ATE546032T1 - Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür - Google Patents

Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür

Info

Publication number
ATE546032T1
ATE546032T1 AT07801892T AT07801892T ATE546032T1 AT E546032 T1 ATE546032 T1 AT E546032T1 AT 07801892 T AT07801892 T AT 07801892T AT 07801892 T AT07801892 T AT 07801892T AT E546032 T1 ATE546032 T1 AT E546032T1
Authority
AT
Austria
Prior art keywords
precious
conductive polymer
layer
electrically conductive
articles
Prior art date
Application number
AT07801892T
Other languages
English (en)
Inventor
Wessling Bernhard
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE200610043811 external-priority patent/DE102006043811B4/de
Application filed by Enthone filed Critical Enthone
Application granted granted Critical
Publication of ATE546032T1 publication Critical patent/ATE546032T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
AT07801892T 2006-09-13 2007-08-24 Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür ATE546032T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200610043811 DE102006043811B4 (de) 2006-09-13 2006-09-13 Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung
DE102006047501 2006-10-05
PCT/EP2007/007467 WO2008031492A1 (en) 2006-09-13 2007-08-24 Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof

Publications (1)

Publication Number Publication Date
ATE546032T1 true ATE546032T1 (de) 2012-03-15

Family

ID=38799833

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07801892T ATE546032T1 (de) 2006-09-13 2007-08-24 Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür

Country Status (9)

Country Link
US (1) US8153271B2 (de)
EP (1) EP2062467B1 (de)
JP (1) JP5114714B2 (de)
KR (1) KR101422529B1 (de)
AT (1) ATE546032T1 (de)
CA (1) CA2662851A1 (de)
MY (1) MY147793A (de)
TW (1) TWI420994B (de)
WO (1) WO2008031492A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004003784B4 (de) * 2004-01-23 2011-01-13 Ormecon Gmbh Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung
DE102004030388A1 (de) * 2004-06-23 2006-01-26 Ormecon Gmbh Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung
DE102005010162B4 (de) * 2005-03-02 2007-06-14 Ormecon Gmbh Leitfähige Polymere aus Teilchen mit anisotroper Morphologie
DE102005039608A1 (de) * 2005-08-19 2007-03-01 Ormecon Gmbh Zusammensetzung mit intrinsisch leitfähigem Polymer
US8026168B2 (en) 2007-08-15 2011-09-27 Tokyo Electron Limited Semiconductor device containing an aluminum tantalum carbonitride barrier film and method of forming
US7985680B2 (en) 2008-08-25 2011-07-26 Tokyo Electron Limited Method of forming aluminum-doped metal carbonitride gate electrodes
SG175830A1 (en) * 2009-04-08 2011-12-29 Sunsonix Process and apparatus for removal of contaminating material from substrates
DE102012015459A1 (de) 2012-08-07 2014-02-13 BWSI GmbH & Co. KG Chemische Beschichtungsanlage mit turbulenzarmer Strömung
WO2014023745A1 (en) 2012-08-07 2014-02-13 Bwsi Gmbh & Co Kg Chemical coating unit with low-turbulence flow
DE102012017058A1 (de) 2012-08-29 2014-03-06 BWSI GmbH & Co. KG Chemische Beschichtungsanlagen mit turbulenzarmer Strömung
DE202015008773U1 (de) 2015-12-22 2016-01-28 Continental Automotive Gmbh Steckkontakt mit organischer Beschichtung und Leiterplattenanordnung
CN105543766B (zh) * 2016-01-07 2019-02-26 山东省特种设备检验研究院泰安分院 NiTi合金复合涂层及其制备方法
CN112992425B (zh) * 2021-02-24 2022-08-30 烟台万隆真空冶金股份有限公司 一种梯度结构铜基复合电接触材料的制备方法
CN114025474B (zh) * 2021-11-22 2022-07-19 百强电子（深圳）有限公司 印刷电路板及其制造方法

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977756A (en) * 1975-09-22 1976-08-31 General Motors Corporation Transitional connector for printed circuits
US4394498A (en) * 1981-08-24 1983-07-19 Celanese Corporation Method for providing particulates of liquid crystal polymers and particulates produced therefrom
AT378008B (de) 1982-09-07 1985-06-10 Neumayer Karl Gmbh Verfahren zur herstellung von mit einer zinnlegierung ueberzogenen draehten
US4585695A (en) * 1983-10-11 1986-04-29 Agency Of Industrial Science And Technology Electrically conductive polypyrrole article
DE3440617C1 (de) * 1984-11-07 1986-06-26 Zipperling Kessler & Co (Gmbh & Co), 2070 Ahrensburg Antistatische bzw. elektrisch halbleitende thermoplastische Polymerblends,Verfahren zu deren Herstellung und deren Verwendung
US4657632A (en) * 1985-08-29 1987-04-14 Techno Instruments Investments 1983 Ltd. Use of immersion tin coating as etch resist
US5104599A (en) * 1987-03-05 1992-04-14 Allied-Signal Inc. Method of forming short fibers composed of anisotropic polymers
DE3729566A1 (de) 1987-09-04 1989-03-16 Zipperling Kessler & Co Intrinsisch leitfaehiges polymer in form eines dispergierbaren feststoffes, dessen herstellung und dessen verwendung
CA1339210C (en) * 1988-05-31 1997-08-05 John Lewicki Recombinant techniques for production of novel natriuretic and vasodilator peptides
DE58909810D1 (de) 1988-10-11 1997-09-04 Zipperling Kessler & Co Verfahren zur herstellung dünner schichten aus leitfähigen polymeren
US5498761A (en) * 1988-10-11 1996-03-12 Wessling; Bernhard Process for producing thin layers of conductive polymers
US4959180A (en) * 1989-02-03 1990-09-25 The United States Of America As Represented By The United States Department Of Energy Colloidal polyaniline
WO1991011266A1 (en) 1990-02-05 1991-08-08 Vsesojuzny Nauchno-Issledovatelsky Instrumentalny Institut Liquid pulverizer
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
US5192835A (en) * 1990-10-09 1993-03-09 Eastman Kodak Company Bonding of solid state device to terminal board
US5278213A (en) * 1991-04-22 1994-01-11 Allied Signal Inc. Method of processing neutral polyanilines in solvent and solvent mixtures
US5281363A (en) * 1991-04-22 1994-01-25 Allied-Signal Inc. Polyaniline compositions having a surface/core dopant arrangement
DE4238765A1 (de) 1992-11-10 1994-05-11 Stuebing Gmbh Verfahren zur stromlosen Verzinnung von Leiterplatten und deren Verwendung
DE4317010A1 (de) * 1993-05-17 1994-11-24 Zipperling Kessler & Co Dispergierbares intrinsisch leitfähiges Polymer und Verfahren zu dessen Herstellung
WO1995000678A1 (de) 1993-06-25 1995-01-05 Zipperling Kessler & Co (Gmbh & Co) Verfahren zur herstellung korrosionsgeschützter metallischer werkstoffe und damit erhältliche werkstoffe
US5532025A (en) * 1993-07-23 1996-07-02 Kinlen; Patrick J. Corrosion inhibiting compositions
US5403913A (en) * 1993-08-12 1995-04-04 The Trustees Of The University Of Pennsylvania Methods for preparing conductive polyanilines
DE4333127A1 (de) 1993-09-29 1995-03-30 Basf Ag Verfahren zum Schutz von lötfähigen Kupfer- und Kupferlegierungsoberflächen vor Korrosion
US5682043A (en) 1994-06-28 1997-10-28 Uniax Corporation Electrochemical light-emitting devices
US5595689A (en) * 1994-07-21 1997-01-21 Americhem, Inc. Highly conductive polymer blends with intrinsically conductive polymers
US5700398A (en) * 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
US5645890A (en) * 1995-02-14 1997-07-08 The Trustess Of The University Of Pennsylvania Prevention of corrosion with polyaniline
DE19525708C1 (de) 1995-07-14 1997-01-30 Rmh Polymers Gmbh & Co Kg Temporärer Anlaufschutz für Kupfer und Kupferlegierungen
US5846606A (en) * 1995-11-29 1998-12-08 Zipperling Kessler & Co. (Gmbh&Co.) Process for the production of metallized materials
US5733599A (en) 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
US6503382B1 (en) 1997-06-27 2003-01-07 University Of Southampton Method of electrodepositing a porous film
JP4150160B2 (ja) 1997-07-25 2008-09-17 ツィッパーリンク ケスラー ウント コー．（ゲーエムベーハー ウント コー．） 固有導電性ポリマーと金属との化合物
DE19754221A1 (de) * 1997-12-06 1999-06-17 Federal Mogul Wiesbaden Gmbh Schichtverbundwerkstoff für Gleitlager mit bleifreier Gleitschicht
US6015482A (en) * 1997-12-18 2000-01-18 Circuit Research Corp. Printed circuit manufacturing process using tin-nickel plating
US6123995A (en) * 1998-03-06 2000-09-26 Shipley Company, L.L.C. Method of manufacture of multilayer circuit boards
DE19812258A1 (de) 1998-03-20 1999-09-23 Bayer Ag Elektrolumineszierende Anordnungen unter Verwendung von Blendsystemen
DE69913605T2 (de) 1998-06-05 2004-09-23 Teijin Ltd. Antistatische Polyesterfolie und Verfahren zu ihrer Herstellung
JP3937113B2 (ja) 1998-06-05 2007-06-27 日産化学工業株式会社 有機−無機複合導電性ゾル及びその製造法
JP3796381B2 (ja) * 1999-01-26 2006-07-12 株式会社エスアイアイ・マイクロパーツ 電気二重層キャパシタ
US6593399B1 (en) 1999-06-04 2003-07-15 Rohm And Haas Company Preparing conductive polymers in the presence of emulsion latexes
US6821323B1 (en) * 1999-11-12 2004-11-23 Enthone Inc. Process for the non-galvanic tin plating of copper or copper alloys
US6361823B1 (en) * 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
EP1167582B1 (de) * 2000-07-01 2005-09-14 Shipley Company LLC Metall-Legierungs-Zusammensetzungen und damit verbundene Plattierungsmethode
US6730401B2 (en) 2001-03-16 2004-05-04 Eastman Chemical Company Multilayered packaging materials for electrostatic applications
US20020187364A1 (en) * 2001-03-16 2002-12-12 Shipley Company, L.L.C. Tin plating
JP2002289653A (ja) 2001-03-26 2002-10-04 Hitachi Cable Ltd 半導体装置用テープキャリアおよびその製造方法
WO2002080637A1 (en) * 2001-04-02 2002-10-10 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
WO2003009657A1 (en) * 2001-07-19 2003-01-30 Toray Industries, Inc. Circuit board, circuit board-use member and production method therefor and method of laminating fexible film
JP2005502192A (ja) * 2001-08-22 2005-01-20 ワールド プロパティーズ インク． 回路基板の金属への接着を改善する方法及びその方法で製作された物品
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
JP3513709B2 (ja) 2001-10-16 2004-03-31 石原薬品株式会社 前処理によるスズホイスカーの防止方法
TW200302685A (en) * 2002-01-23 2003-08-01 Matsushita Electric Ind Co Ltd Circuit component built-in module and method of manufacturing the same
JP2005526876A (ja) * 2002-03-01 2005-09-08 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 添加剤を含有する有機導電性ポリマーの印刷
JP3940620B2 (ja) 2002-03-22 2007-07-04 ガンツ化成株式会社 非球塊状ポリマー微粒子の製造法
JP3855161B2 (ja) 2002-05-10 2006-12-06 石原薬品株式会社 電子部品のスズホイスカーの防止方法
DE10227362A1 (de) * 2002-06-19 2004-01-08 Basf Ag Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen
DE10234363A1 (de) * 2002-07-27 2004-02-12 Robert Bosch Gmbh Korrosionsschutzlack für metallische Oberflächen
ATE404609T1 (de) 2002-09-24 2008-08-15 Du Pont Wasserdispergierbare polythiophene hergestellt unter verwendung von kolloiden auf basis von polymersäuren
TWI302563B (en) * 2002-09-24 2008-11-01 Du Pont Electrically conducting organic polymer/nanoparticle composites and methods for use thereof
WO2004029133A1 (en) 2002-09-24 2004-04-08 E.I. Du Pont De Nemours And Company Water dispersible polyanilines made with polymeric acid colloids for electronics applications
US6962642B2 (en) * 2002-09-26 2005-11-08 International Business Machines Corporation Treating copper surfaces for electronic applications
AU2003297783A1 (en) * 2002-12-27 2004-07-29 Foamex L.P. Gas diffusion layer containing inherently conductive polymer for fuel cells
JP4603812B2 (ja) 2003-05-12 2010-12-22 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 改良されたスズめっき方法
AT412094B (de) * 2003-05-13 2004-09-27 Austria Tech & System Tech Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
DE102004003784B4 (de) * 2004-01-23 2011-01-13 Ormecon Gmbh Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung
JP5245188B2 (ja) * 2004-03-03 2013-07-24 日清紡ホールディングス株式会社 楕円球状有機ポリマー粒子およびその製造方法
JP2007529586A (ja) * 2004-03-18 2007-10-25 オルメコン・ゲーエムベーハー コロイド状導電性ポリマーおよび炭素を含む組成物
US20050269555A1 (en) 2004-05-11 2005-12-08 Suck-Hyun Lee Conductive polymers having highly enhanced solubility in organic solvent and electrical conductivity and synthesizing process thereof
DE102004030388A1 (de) * 2004-06-23 2006-01-26 Ormecon Gmbh Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung
DE102004030930A1 (de) * 2004-06-25 2006-02-23 Ormecon Gmbh Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung
US7087441B2 (en) * 2004-10-21 2006-08-08 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having a plurality of solder connection sites thereon
DE102005010162B4 (de) * 2005-03-02 2007-06-14 Ormecon Gmbh Leitfähige Polymere aus Teilchen mit anisotroper Morphologie
DE202005010364U1 (de) * 2005-07-01 2005-09-08 Ormecon Gmbh Zinnbeschichtete flexible Leiterplatten mit geringer Neigung zur Whiskerbildung
DE102005039608A1 (de) * 2005-08-19 2007-03-01 Ormecon Gmbh Zusammensetzung mit intrinsisch leitfähigem Polymer
DE102007040065A1 (de) 2007-08-24 2009-02-26 Ormecon Gmbh Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
EP2062467B1 (de) 2012-02-15
JP5114714B2 (ja) 2013-01-09
WO2008031492A8 (en) 2009-04-23
EP2062467A1 (de) 2009-05-27
WO2008031492A1 (en) 2008-03-20
KR101422529B1 (ko) 2014-07-24
TW200822825A (en) 2008-05-16
JP2010504225A (ja) 2010-02-12
TWI420994B (zh) 2013-12-21
MY147793A (en) 2013-01-31
US8153271B2 (en) 2012-04-10
CA2662851A1 (en) 2008-03-20
US20100012359A1 (en) 2010-01-21
KR20090075683A (ko) 2009-07-08

Similar Documents

Publication Publication Date Title
ATE546032T1 (de) Artikel mit beschichtung aus elektrisch leitendem polymer und edel-/halbedelmetal sowie herstellungsverfahren dafür
TW200616789A (en) Article with a coating of electrically conductive polymer and process for production thereof
TW200607416A (en) Tin-coated printed circuit boards with low tendency to whisker formation
TW200601920A (en) Wiring circuit board and production method thereof
MY164452A (en) Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same
ATE275214T1 (de) Bad und verfahren zur stromlosen plattierung von silber auf metallischen oberflächen
TW200604376A (en) Silver plating in electronics manufacture
TW200620615A (en) A substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same
MY158913A (en) Material for electric contact and method of producing the same
TW200714732A (en) Metal duplex and method
TW200635685A (en) Composite wire for electrical discharge machining
DE60306772D1 (de) Elektrode für gasentwicklung und deren herstellungsverfahren
EP1353539A3 (de) Leiterplattenherstellung
TW200720483A (en) Method for improved adhesion of polymeric materials to copper or copper alloy surfaces
TW200705589A (en) Printed circuit board
MY138109A (en) Electronic part and surface treatment method of the same
TW200638529A (en) Flexible electronic circuit articles and methods of making thereof
PH12016500496A1 (en) Method of selectively treating copper in the presence of further metal
ATE487812T1 (de) Edelmetallhaltige schichtfolge für dekorative artikel
TW200605184A (en) Coated copper, method for inhibiting the occurrence of whisker, printing wiring board, and semiconductor device
EP2495354A4 (de) Plattiertes element aus sn-rückfluss
FR2969899B1 (fr) Circuit imprime a substrat metallique isole
MY143782A (en) Method for coating substrates containing antimony compounds with tin and tin alloys
MY157195A (en) Material comprised of metal and lactic acid condensate and electronic component
TH109355A (th) ชิ้นส่วนที่มีการเคลือบด้วยโพลิเมอร์เชิงความนำไฟฟ้า และโลหะมีค่า/ราคาถูก และกระบวนการสำหรับการผลิตของมัน