BR0215041A - Solda macia sem chumbo - Google Patents
Solda macia sem chumboInfo
- Publication number
- BR0215041A BR0215041A BR0215041-7A BR0215041A BR0215041A BR 0215041 A BR0215041 A BR 0215041A BR 0215041 A BR0215041 A BR 0215041A BR 0215041 A BR0215041 A BR 0215041A
- Authority
- BR
- Brazil
- Prior art keywords
- weight
- lead
- soft
- nickel
- soft solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- 229910045601 alloy Inorganic materials 0.000 abstract 4
- 239000000956 alloy Substances 0.000 abstract 4
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052779 Neodymium Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- -1 for example Chemical class 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 229910052747 lanthanoid Inorganic materials 0.000 abstract 1
- 150000002602 lanthanoids Chemical class 0.000 abstract 1
- 229910052746 lanthanum Inorganic materials 0.000 abstract 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 abstract 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Organic Insulating Materials (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
"SOLDA MACIA SEM CHUMBO". A presente invenção refere-se a uma solda macia sem chumbo, especialmente para o emprego na eletrónica e eletrotécnica. O objeto da invenção baseia-se em desenvolver uma solda macia sem chumbo, a qual não tenda de modo algum à formação de dentrídios grossos, após a fusão assegure uma superfície lisa e homogênea da solda e seja adequada para a aplicação como esferas de BGA. De acordo com a invenção, este objeto é solucionado por uma liga de solda de Sn-Ag-Cu sem chumbo, que se caracteriza pelo fato de se ligar à liga básica com 5,0 até 20<198> em peso, de prata, 0,8 até 1,2<198> em peso, de cobre, restante em cada caso chumbo e impurezas usuais, sendo que se ligam a esta liga básica sempre 0,8 até 1,2<198> em peso, de índio e 0,01 até 0,2<198> em peso, de níquel ou ao invés de níquel ou 0,01 até 0,2<198> em peso, de germânio ou 0,01 até 0,2<198> em peso, de um elemento dos lantanóides tal como por exemplo, lantano ou neodima, onde as três variantes mencionadas por último também podem ser combinadas entre si ou umas com as outras na forma de pré-ligas, de modo tal que sua soma perfaça 0,01 até 0,2<198> em peso.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10161826 | 2001-12-15 | ||
| PCT/DE2002/004525 WO2003051572A1 (de) | 2001-12-15 | 2002-12-10 | Bleifreies weichlot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0215041A true BR0215041A (pt) | 2004-11-03 |
Family
ID=7709452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0215041-7A Pending BR0215041A (pt) | 2001-12-15 | 2002-12-10 | Solda macia sem chumbo |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20050008525A1 (pt) |
| EP (1) | EP1453636B1 (pt) |
| JP (1) | JP2005512813A (pt) |
| KR (1) | KR20040063990A (pt) |
| CN (1) | CN1310736C (pt) |
| AT (1) | ATE334775T1 (pt) |
| BR (1) | BR0215041A (pt) |
| DE (1) | DE50207747D1 (pt) |
| HU (1) | HUP0402010A2 (pt) |
| MX (1) | MXPA04005835A (pt) |
| WO (1) | WO2003051572A1 (pt) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4791685B2 (ja) * | 2003-05-22 | 2011-10-12 | シャープ株式会社 | 導電性ボール、電極構造、電子部品の電極の形成方法、電子部品ならびに電子機器 |
| DE102004038280B4 (de) | 2004-08-03 | 2006-07-27 | W.C. Heraeus Gmbh | Verfahren zum Herstellen von Feinstlotpulvern |
| CN1314512C (zh) * | 2005-01-28 | 2007-05-09 | 于大全 | 无铅钎料合金添加剂及无铅合金钎料 |
| JP4322844B2 (ja) * | 2005-06-10 | 2009-09-02 | シャープ株式会社 | 半導体装置および積層型半導体装置 |
| TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法 |
| JP4040644B2 (ja) * | 2005-07-28 | 2008-01-30 | シャープ株式会社 | 半田付け実装構造の製造方法および半田付け実装方法 |
| DE102006047764A1 (de) * | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C |
| DE202006015429U1 (de) * | 2006-10-09 | 2008-02-21 | Innowatec Dipl.-Ing. Grieger & Englert Gmbh & Co. Kg | Vorrichtung zum Reinigen eines Druckzylinders |
| WO2008084603A1 (ja) * | 2007-01-11 | 2008-07-17 | Topy Kogyo Kabushiki Kaisha | マニュアルソルダリング用無鉛はんだ合金 |
| WO2009110458A1 (ja) * | 2008-03-05 | 2009-09-11 | 千住金属工業株式会社 | 鉛フリーはんだ接続構造体およびはんだボール |
| US8395051B2 (en) * | 2008-12-23 | 2013-03-12 | Intel Corporation | Doping of lead-free solder alloys and structures formed thereby |
| US8509731B2 (en) * | 2009-11-06 | 2013-08-13 | Research In Motion Limited | Location determination for mobile devices in emergency situations |
| CN101885119B (zh) * | 2010-06-25 | 2012-01-11 | 常熟市华银焊料有限公司 | 含V、Nd和Ge的Sn-Cu-Ni无铅钎料 |
| RU2541249C2 (ru) * | 2013-02-20 | 2015-02-10 | Открытое акционерное общество "АВТОВАЗ" | Способ изготовления припоя на основе олова |
| CN105750758A (zh) * | 2016-04-29 | 2016-07-13 | 广东中实金属有限公司 | 一种高可靠性的低温无铅焊料及其制备方法 |
| CN107502782B (zh) * | 2017-10-24 | 2019-06-21 | 河南科技大学 | 铜合金热镀用稀土锡基合金及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527628A (en) * | 1993-07-20 | 1996-06-18 | Iowa State University Research Foudation, Inc. | Pb-free Sn-Ag-Cu ternary eutectic solder |
| US6224690B1 (en) * | 1995-12-22 | 2001-05-01 | International Business Machines Corporation | Flip-Chip interconnections using lead-free solders |
| US6231691B1 (en) * | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
| US6231639B1 (en) * | 1997-03-07 | 2001-05-15 | Metaullics Systems Co., L.P. | Modular filter for molten metal |
| DE19729545A1 (de) * | 1997-07-10 | 1999-01-14 | Euromat Gmbh | Lotlegierung |
| US20020155024A1 (en) * | 2000-10-27 | 2002-10-24 | H-Technologies Group, Inc. | Lead-free solder compositions |
| EP1231015B1 (en) * | 2001-02-09 | 2007-01-03 | Taiho Kogyo Co., Ltd. | Lead-free solder and solder joint |
| CN1346728A (zh) * | 2001-09-19 | 2002-05-01 | 大连理工大学 | 含稀土多合金组元无铅钎料合金 |
-
2002
- 2002-12-10 MX MXPA04005835A patent/MXPA04005835A/es not_active Application Discontinuation
- 2002-12-10 AT AT02791624T patent/ATE334775T1/de not_active IP Right Cessation
- 2002-12-10 DE DE50207747T patent/DE50207747D1/de not_active Expired - Lifetime
- 2002-12-10 WO PCT/DE2002/004525 patent/WO2003051572A1/de active IP Right Grant
- 2002-12-10 CN CNB028249046A patent/CN1310736C/zh not_active Expired - Fee Related
- 2002-12-10 KR KR10-2004-7008958A patent/KR20040063990A/ko not_active Application Discontinuation
- 2002-12-10 JP JP2003552486A patent/JP2005512813A/ja active Pending
- 2002-12-10 HU HU0402010A patent/HUP0402010A2/hu unknown
- 2002-12-10 EP EP02791624A patent/EP1453636B1/de not_active Expired - Lifetime
- 2002-12-10 US US10/498,154 patent/US20050008525A1/en not_active Abandoned
- 2002-12-10 BR BR0215041-7A patent/BR0215041A/pt active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| ATE334775T1 (de) | 2006-08-15 |
| HUP0402010A2 (hu) | 2005-01-28 |
| CN1310736C (zh) | 2007-04-18 |
| DE50207747D1 (de) | 2006-09-14 |
| EP1453636A1 (de) | 2004-09-08 |
| WO2003051572A1 (de) | 2003-06-26 |
| MXPA04005835A (es) | 2005-03-31 |
| KR20040063990A (ko) | 2004-07-15 |
| EP1453636B1 (de) | 2006-08-02 |
| CN1604832A (zh) | 2005-04-06 |
| JP2005512813A (ja) | 2005-05-12 |
| US20050008525A1 (en) | 2005-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
| B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |