JP2005512813A - 無鉛ソフトハンダ - Google Patents

無鉛ソフトハンダ Download PDF

Info

Publication number
JP2005512813A
JP2005512813A JP2003552486A JP2003552486A JP2005512813A JP 2005512813 A JP2005512813 A JP 2005512813A JP 2003552486 A JP2003552486 A JP 2003552486A JP 2003552486 A JP2003552486 A JP 2003552486A JP 2005512813 A JP2005512813 A JP 2005512813A
Authority
JP
Japan
Prior art keywords
solder
alloy
lead
present
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003552486A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005512813A5 (enExample
JP2005512813A6 (ja
Inventor
プファル・ローラント
ヴァルター・ヘルマン
ヴァルト・ヘルマン
Original Assignee
プファル・シュタンツテヒニク・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by プファル・シュタンツテヒニク・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング filed Critical プファル・シュタンツテヒニク・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
Publication of JP2005512813A publication Critical patent/JP2005512813A/ja
Publication of JP2005512813A6 publication Critical patent/JP2005512813A6/ja
Publication of JP2005512813A5 publication Critical patent/JP2005512813A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Organic Insulating Materials (AREA)
JP2003552486A 2001-12-15 2002-12-10 無鉛ソフトハンダ Pending JP2005512813A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10161826 2001-12-15
DE10161826.3 2001-12-15
PCT/DE2002/004525 WO2003051572A1 (de) 2001-12-15 2002-12-10 Bleifreies weichlot

Publications (3)

Publication Number Publication Date
JP2005512813A true JP2005512813A (ja) 2005-05-12
JP2005512813A6 JP2005512813A6 (ja) 2005-08-04
JP2005512813A5 JP2005512813A5 (enExample) 2006-01-19

Family

ID=7709452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003552486A Pending JP2005512813A (ja) 2001-12-15 2002-12-10 無鉛ソフトハンダ

Country Status (11)

Country Link
US (1) US20050008525A1 (enExample)
EP (1) EP1453636B1 (enExample)
JP (1) JP2005512813A (enExample)
KR (1) KR20040063990A (enExample)
CN (1) CN1310736C (enExample)
AT (1) ATE334775T1 (enExample)
BR (1) BR0215041A (enExample)
DE (1) DE50207747D1 (enExample)
HU (1) HUP0402010A2 (enExample)
MX (1) MXPA04005835A (enExample)
WO (1) WO2003051572A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008084603A1 (ja) * 2007-01-11 2008-07-17 Topy Kogyo Kabushiki Kaisha マニュアルソルダリング用無鉛はんだ合金

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4791685B2 (ja) * 2003-05-22 2011-10-12 シャープ株式会社 導電性ボール、電極構造、電子部品の電極の形成方法、電子部品ならびに電子機器
DE102004038280B4 (de) 2004-08-03 2006-07-27 W.C. Heraeus Gmbh Verfahren zum Herstellen von Feinstlotpulvern
CN1314512C (zh) * 2005-01-28 2007-05-09 于大全 无铅钎料合金添加剂及无铅合金钎料
JP4322844B2 (ja) * 2005-06-10 2009-09-02 シャープ株式会社 半導体装置および積層型半導体装置
RU2302932C2 (ru) * 2005-07-11 2007-07-20 Тольяттинский государственный университет Способ изготовления припоя
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP4040644B2 (ja) * 2005-07-28 2008-01-30 シャープ株式会社 半田付け実装構造の製造方法および半田付け実装方法
DE102006047764A1 (de) * 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
DE202006015429U1 (de) * 2006-10-09 2008-02-21 Innowatec Dipl.-Ing. Grieger & Englert Gmbh & Co. Kg Vorrichtung zum Reinigen eines Druckzylinders
JP4899115B2 (ja) * 2008-03-05 2012-03-21 千住金属工業株式会社 鉛フリーはんだ接続構造体およびはんだボール
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
US8509731B2 (en) * 2009-11-06 2013-08-13 Research In Motion Limited Location determination for mobile devices in emergency situations
CN101885119B (zh) * 2010-06-25 2012-01-11 常熟市华银焊料有限公司 含V、Nd和Ge的Sn-Cu-Ni无铅钎料
RU2541249C2 (ru) * 2013-02-20 2015-02-10 Открытое акционерное общество "АВТОВАЗ" Способ изготовления припоя на основе олова
CN105750758A (zh) * 2016-04-29 2016-07-13 广东中实金属有限公司 一种高可靠性的低温无铅焊料及其制备方法
CN107502782B (zh) * 2017-10-24 2019-06-21 河南科技大学 铜合金热镀用稀土锡基合金及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6231639B1 (en) * 1997-03-07 2001-05-15 Metaullics Systems Co., L.P. Modular filter for molten metal
DE19729545A1 (de) * 1997-07-10 1999-01-14 Euromat Gmbh Lotlegierung
US20020155024A1 (en) * 2000-10-27 2002-10-24 H-Technologies Group, Inc. Lead-free solder compositions
EP1231015B1 (en) * 2001-02-09 2007-01-03 Taiho Kogyo Co., Ltd. Lead-free solder and solder joint
CN1346728A (zh) * 2001-09-19 2002-05-01 大连理工大学 含稀土多合金组元无铅钎料合金

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008084603A1 (ja) * 2007-01-11 2008-07-17 Topy Kogyo Kabushiki Kaisha マニュアルソルダリング用無鉛はんだ合金

Also Published As

Publication number Publication date
EP1453636B1 (de) 2006-08-02
US20050008525A1 (en) 2005-01-13
CN1604832A (zh) 2005-04-06
BR0215041A (pt) 2004-11-03
WO2003051572A1 (de) 2003-06-26
CN1310736C (zh) 2007-04-18
HUP0402010A2 (hu) 2005-01-28
MXPA04005835A (es) 2005-03-31
ATE334775T1 (de) 2006-08-15
KR20040063990A (ko) 2004-07-15
EP1453636A1 (de) 2004-09-08
DE50207747D1 (de) 2006-09-14

Similar Documents

Publication Publication Date Title
JP2005512813A (ja) 無鉛ソフトハンダ
JP2005512813A6 (ja) 無鉛ソフトハンダ
JP3296289B2 (ja) はんだ合金
JP5660199B2 (ja) 鉛フリーはんだ合金
JP5943065B2 (ja) 接合方法、電子装置の製造方法、および電子部品
JP2009141197A (ja) 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器
JPWO2018174162A1 (ja) はんだ継手
JP3353662B2 (ja) はんだ合金
JP2005512813A5 (enExample)
JP4836009B2 (ja) はんだ合金、はんだボールおよびそれを用いたはんだ接合部
JPH10286689A (ja) はんだ合金
JP5253794B2 (ja) 鉛フリー接合用材料およびその製造方法
CN111542624A (zh) 用于高可靠性应用的标准sac合金的低银锡基替代焊料合金
JP2006255784A (ja) 無鉛ハンダ合金
JP3776361B2 (ja) 鉛フリーはんだ及びはんだ継手
EP1707302B1 (en) Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P)
KR20130083663A (ko) 무연 솔더 조성물
JP2013035016A (ja) 鉛フリーはんだ及びそのはんだを用いたクリームはんだ
JP2008221330A (ja) はんだ合金
CA2540486A1 (en) Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), nickel (ni), phosphorus (p) and/or rare earth: cerium (ce) or lanthanum (la)
KR100424662B1 (ko) 무연솔더합금조성물
JP2008093701A (ja) はんだ合金
JP2000210788A (ja) 無鉛半田合金およびその製造方法
WO2017221861A1 (ja) はんだペーストおよびはんだ接合体
JP2006043709A (ja) 鉛フリーはんだ合金

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051122

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090303

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090818