JP2005518127A5 - - Google Patents
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- Publication number
- JP2005518127A5 JP2005518127A5 JP2003568774A JP2003568774A JP2005518127A5 JP 2005518127 A5 JP2005518127 A5 JP 2005518127A5 JP 2003568774 A JP2003568774 A JP 2003568774A JP 2003568774 A JP2003568774 A JP 2003568774A JP 2005518127 A5 JP2005518127 A5 JP 2005518127A5
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- Prior art keywords
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- electrode structure
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- electrode
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 8
- 238000002161 passivation Methods 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 239000002318 adhesion promoter Substances 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052749 magnesium Inorganic materials 0.000 claims 3
- 239000011777 magnesium Substances 0.000 claims 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 230000006978 adaptation Effects 0.000 claims 1
- 230000004888 barrier function Effects 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10206369A DE10206369B4 (de) | 2002-02-15 | 2002-02-15 | Elektrodenstruktur mit verbesserter Leistungsverträglichkeit und Verfahren zur Herstellung |
| PCT/DE2003/000363 WO2003069775A1 (de) | 2002-02-15 | 2003-02-07 | Elektrodenstruktur mit verbesserter leistungsverträglichkeit und verfahren zur herstellung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005518127A JP2005518127A (ja) | 2005-06-16 |
| JP2005518127A5 true JP2005518127A5 (enExample) | 2006-03-09 |
| JP4314118B2 JP4314118B2 (ja) | 2009-08-12 |
Family
ID=27635000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003568774A Expired - Fee Related JP4314118B2 (ja) | 2002-02-15 | 2003-02-07 | 改善された出力許容性を有する電極構造体及び製造法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7345409B2 (enExample) |
| JP (1) | JP4314118B2 (enExample) |
| DE (1) | DE10206369B4 (enExample) |
| WO (1) | WO2003069775A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004032621B4 (de) * | 2004-07-05 | 2016-05-25 | Epcos Ag | SAW Bauelement mit verbesserter Leistungsverträglichkeit |
| DE102004045181B4 (de) * | 2004-09-17 | 2016-02-04 | Epcos Ag | SAW-Bauelement mit reduziertem Temperaturgang und Verfahren zur Herstellung |
| DE102004058016B4 (de) * | 2004-12-01 | 2014-10-09 | Epcos Ag | Mit akustischen Oberflächenwellen arbeitendes Bauelement mit hoher Bandbreite |
| JP4279271B2 (ja) | 2005-06-01 | 2009-06-17 | アルプス電気株式会社 | 弾性表面波素子及びその製造方法 |
| US20060289948A1 (en) * | 2005-06-22 | 2006-12-28 | International Business Machines Corporation | Method to control flatband/threshold voltage in high-k metal gated stacks and structures thereof |
| DE102006039515B4 (de) * | 2006-08-23 | 2012-02-16 | Epcos Ag | Drehbewegungssensor mit turmartigen Schwingstrukturen |
| DE102006044663A1 (de) * | 2006-09-21 | 2008-04-03 | Epcos Ag | Filterbauelement |
| DE102006048879B4 (de) * | 2006-10-16 | 2018-02-01 | Snaptrack, Inc. | Elektroakustisches Bauelement |
| DE102009021508B4 (de) | 2009-05-15 | 2014-05-22 | Epcos Ag | Elektrode mit verbesserter Leistungsfestigkeit |
| US9520856B2 (en) | 2009-06-24 | 2016-12-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator structure having an electrode with a cantilevered portion |
| US8330556B2 (en) * | 2009-11-23 | 2012-12-11 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Passivation layers in acoustic resonators |
| DE102009056663B4 (de) | 2009-12-02 | 2022-08-11 | Tdk Electronics Ag | Metallisierung mit hoher Leistungsverträglichkeit und hoher elektrischer Leitfähigkeit und Verfahren zur Herstellung |
| US20110304412A1 (en) * | 2010-06-10 | 2011-12-15 | Hao Zhang | Acoustic Wave Resonators and Methods of Manufacturing Same |
| DE102010034121A1 (de) | 2010-08-12 | 2012-02-16 | Epcos Ag | Mit akustischen Wellen arbeitendes Bauelement mit reduziertem Temperaturgang der Frequenzlage und Verfahren zur Herstellung |
| JP5664655B2 (ja) * | 2010-09-17 | 2015-02-04 | 株式会社村田製作所 | 弾性波装置 |
| DE102010048620B4 (de) | 2010-10-15 | 2013-03-28 | Epcos Ag | Elektrode, mikroakustisches Bauelement und Herstellungsverfahren für eine Elektrode |
| CN103119847B (zh) * | 2010-12-28 | 2016-01-20 | 京瓷株式会社 | 弹性波元件及使用该弹性波元件的弹性波装置 |
| US9425764B2 (en) | 2012-10-25 | 2016-08-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having composite electrodes with integrated lateral features |
| US9203374B2 (en) | 2011-02-28 | 2015-12-01 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator comprising a bridge |
| US9444426B2 (en) | 2012-10-25 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having integrated lateral feature and temperature compensation feature |
| US8922302B2 (en) | 2011-08-24 | 2014-12-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator formed on a pedestal |
| DE102011087820A1 (de) | 2011-12-06 | 2013-06-06 | Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. | Akustisches oberflächenwellenbauelement und verfahren zu seiner herstellung |
| US9608592B2 (en) | 2014-01-21 | 2017-03-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic wave resonator (FBAR) having stress-relief |
| US9136820B2 (en) * | 2012-07-31 | 2015-09-15 | Tdk Corporation | Piezoelectric device |
| DE112012007215B4 (de) * | 2012-12-12 | 2018-10-31 | Epcos Ag | Elektroakustische Komponente |
| CN107615656B (zh) * | 2015-07-02 | 2021-01-26 | 株式会社村田制作所 | 弹性波装置 |
| WO2017013946A1 (ja) * | 2015-07-17 | 2017-01-26 | 株式会社村田製作所 | 弾性波装置 |
| US20180041187A1 (en) * | 2016-08-04 | 2018-02-08 | Skyworks Filter Solutions Japan Co., Ltd. | Surface acoustic wave elements having improved resistance to cracking, and methods of manufacturing same |
| JP2019092019A (ja) * | 2017-11-14 | 2019-06-13 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
| DE102018109849B4 (de) * | 2018-04-24 | 2020-03-05 | RF360 Europe GmbH | Elektroakustischer Resonator und Verfahren zum Bilden desselben |
| US11063571B2 (en) * | 2019-07-25 | 2021-07-13 | Zhuhai Crystal Resonance Technologies Co., Ltd. | Packaged electronic components |
| WO2021241435A1 (ja) | 2020-05-28 | 2021-12-02 | 株式会社村田製作所 | 弾性波装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62272610A (ja) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | 弾性表面波素子 |
| JP3379049B2 (ja) * | 1993-10-27 | 2003-02-17 | 富士通株式会社 | 表面弾性波素子とその製造方法 |
| JPH0969748A (ja) * | 1995-09-01 | 1997-03-11 | Matsushita Electric Ind Co Ltd | Ｓａｗデバイスおよびその製造方法 |
| JPH09223944A (ja) * | 1995-12-13 | 1997-08-26 | Fujitsu Ltd | 弾性表面波素子及びその製造方法 |
| EP0803919B1 (de) * | 1996-04-25 | 2001-06-13 | Epcos Ag | Verfahren zum Herstellen einer Metallisierung auf piezoelektrischen Substraten |
| EP0936734A4 (en) | 1997-07-28 | 2000-10-25 | Toshiba Kk | ACOUSTIC SURFACE WAVE ARRANGEMENT AND METHOD FOR THEIR PRODUCTION |
| EP1124328A1 (en) * | 2000-02-10 | 2001-08-16 | Lucent Technologies Inc. | A method of fabricating a zinc oxide based resonator |
| JP3402311B2 (ja) * | 2000-05-19 | 2003-05-06 | 株式会社村田製作所 | 弾性表面波装置 |
| JP3521864B2 (ja) * | 2000-10-26 | 2004-04-26 | 株式会社村田製作所 | 弾性表面波素子 |
| JP3445971B2 (ja) | 2000-12-14 | 2003-09-16 | 富士通株式会社 | 弾性表面波素子 |
| JP3926633B2 (ja) | 2001-06-22 | 2007-06-06 | 沖電気工業株式会社 | Ｓａｗデバイス及びその製造方法 |
| US7148610B2 (en) * | 2002-02-01 | 2006-12-12 | Oc Oerlikon Balzers Ag | Surface acoustic wave device having improved performance and method of making the device |
| JP4060090B2 (ja) * | 2002-02-15 | 2008-03-12 | 沖電気工業株式会社 | 弾性表面波素子 |
| CN100576738C (zh) * | 2002-04-15 | 2009-12-30 | 松下电器产业株式会社 | 表面声波器件及利用其的移动通信设备和传感器 |
-
2002
- 2002-02-15 DE DE10206369A patent/DE10206369B4/de not_active Expired - Fee Related
-
2003
- 2003-02-07 US US10/504,625 patent/US7345409B2/en not_active Expired - Lifetime
- 2003-02-07 JP JP2003568774A patent/JP4314118B2/ja not_active Expired - Fee Related
- 2003-02-07 WO PCT/DE2003/000363 patent/WO2003069775A1/de not_active Ceased