JP2005520339A - ウエハレベルのコーティングされた銅スタッドバンプ - Google Patents
ウエハレベルのコーティングされた銅スタッドバンプ Download PDFInfo
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- JP2005520339A JP2005520339A JP2003577307A JP2003577307A JP2005520339A JP 2005520339 A JP2005520339 A JP 2005520339A JP 2003577307 A JP2003577307 A JP 2003577307A JP 2003577307 A JP2003577307 A JP 2003577307A JP 2005520339 A JP2005520339 A JP 2005520339A
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- Prior art keywords
- bump
- semiconductor die
- copper
- semiconductor
- resistant layer
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 112
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 112
- 239000010949 copper Substances 0.000 title claims abstract description 112
- 239000004065 semiconductor Substances 0.000 claims abstract description 102
- 238000000034 method Methods 0.000 claims abstract description 56
- 238000007747 plating Methods 0.000 claims abstract description 8
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 6
- 230000003647 oxidation Effects 0.000 claims description 37
- 238000007254 oxidation reaction Methods 0.000 claims description 37
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 230000005669 field effect Effects 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 229910001020 Au alloy Inorganic materials 0.000 claims 1
- 239000003353 gold alloy Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 61
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000000637 aluminium metallisation Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
Description
22 銅バンプ
24 密着層
26 耐酸化層
30 コーティングされた銅バンプ
40 回路基板
100 バンプ半導体ダイ
Claims (17)
- (a)複数の銅バンプを半導体デバイスからなる半導体ダイ上にめっきプロセスを用いて形成する工程と、
(b)密着層を前記複数の銅バンプの各銅バンプ上に形成する工程と、
(c)耐酸化層を前記複数の銅バンプの各銅バンプ上に形成する工程と、からなる方法であって、
前記密着層が前記耐酸化層と前記銅バンプとの間にあることを特徴とする方法。 - 前記半導体デバイスはパワーMOSFET (金属酸化物半導体電界効果トランジスタ)であることを特徴とする請求項1記載の方法。
- 前記耐酸化層及び前記密着層は各銅バンプの頂面及び側面をコーティングすることを特徴とする請求項1記載の方法。
- 各銅バンプは厚みが約25ミクロンより厚いことを特徴とする請求項1記載の方法。
- 前記半導体ダイは半導体ウエハに存在し、前記方法が更に前記半導体ウエハをダイスカットして個々の半導体ダイを形成する工程を含むことを特徴とする請求項1記載の方法。
- 前記方法が更に(c)工程の後に前記半導体ダイをパッケージングする工程を含むことを特徴とする請求項1記載の方法。
- 前記耐酸化層は貴金属からなることを特徴とする請求項1記載の方法。
- 前記耐酸化層は貴金属からなり、前記貴金属は金若しくは金合金からなることを特徴とする請求項1記載の方法。
- (a)複数の銅バンプを半導体デバイスからなる半導体ダイ上にめっきプロセスを用いて形成する工程と、
(b)ニッケルからなる密着層を前記複数の銅バンプの各銅バンプ上に形成する工程と、
(c)コーティングされた銅バンプを形成すべく前記密着層が耐酸化層と前記銅バンプとの間に存在するように、金からなる前記耐酸化層を前記複数の銅バンプの各銅バンプ上に形成する工程と、
(d)前記コーティングされた銅バンプを回路基板の導電性領域にはんだを用いて接合する工程と、からなることを特徴とする方法。 - 前記半導体デバイスは縦型パワーMOSFETからなることを特徴とする請求項9記載の方法。
- バンプ半導体ダイであって、
(a)半導体デバイスからなる半導体ダイと、
(b)前記半導体ダイ上にあって、頂面を有するめっきした銅バンプと、
(c)前記めっきした銅バンプの少なくとも前記頂面上の密着層と、
(d)前記密着層上の耐酸化層と、
からなることを特徴とする半導体ダイ。 - 前記半導体デバイスはパワーMOSFET(金属酸化物電界効果トランジスタ)であることを特徴とする請求項11記載のバンプ半導体ダイ。
- 前記めっきした銅バンプは電気めっきされていることを特徴とする請求項11記載のバンプ半導体ダイ。
- 前記密着層はニッケルからなり、前記耐酸化層は金からなることを特徴とする請求項11記載のバンプ半導体ダイ。
- 前記耐酸化層は貴金属からなることを特徴とする請求項11記載のバンプ半導体ダイ。
- 前記半導体ダイは前記半導体ダイの一方側にソース領域及びゲート領域を有し、前記半導体ダイの反対側にドレイン領域を有することを特徴とする請求項11記載のバンプ半導体ダイ。
- 請求項11記載の前記バンプ半導体ダイを有することを特徴とする半導体ダイパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36378902P | 2002-03-12 | 2002-03-12 | |
PCT/US2003/007421 WO2003079407A2 (en) | 2002-03-12 | 2003-03-10 | Wafer-level coated copper stud bumps |
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Publication Number | Publication Date |
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JP2005520339A true JP2005520339A (ja) | 2005-07-07 |
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ID=28041811
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Application Number | Title | Priority Date | Filing Date |
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JP2003577307A Pending JP2005520339A (ja) | 2002-03-12 | 2003-03-10 | ウエハレベルのコーティングされた銅スタッドバンプ |
Country Status (8)
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US (1) | US6731003B2 (ja) |
JP (1) | JP2005520339A (ja) |
KR (1) | KR20040111395A (ja) |
CN (1) | CN100474539C (ja) |
AU (1) | AU2003218085A1 (ja) |
DE (1) | DE10392377T5 (ja) |
TW (1) | TWI258822B (ja) |
WO (1) | WO2003079407A2 (ja) |
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2003
- 2003-03-10 KR KR10-2004-7014230A patent/KR20040111395A/ko not_active Application Discontinuation
- 2003-03-10 JP JP2003577307A patent/JP2005520339A/ja active Pending
- 2003-03-10 WO PCT/US2003/007421 patent/WO2003079407A2/en active Application Filing
- 2003-03-10 DE DE10392377T patent/DE10392377T5/de not_active Withdrawn
- 2003-03-10 CN CNB038106442A patent/CN100474539C/zh not_active Expired - Fee Related
- 2003-03-10 AU AU2003218085A patent/AU2003218085A1/en not_active Abandoned
- 2003-03-11 US US10/386,621 patent/US6731003B2/en not_active Expired - Fee Related
- 2003-03-11 TW TW092105254A patent/TWI258822B/zh not_active IP Right Cessation
Cited By (3)
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JP2013042005A (ja) * | 2011-08-17 | 2013-02-28 | Sony Corp | 半導体装置、半導体装置の製造方法、及び、電子機器 |
JP2020077694A (ja) * | 2018-11-06 | 2020-05-21 | ローム株式会社 | 半導体装置 |
JP7231382B2 (ja) | 2018-11-06 | 2023-03-01 | ローム株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
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CN1653603A (zh) | 2005-08-10 |
KR20040111395A (ko) | 2004-12-31 |
TW200306631A (en) | 2003-11-16 |
US20030173684A1 (en) | 2003-09-18 |
AU2003218085A8 (en) | 2003-09-29 |
WO2003079407A2 (en) | 2003-09-25 |
US6731003B2 (en) | 2004-05-04 |
AU2003218085A1 (en) | 2003-09-29 |
WO2003079407A3 (en) | 2004-07-01 |
CN100474539C (zh) | 2009-04-01 |
TWI258822B (en) | 2006-07-21 |
DE10392377T5 (de) | 2005-05-12 |
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