JP2005529200A - 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 - Google Patents

照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 Download PDF

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Publication number
JP2005529200A
JP2005529200A JP2004502060A JP2004502060A JP2005529200A JP 2005529200 A JP2005529200 A JP 2005529200A JP 2004502060 A JP2004502060 A JP 2004502060A JP 2004502060 A JP2004502060 A JP 2004502060A JP 2005529200 A JP2005529200 A JP 2005529200A
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Japan
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composition
weight
group
component
ethyl
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Pending
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JP2004502060A
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Japanese (ja)
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JP2005529200A5 (OSRAM
Inventor
ティエス，ジェンス，クリストフ
ディアス，アイリン，ジョルゲ，アンゲロ，アタナシウス
ロウトン，ジョン，アラン
ウィンミル，デイビッド，エル．
シュ，ジゲン
ヨウ，シャオロン
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DSM IP Assets BV
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DSM IP Assets BV
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Publication of JP2005529200A publication Critical patent/JP2005529200A/ja
Publication of JP2005529200A5 publication Critical patent/JP2005529200A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
JP2004502060A 2002-05-03 2003-05-01 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 Pending JP2005529200A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37723902P 2002-05-03 2002-05-03
PCT/NL2003/000320 WO2003093901A1 (en) 2002-05-03 2003-05-01 Radiation curable resin composition and rapid prototyping process using the same

Related Child Applications (1)

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JP2010036379A Division JP5656419B2 (ja) 2002-05-03 2010-02-22 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法

Publications (2)

Publication Number Publication Date
JP2005529200A true JP2005529200A (ja) 2005-09-29
JP2005529200A5 JP2005529200A5 (OSRAM) 2006-09-14

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JP2004502060A Pending JP2005529200A (ja) 2002-05-03 2003-05-01 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法
JP2010036379A Expired - Lifetime JP5656419B2 (ja) 2002-05-03 2010-02-22 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法

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Country Status (8)

Country Link
US (3) US7183040B2 (OSRAM)
EP (2) EP1502155B1 (OSRAM)
JP (2) JP2005529200A (OSRAM)
KR (3) KR20120086737A (OSRAM)
CN (2) CN100576069C (OSRAM)
AU (1) AU2003224516A1 (OSRAM)
ES (1) ES2405107T3 (OSRAM)
WO (1) WO2003093901A1 (OSRAM)

Cited By (9)

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JP2006503154A (ja) * 2002-10-18 2006-01-26 ディーエスエム アイピー アセッツ ビー．ブイ． 硬化性組成物およびそれを用いるラピッドプロトタイピング方法
JP2007513234A (ja) * 2003-12-02 2007-05-24 ディーエスエム アイピー アセッツ ビー．ブイ． 難燃性の放射線硬化性組成物
JP2008533273A (ja) * 2005-03-18 2008-08-21 ペルストルプ スペシヤルテイ ケミカルズ アーベー 紫外線硬化性樹脂組成物
JP2009513764A (ja) * 2005-10-27 2009-04-02 ハンツマン アドバンスト マテリアルズ （スイッツァランド） ゲーエムベーハー アンチモンを含まない光硬化性樹脂組成物及び三次元物品
JP2009173781A (ja) * 2008-01-25 2009-08-06 Cmet Inc 光学的立体造形用樹脂組成物
JP2010520947A (ja) * 2007-03-14 2010-06-17 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー Ａｂｓ様物品を製造するための光硬化性組成物
JP2011509313A (ja) * 2007-11-27 2011-03-24 ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー 高透明性を有する三次元物品を製造するための光硬化型樹脂組成物
JP2013023574A (ja) * 2011-07-21 2013-02-04 Jsr Corp 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
WO2015137504A1 (ja) * 2014-03-14 2015-09-17 コニカミノルタ株式会社 ３ｄ造形用光硬化性組成物および３ｄ造形物の製造方法

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PL2524090T3 (pl) 2010-01-11 2022-06-13 Välinge Innovation AB Pokrycie powierzchni z konstrukcją blokującą
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EP3358101B1 (en) 2013-03-25 2019-11-06 Välinge Innovation AB Floorboards provided with a mechanical locking system and a method to produce such a locking system
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HK1080554A1 (zh) 2006-04-28
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EP2466378A3 (en) 2012-09-05
US7183040B2 (en) 2007-02-27
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AU2003224516A1 (en) 2003-11-17
CN101706639A (zh) 2010-05-12
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EP2466378B1 (en) 2014-01-08
US20080064780A1 (en) 2008-03-13
US20070154840A1 (en) 2007-07-05
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EP1502155A1 (en) 2005-02-02
US20040142274A1 (en) 2004-07-22
KR20110051258A (ko) 2011-05-17
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EP2466378A2 (en) 2012-06-20
KR20050007372A (ko) 2005-01-17

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