JP2005524987A5 - - Google Patents
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- Publication number
- JP2005524987A5 JP2005524987A5 JP2004504268A JP2004504268A JP2005524987A5 JP 2005524987 A5 JP2005524987 A5 JP 2005524987A5 JP 2004504268 A JP2004504268 A JP 2004504268A JP 2004504268 A JP2004504268 A JP 2004504268A JP 2005524987 A5 JP2005524987 A5 JP 2005524987A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor
- insulator
- structure according
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000012212 insulator Substances 0.000 claims 67
- 239000004065 semiconductor Substances 0.000 claims 43
- 238000004519 manufacturing process Methods 0.000 claims 24
- 239000000758 substrate Substances 0.000 claims 11
- 238000000034 method Methods 0.000 claims 9
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims 5
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052732 germanium Inorganic materials 0.000 claims 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- KJXBRHIPHIVJCS-UHFFFAOYSA-N oxo(oxoalumanyloxy)lanthanum Chemical compound O=[Al]O[La]=O KJXBRHIPHIVJCS-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 238000000348 solid-phase epitaxy Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 239000002178 crystalline material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37886802P | 2002-05-07 | 2002-05-07 | |
| US60/378,868 | 2002-05-07 | ||
| US45501803P | 2003-03-12 | 2003-03-12 | |
| US60/455,018 | 2003-03-12 | ||
| PCT/US2003/014314 WO2003096385A2 (en) | 2002-05-07 | 2003-05-07 | Silicon-on-insulator structures and methods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005524987A JP2005524987A (ja) | 2005-08-18 |
| JP2005524987A5 true JP2005524987A5 (enExample) | 2006-06-22 |
| JP4951202B2 JP4951202B2 (ja) | 2012-06-13 |
Family
ID=29423648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004504268A Expired - Lifetime JP4951202B2 (ja) | 2002-05-07 | 2003-05-07 | シリコンオンインシュレータ構造の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7452757B2 (enExample) |
| EP (1) | EP1502285A2 (enExample) |
| JP (1) | JP4951202B2 (enExample) |
| KR (1) | KR101023034B1 (enExample) |
| WO (1) | WO2003096385A2 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7192888B1 (en) * | 2000-08-21 | 2007-03-20 | Micron Technology, Inc. | Low selectivity deposition methods |
| US6921702B2 (en) | 2002-07-30 | 2005-07-26 | Micron Technology Inc. | Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics |
| US7682947B2 (en) * | 2003-03-13 | 2010-03-23 | Asm America, Inc. | Epitaxial semiconductor deposition methods and structures |
| US7238595B2 (en) * | 2003-03-13 | 2007-07-03 | Asm America, Inc. | Epitaxial semiconductor deposition methods and structures |
| KR20060056331A (ko) * | 2003-07-23 | 2006-05-24 | 에이에스엠 아메리카, 인코포레이티드 | 절연체-상-실리콘 구조 및 벌크 기판 상의 SiGe 증착 |
| WO2005013326A2 (en) * | 2003-07-30 | 2005-02-10 | Asm America, Inc. | Epitaxial growth of relaxed silicon germanium layers |
| US7601649B2 (en) | 2004-08-02 | 2009-10-13 | Micron Technology, Inc. | Zirconium-doped tantalum oxide films |
| US7081421B2 (en) | 2004-08-26 | 2006-07-25 | Micron Technology, Inc. | Lanthanide oxide dielectric layer |
| US7235501B2 (en) | 2004-12-13 | 2007-06-26 | Micron Technology, Inc. | Lanthanum hafnium oxide dielectrics |
| US7662729B2 (en) | 2005-04-28 | 2010-02-16 | Micron Technology, Inc. | Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer |
| KR100676201B1 (ko) * | 2005-05-24 | 2007-01-30 | 삼성전자주식회사 | 원자층 적층법을 이용한 반도체 디바이스 제조방법 |
| US7572695B2 (en) | 2005-05-27 | 2009-08-11 | Micron Technology, Inc. | Hafnium titanium oxide films |
| JP2006344865A (ja) * | 2005-06-10 | 2006-12-21 | Toyoko Kagaku Co Ltd | Soi基板及び該基板の製造方法 |
| US7972974B2 (en) | 2006-01-10 | 2011-07-05 | Micron Technology, Inc. | Gallium lanthanide oxide films |
| US7901968B2 (en) * | 2006-03-23 | 2011-03-08 | Asm America, Inc. | Heteroepitaxial deposition over an oxidized surface |
| KR100774818B1 (ko) * | 2006-08-22 | 2007-11-07 | 동부일렉트로닉스 주식회사 | Soi기판 |
| EP1975988B1 (en) * | 2007-03-28 | 2015-02-25 | Siltronic AG | Multilayered semiconductor wafer and process for its production |
| JP5496540B2 (ja) * | 2008-04-24 | 2014-05-21 | 株式会社半導体エネルギー研究所 | 半導体基板の作製方法 |
| US8765508B2 (en) | 2008-08-27 | 2014-07-01 | Soitec | Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters |
| WO2011061580A1 (en) | 2009-11-18 | 2011-05-26 | S.O.I.Tec Silicon On Insulator Technologies | Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods |
| US8592294B2 (en) | 2010-02-22 | 2013-11-26 | Asm International N.V. | High temperature atomic layer deposition of dielectric oxides |
| US9608119B2 (en) | 2010-03-02 | 2017-03-28 | Micron Technology, Inc. | Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures |
| US8507966B2 (en) | 2010-03-02 | 2013-08-13 | Micron Technology, Inc. | Semiconductor cells, arrays, devices and systems having a buried conductive line and methods for forming the same |
| US9646869B2 (en) | 2010-03-02 | 2017-05-09 | Micron Technology, Inc. | Semiconductor devices including a diode structure over a conductive strap and methods of forming such semiconductor devices |
| US8288795B2 (en) | 2010-03-02 | 2012-10-16 | Micron Technology, Inc. | Thyristor based memory cells, devices and systems including the same and methods for forming the same |
| DE102010035489A1 (de) * | 2010-08-26 | 2012-03-01 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelement |
| US9023721B2 (en) | 2010-11-23 | 2015-05-05 | Soitec | Methods of forming bulk III-nitride materials on metal-nitride growth template layers, and structures formed by such methods |
| FR2968830B1 (fr) | 2010-12-08 | 2014-03-21 | Soitec Silicon On Insulator | Couches matricielles ameliorees pour le depot heteroepitaxial de materiaux semiconducteurs de nitrure iii en utilisant des procedes hvpe |
| FR2968678B1 (fr) | 2010-12-08 | 2015-11-20 | Soitec Silicon On Insulator | Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés |
| US8753942B2 (en) | 2010-12-01 | 2014-06-17 | Intel Corporation | Silicon and silicon germanium nanowire structures |
| US8952418B2 (en) | 2011-03-01 | 2015-02-10 | Micron Technology, Inc. | Gated bipolar junction transistors |
| US8519431B2 (en) | 2011-03-08 | 2013-08-27 | Micron Technology, Inc. | Thyristors |
| JP5802436B2 (ja) * | 2011-05-30 | 2015-10-28 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
| US9105469B2 (en) | 2011-06-30 | 2015-08-11 | Piquant Research Llc | Defect mitigation structures for semiconductor devices |
| US9127345B2 (en) | 2012-03-06 | 2015-09-08 | Asm America, Inc. | Methods for depositing an epitaxial silicon germanium layer having a germanium to silicon ratio greater than 1:1 using silylgermane and a diluent |
| US9171715B2 (en) | 2012-09-05 | 2015-10-27 | Asm Ip Holding B.V. | Atomic layer deposition of GeO2 |
| CN102916039B (zh) * | 2012-10-19 | 2016-01-20 | 清华大学 | 具有氧化铍的半导体结构 |
| US9218963B2 (en) | 2013-12-19 | 2015-12-22 | Asm Ip Holding B.V. | Cyclical deposition of germanium |
| WO2017019096A1 (en) * | 2015-07-30 | 2017-02-02 | Halliburton Energy Services, Inc. | Integrated computational elements incorporating a stress relief layer |
| KR102514785B1 (ko) * | 2017-05-19 | 2023-03-29 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양 전지 및 이의 제조 방법 |
| US12006570B2 (en) * | 2017-08-31 | 2024-06-11 | Uchicago Argonne, Llc | Atomic layer deposition for continuous, high-speed thin films |
| KR102871969B1 (ko) | 2024-05-14 | 2025-10-15 | 연세대학교 산학협력단 | 결정성 채널층을 포함하는 반도체 소자 및 이의 제조방법 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4199773A (en) * | 1978-08-29 | 1980-04-22 | Rca Corporation | Insulated gate field effect silicon-on-sapphire transistor and method of making same |
| JPS60202952A (ja) * | 1984-03-28 | 1985-10-14 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0618174B2 (ja) * | 1986-07-08 | 1994-03-09 | シャープ株式会社 | 半導体基板 |
| JPS63305529A (ja) * | 1987-06-05 | 1988-12-13 | Nippon Telegr & Teleph Corp <Ntt> | 基板およびその製造方法 |
| JPS6436046A (en) * | 1987-07-31 | 1989-02-07 | Seiko Epson Corp | Manufacture of semiconductor device |
| US4935382A (en) * | 1987-10-30 | 1990-06-19 | American Telephone And Telegraph Company | Method of making a semiconductor-insulator-semiconductor structure |
| US5256550A (en) * | 1988-11-29 | 1993-10-26 | Hewlett-Packard Company | Fabricating a semiconductor device with strained Si1-x Gex layer |
| US5310696A (en) * | 1989-06-16 | 1994-05-10 | Massachusetts Institute Of Technology | Chemical method for the modification of a substrate surface to accomplish heteroepitaxial crystal growth |
| JPH03109299A (ja) * | 1989-09-22 | 1991-05-09 | Nippon Telegr & Teleph Corp <Ntt> | 多結晶シリコン膜の形成方法 |
| US5164359A (en) * | 1990-04-20 | 1992-11-17 | Eaton Corporation | Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate |
| EP0568064B1 (en) * | 1992-05-01 | 1999-07-14 | Texas Instruments Incorporated | Pb/Bi-containing high-dielectric constant oxides using a non-Pb/Bi-containing perovskite as a buffer layer |
| US5478653A (en) * | 1994-04-04 | 1995-12-26 | Guenzer; Charles S. | Bismuth titanate as a template layer for growth of crystallographically oriented silicon |
| JPH10144607A (ja) * | 1996-11-13 | 1998-05-29 | Hitachi Ltd | 半導体基板およびその製造方法ならびにそれを用いた半導体装置およびその製造方法 |
| JPH10265948A (ja) * | 1997-03-25 | 1998-10-06 | Rohm Co Ltd | 半導体装置用基板およびその製法 |
| CA2232796C (en) * | 1997-03-26 | 2002-01-22 | Canon Kabushiki Kaisha | Thin film forming process |
| JPH11233440A (ja) * | 1998-02-13 | 1999-08-27 | Toshiba Corp | 半導体装置 |
| JP4439020B2 (ja) * | 1998-03-26 | 2010-03-24 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
| US6346732B1 (en) * | 1999-05-14 | 2002-02-12 | Kabushiki Kaisha Toshiba | Semiconductor device with oxide mediated epitaxial layer |
| JP2001102555A (ja) * | 1999-09-30 | 2001-04-13 | Seiko Epson Corp | 半導体装置、薄膜トランジスタ及びそれらの製造方法 |
| US6437375B1 (en) * | 2000-06-05 | 2002-08-20 | Micron Technology, Inc. | PD-SOI substrate with suppressed floating body effect and method for its fabrication |
| US6583034B2 (en) * | 2000-11-22 | 2003-06-24 | Motorola, Inc. | Semiconductor structure including a compliant substrate having a graded monocrystalline layer and methods for fabricating the structure and semiconductor devices including the structure |
| US6933566B2 (en) * | 2001-07-05 | 2005-08-23 | International Business Machines Corporation | Method of forming lattice-matched structure on silicon and structure formed thereby |
| US6693298B2 (en) * | 2001-07-20 | 2004-02-17 | Motorola, Inc. | Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same |
| US6515335B1 (en) * | 2002-01-04 | 2003-02-04 | International Business Machines Corporation | Method for fabrication of relaxed SiGe buffer layers on silicon-on-insulators and structures containing the same |
-
2003
- 2003-05-07 US US10/434,423 patent/US7452757B2/en not_active Expired - Lifetime
- 2003-05-07 WO PCT/US2003/014314 patent/WO2003096385A2/en not_active Ceased
- 2003-05-07 EP EP03728753A patent/EP1502285A2/en not_active Withdrawn
- 2003-05-07 KR KR1020047017791A patent/KR101023034B1/ko not_active Expired - Lifetime
- 2003-05-07 JP JP2004504268A patent/JP4951202B2/ja not_active Expired - Lifetime
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