및 그 사용 방법
JP2022059731A (ja) * 2020-10-02 2022-04-14 メルテックス株式会社 バレルめっき用スズめっき液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE962489C (de) * 1954-02-10 1957-04-25 Dehydag Gmbh Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
DE2025538A1 (de) * 1970-04-02 1971-10-21 Lokomotivbau Elektrotech Verfahren zur galvanischen Glanzverkupferung aus sauren Elektrolyten
US4169772A (en) * 1978-11-06 1979-10-02 R. O. Hull & Company, Inc. Acid zinc plating baths, compositions useful therein, and methods for electrodepositing bright zinc deposits
US20030196901A1 (en) * 2002-04-23 2003-10-23 Applied Materials, Inc. Method for plating metal onto wafers
DE10227362A1 (de) * 2002-06-19 2004-01-08 Basf Ag Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen

Also Published As

Publication number Publication date
CN101437983A (zh) 2009-05-20
JP2009533548A (ja) 2009-09-17
WO2007118985A1 (fr) 2007-10-25
EP2007930A1 (fr) 2008-12-31
FR2899600A1 (fr) 2007-10-12
US20100243467A1 (en) 2010-09-30

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20131231