WO2004001099A3 - Komplexbildner für die behandlung von metall- und kunststoffoberflächen - Google Patents
Komplexbildner für die behandlung von metall- und kunststoffoberflächen Download PDFInfo
- Publication number
- WO2004001099A3 WO2004001099A3 PCT/EP2003/006491 EP0306491W WO2004001099A3 WO 2004001099 A3 WO2004001099 A3 WO 2004001099A3 EP 0306491 W EP0306491 W EP 0306491W WO 2004001099 A3 WO2004001099 A3 WO 2004001099A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- constituent
- acid
- metals
- metal
- polymer
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0233—Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA 2489916 CA2489916A1 (en) | 2002-06-19 | 2003-06-18 | Complexing agent for treating metallic and plastic surfaces |
AU2003246562A AU2003246562A1 (en) | 2002-06-19 | 2003-06-18 | Complexing agent for treating metallic and plastic surfaces |
EP03760658A EP1525247A2 (de) | 2002-06-19 | 2003-06-18 | Komplexbildner f r die behandlung von metall- und kunststoff oberfl chen |
JP2004514799A JP2005536579A (ja) | 2002-06-19 | 2003-06-18 | 金属表面及びプラスチック表面の処理用錯生成剤 |
US10/518,447 US20050209117A1 (en) | 2002-06-19 | 2003-06-18 | Complexing agent for treating metallic and plastic surfaces |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10227362.6 | 2002-06-19 | ||
DE2002127362 DE10227362A1 (de) | 2002-06-19 | 2002-06-19 | Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004001099A2 WO2004001099A2 (de) | 2003-12-31 |
WO2004001099A3 true WO2004001099A3 (de) | 2004-11-11 |
Family
ID=29719255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/006491 WO2004001099A2 (de) | 2002-06-19 | 2003-06-18 | Komplexbildner für die behandlung von metall- und kunststoffoberflächen |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050209117A1 (de) |
EP (1) | EP1525247A2 (de) |
JP (1) | JP2005536579A (de) |
AU (1) | AU2003246562A1 (de) |
CA (1) | CA2489916A1 (de) |
DE (1) | DE10227362A1 (de) |
WO (1) | WO2004001099A2 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004003784B4 (de) * | 2004-01-23 | 2011-01-13 | Ormecon Gmbh | Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung |
KR100795364B1 (ko) * | 2004-02-10 | 2008-01-17 | 삼성전자주식회사 | 반도체 기판용 세정액 조성물, 이를 이용한 세정 방법 및도전성 구조물의 제조 방법 |
DE102004030388A1 (de) * | 2004-06-23 | 2006-01-26 | Ormecon Gmbh | Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung |
DE102004044605A1 (de) * | 2004-09-13 | 2006-03-30 | Basf Ag | Verwendung von Polymeren zur Modifizierung von Oberflächen in Reinigeranwendungen |
US7972533B2 (en) * | 2006-04-04 | 2011-07-05 | United Technologies Corporation | Chromate free waterborne corrosion resistant primer with non-carcinogenic corrosion inhibiting additive |
FR2899600B1 (fr) * | 2006-04-06 | 2008-08-08 | Technologies Moleculaires Tecm | Inhibiteurs conditionnels tensioactifs pour le depot electrolytique du cuivre sur une surface |
US7338585B2 (en) * | 2006-05-17 | 2008-03-04 | Intel Corporation | Electroplating chemistries and methods of forming interconnections |
US20080067077A1 (en) * | 2006-09-04 | 2008-03-20 | Akira Kodera | Electrolytic liquid for electrolytic polishing and electrolytic polishing method |
ATE546032T1 (de) | 2006-09-13 | 2012-03-15 | Enthone | Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür |
EP2083067A1 (de) * | 2008-01-25 | 2009-07-29 | Basf Aktiengesellschaft | Verwendung von organischen Komplexbildnern und/oder polymeren carbonsäuregruppenhaltigen Verbindungen in einer flüssigen Wasch- oder Reinigungsmittelzusammensetzung |
WO2009108922A1 (en) * | 2008-02-28 | 2009-09-03 | Aeromet Technologies, Inc. | Methods for removing precious metal-containing coatings and recovery of precious metals therefrom |
CN102356185B (zh) * | 2009-01-16 | 2014-03-26 | 雅培血管企业有限公司 | 用于电抛光金属支架的方法、设备和溶液 |
US8647496B2 (en) | 2009-01-16 | 2014-02-11 | Abbott Laboratories Vascular Enterprises Limited | Method, apparatus, and electrolytic solution for electropolishing metallic stents |
CN102356184B (zh) * | 2009-01-16 | 2014-09-24 | 雅培血管企业有限公司 | 对高强度医疗合金制成的支架进行电抛光的方法和溶液 |
KR101829399B1 (ko) * | 2010-03-04 | 2018-03-30 | 삼성전자주식회사 | 감광성 수지 제거제 조성물 및 이를 이용하는 반도체 제조 공정 |
KR101276706B1 (ko) | 2011-03-08 | 2013-06-19 | 한국과학기술원 | 전자부품 패키지용 기판 표면 처리제 및 이를 이용한 접착 및 패키징 방법 |
WO2012127398A1 (en) * | 2011-03-22 | 2012-09-27 | Basf Se | A chemical mechanical polishing (cmp) composition comprising a polymeric polyamine |
DK2728041T3 (en) * | 2012-10-30 | 2017-03-20 | Hydro Aluminium Rolled Prod | Coated aluminum strip and method of manufacture |
TWI471457B (zh) * | 2013-02-22 | 2015-02-01 | Uwin Nanotech Co Ltd | 金屬剝除添加劑、含其之組合物、及使用該組合物以剝除金屬的方法 |
US9536731B2 (en) * | 2013-10-25 | 2017-01-03 | International Business Machines Corporation | Wet clean process for removing CxHyFz etch residue |
KR102115548B1 (ko) * | 2013-12-16 | 2020-05-26 | 삼성전자주식회사 | 유기물 세정 조성물 및 이를 이용하는 반도체 장치의 제조 방법 |
WO2015141225A1 (ja) * | 2014-03-18 | 2015-09-24 | 株式会社クラレ | 多層構造体およびその製造方法、それを用いた包装材および製品、電子デバイスの保護シートならびにコーティング液 |
TWI650389B (zh) * | 2014-03-18 | 2019-02-11 | Kuraray Co., Ltd. | 電子裝置 |
US20160355939A1 (en) * | 2015-06-05 | 2016-12-08 | Lam Research Corporation | Polarization stabilizer additive for electroplating |
DE102016210289A1 (de) * | 2016-06-10 | 2017-12-14 | Henkel Ag & Co. Kgaa | Verfahren zur reinigenden Vorbehandlung von durch Schweißen zusammengefügten eisenhaltigen Bauteilen |
US10731270B2 (en) * | 2017-08-24 | 2020-08-04 | Seagate Technology Llc | Method of removing particles from an electronic component |
US10443135B1 (en) * | 2018-05-11 | 2019-10-15 | Macdermid Enthone Inc. | Near neutral pH pickle on multi-metals |
PL3581684T3 (pl) * | 2018-06-11 | 2021-06-14 | Atotech Deutschland Gmbh | Kwasowa kąpiel galwaniczna cynkowa lub stopu cynkowo-niklowego do osadzania warstwy cynku lub stopu cynkowo-niklowego |
US11866631B2 (en) | 2019-04-29 | 2024-01-09 | Ecolab Usa Inc. | Oxygenated aminophenol compounds and methods for preventing monomer polymerization |
DE102019119472A1 (de) * | 2019-07-18 | 2021-01-21 | voestalpine eifeler Coating GmbH | Verfahren zum entschichten von werkstücken |
CN110735159A (zh) * | 2019-11-07 | 2020-01-31 | 徐州丰华金属材料有限公司 | 一种合金金属材料的电镀配方 |
DE102020119180A1 (de) * | 2020-07-21 | 2022-01-27 | Johann Wolfgang Goethe-Universität | Verfahren zum Entfernen eines Korrosionsprodukts von einer Metalloberfläche |
WO2022055426A1 (en) * | 2020-09-08 | 2022-03-17 | Nanyang Technological University | Surface conditioner for electroless deposition |
CA3196257A1 (en) | 2020-10-21 | 2022-04-28 | Ashish Dhawan | Alkoxylated (hydroxyalkyl)aminophenol polymers and methods of use |
CN112457517B (zh) * | 2020-11-20 | 2022-09-30 | 山西凝固力新型材料股份有限公司 | 一种用于酚醛树脂泡沫填充材料的酸固化剂及其制备方法 |
US20230203695A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent |
WO2024048039A1 (ja) * | 2022-08-31 | 2024-03-07 | 株式会社Jcu | めっき液 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10013828A1 (de) * | 1999-04-01 | 2000-10-05 | Basf Ag | Vorrichtung, aufweisend eine gegen unerwünschte Abscheidung von Polymer geschützte metallische Oberfläche |
EP1260614A1 (de) * | 2001-05-24 | 2002-11-27 | Shipley Co. L.L.C. | Zinn Platierung |
WO2003056061A2 (de) * | 2001-12-27 | 2003-07-10 | Basf Aktiengesellschaft | Derivate von polymeren für die metallbehandlung |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3251778A (en) * | 1960-08-04 | 1966-05-17 | Petrolite Corp | Process of preventing scale |
US3424790A (en) * | 1966-05-11 | 1969-01-28 | Dow Chemical Co | Process for preparing carboxymethylated polyethylenimine and products produced by the same |
US4046748A (en) * | 1976-04-19 | 1977-09-06 | Arizona Chemical Company | Polymers of terpene-maleic anhydride adducts with aliphatic diamines |
SE7709470L (sv) * | 1976-09-01 | 1978-03-02 | Vnii Sintetischeskich Smol | Syramedel och forfarande for framstellning av detsamma |
US4577159A (en) * | 1984-07-27 | 1986-03-18 | Hewlett-Packard Company | Low drift broadband amplifier |
DE3534273A1 (de) * | 1985-09-26 | 1987-04-02 | Basf Ag | Verfahren zur herstellung von vinylamin-einheiten enthaltenden wasserloeslichen copolymerisaten und deren verwendung als nass- und trockenverfestigungsmittel fuer papier |
DE3842820A1 (de) * | 1988-12-20 | 1990-06-28 | Basf Ag | Verfahren zur herstellung von stabilen wasser-in-oel-emulsionen von hydrolysierten polymerisaten von n-vinylamiden und ihre verwendung |
DE19515943A1 (de) * | 1995-05-02 | 1996-11-07 | Basf Ag | Pfropfpolymerisate aus Alkylenoxideinheiten enthaltenden Polymerisaten und ethylenisch ungesättigten Verbindungen, Verfahren zu ihrer Herstellung und ihre Verwendung |
DE19526626A1 (de) * | 1995-07-21 | 1997-01-23 | Basf Ag | Pfropfpolymerisate aus Vinylester- und/oder Vinylalkohol-Einheiten enthaltenden Polymerisaten und ethylenisch ungesättigten Verbindungen, Verfahren zu ihrer Herstellung und ihre Verwendung |
US6284309B1 (en) * | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
US20030104623A1 (en) * | 2001-11-29 | 2003-06-05 | Nippon Shokubai Co., Ltd. | Method of introducing a protein into cells |
-
2002
- 2002-06-19 DE DE2002127362 patent/DE10227362A1/de not_active Withdrawn
-
2003
- 2003-06-18 WO PCT/EP2003/006491 patent/WO2004001099A2/de not_active Application Discontinuation
- 2003-06-18 JP JP2004514799A patent/JP2005536579A/ja not_active Withdrawn
- 2003-06-18 CA CA 2489916 patent/CA2489916A1/en not_active Abandoned
- 2003-06-18 US US10/518,447 patent/US20050209117A1/en not_active Abandoned
- 2003-06-18 AU AU2003246562A patent/AU2003246562A1/en not_active Abandoned
- 2003-06-18 EP EP03760658A patent/EP1525247A2/de not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10013828A1 (de) * | 1999-04-01 | 2000-10-05 | Basf Ag | Vorrichtung, aufweisend eine gegen unerwünschte Abscheidung von Polymer geschützte metallische Oberfläche |
EP1260614A1 (de) * | 2001-05-24 | 2002-11-27 | Shipley Co. L.L.C. | Zinn Platierung |
WO2003056061A2 (de) * | 2001-12-27 | 2003-07-10 | Basf Aktiengesellschaft | Derivate von polymeren für die metallbehandlung |
Also Published As
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US20050209117A1 (en) | 2005-09-22 |
AU2003246562A1 (en) | 2004-01-06 |
CA2489916A1 (en) | 2003-12-31 |
DE10227362A1 (de) | 2004-01-08 |
AU2003246562A8 (en) | 2004-01-06 |
JP2005536579A (ja) | 2005-12-02 |
WO2004001099A2 (de) | 2003-12-31 |
EP1525247A2 (de) | 2005-04-27 |
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