JP2005515629A5 - - Google Patents

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Publication number
JP2005515629A5
JP2005515629A5 JP2003560965A JP2003560965A JP2005515629A5 JP 2005515629 A5 JP2005515629 A5 JP 2005515629A5 JP 2003560965 A JP2003560965 A JP 2003560965A JP 2003560965 A JP2003560965 A JP 2003560965A JP 2005515629 A5 JP2005515629 A5 JP 2005515629A5
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JP
Japan
Prior art keywords
workpiece
edge
directing
chamber
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2003560965A
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English (en)
Japanese (ja)
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JP2005515629A (ja
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Publication date
Priority claimed from US10/032,318 external-priority patent/US6833063B2/en
Application filed filed Critical
Priority claimed from PCT/US2002/041415 external-priority patent/WO2003060963A2/en
Publication of JP2005515629A publication Critical patent/JP2005515629A/ja
Publication of JP2005515629A5 publication Critical patent/JP2005515629A5/ja
Withdrawn legal-status Critical Current

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JP2003560965A 2001-12-21 2002-12-23 電気化学エッジおよびべベル洗浄方法およびシステム Withdrawn JP2005515629A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/032,318 US6833063B2 (en) 2001-12-21 2001-12-21 Electrochemical edge and bevel cleaning process and system
US42493602P 2002-11-08 2002-11-08
PCT/US2002/041415 WO2003060963A2 (en) 2001-12-21 2002-12-23 Electrochemical edge and bevel cleaning process and system

Publications (2)

Publication Number Publication Date
JP2005515629A JP2005515629A (ja) 2005-05-26
JP2005515629A5 true JP2005515629A5 (enExample) 2005-12-22

Family

ID=26708251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003560965A Withdrawn JP2005515629A (ja) 2001-12-21 2002-12-23 電気化学エッジおよびべベル洗浄方法およびシステム

Country Status (8)

Country Link
US (1) US7029567B2 (enExample)
EP (1) EP1456868A2 (enExample)
JP (1) JP2005515629A (enExample)
KR (1) KR20040103911A (enExample)
CN (1) CN1636267A (enExample)
AU (1) AU2002358291A1 (enExample)
TW (1) TW594874B (enExample)
WO (1) WO2003060963A2 (enExample)

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US7686935B2 (en) * 1998-10-26 2010-03-30 Novellus Systems, Inc. Pad-assisted electropolishing
US7780867B1 (en) * 1999-10-01 2010-08-24 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
DE10128507B4 (de) * 2001-06-14 2008-07-17 Mtu Aero Engines Gmbh Verwendung einer Vorrichtung zum chemischen oder elektrochemischen Bearbeiten von Bauteilen
EP1473387A1 (de) * 2003-05-02 2004-11-03 Siemens Aktiengesellschaft Verfahren zur Entschichtung eines Bauteils
US9236279B2 (en) * 2003-06-27 2016-01-12 Lam Research Corporation Method of dielectric film treatment
US20050037620A1 (en) * 2003-08-15 2005-02-17 Berman Michael J. Method for achieving wafer contact for electro-processing
US7648622B2 (en) * 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7998335B2 (en) * 2005-06-13 2011-08-16 Cabot Microelectronics Corporation Controlled electrochemical polishing method
US20090266707A1 (en) * 2005-08-26 2009-10-29 Novellus Systems, Inc. Pad-assisted electropolishing
KR100709590B1 (ko) * 2006-01-04 2007-04-20 (주)소슬 클러스터형 베벨에치장치
US8100081B1 (en) 2006-06-30 2012-01-24 Novellus Systems, Inc. Edge removal of films using externally generated plasma species
KR100801711B1 (ko) * 2007-02-27 2008-02-11 삼성전자주식회사 반도체 식각 및 증착 공정들을 수행하는 반도체 제조장비들 및 그를 이용한 반도체 소자의 형성방법들
US9732416B1 (en) 2007-04-18 2017-08-15 Novellus Systems, Inc. Wafer chuck with aerodynamic design for turbulence reduction
US8192822B2 (en) * 2008-03-31 2012-06-05 Memc Electronic Materials, Inc. Edge etched silicon wafers
US8419964B2 (en) 2008-08-27 2013-04-16 Novellus Systems, Inc. Apparatus and method for edge bevel removal of copper from silicon wafers
US8414790B2 (en) * 2008-11-13 2013-04-09 Lam Research Corporation Bevel plasma treatment to enhance wet edge clean
KR20110099108A (ko) * 2008-11-19 2011-09-06 엠이엠씨 일렉트로닉 머티리얼즈, 인크. 반도체 웨이퍼의 에지를 스트리핑하기 위한 방법 및 시스템
US8172646B2 (en) * 2009-02-27 2012-05-08 Novellus Systems, Inc. Magnetically actuated chuck for edge bevel removal
KR101198412B1 (ko) * 2009-12-30 2012-11-07 삼성전기주식회사 기판도금장치 및 기판도금방법
US8853054B2 (en) 2012-03-06 2014-10-07 Sunedison Semiconductor Limited Method of manufacturing silicon-on-insulator wafers
CN102623323A (zh) * 2012-04-01 2012-08-01 南通富士通微电子股份有限公司 半导体圆片喷液蚀刻系统及方法
CN103021937B (zh) * 2013-01-09 2015-07-08 华进半导体封装先导技术研发中心有限公司 化学腐蚀硅通孔面过电镀铜层的装置及方法
SG11201508466QA (en) * 2013-05-09 2015-11-27 Acm Research Shanghai Inc Apparatus and method for plating and/or polishing wafer
CN105088328B (zh) * 2014-05-07 2018-11-06 盛美半导体设备（上海）有限公司 电化学抛光供液装置
CN106206236B (zh) * 2016-08-30 2018-05-04 上海华力微电子有限公司 刻蚀设备以及用于去除晶背边缘薄膜的晶背边缘刻蚀方法
SG11202006936RA (en) * 2018-02-01 2020-08-28 Applied Materials Inc Cleaning components and methods in a plating system
DE102018111858A1 (de) * 2018-05-17 2019-11-21 Nexwafe Gmbh Vorrichtung und Verfahren zum einseitigen Ätzen einer Halbleiterschicht eines Werkstücks
CN110867449B (zh) * 2019-11-12 2021-09-07 长江存储科技有限责任公司 三维存储器及其制备方法
KR20220107012A (ko) * 2019-11-27 2022-08-01 램 리써치 코포레이션 쓰루-레지스트 (through-resist) 도금을 위한 에지 제거
JP7475945B2 (ja) * 2020-04-20 2024-04-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR20220130663A (ko) * 2021-03-17 2022-09-27 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 장치의 콘택트 부재 세정 방법
JP7696241B2 (ja) * 2021-07-06 2025-06-20 東京エレクトロン株式会社 基板処理装置および基板処理方法
WO2023079634A1 (ja) * 2021-11-04 2023-05-11 株式会社荏原製作所 めっき装置および基板洗浄方法
CN114855257B (zh) * 2022-04-20 2024-06-25 湖南华翔医疗科技有限公司 金属膜材的边缘抛光方法及金属膜材和应用

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US5284554A (en) * 1992-01-09 1994-02-08 International Business Machines Corporation Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
US5567300A (en) * 1994-09-02 1996-10-22 Ibm Corporation Electrochemical metal removal technique for planarization of surfaces
US5865984A (en) * 1997-06-30 1999-02-02 International Business Machines Corporation Electrochemical etching apparatus and method for spirally etching a workpiece
US6056869A (en) * 1998-06-04 2000-05-02 International Business Machines Corporation Wafer edge deplater for chemical mechanical polishing of substrates
US6883063B2 (en) * 1998-06-30 2005-04-19 Emc Corporation Method and apparatus for initializing logical objects in a data storage system
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6610190B2 (en) * 2000-11-03 2003-08-26 Nutool, Inc. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
JP2000331975A (ja) * 1999-05-19 2000-11-30 Ebara Corp ウエハ洗浄装置
US6309981B1 (en) * 1999-10-01 2001-10-30 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
US6352623B1 (en) * 1999-12-17 2002-03-05 Nutool, Inc. Vertically configured chamber used for multiple processes

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