KR970000429A - 범용 무연땜납 - Google Patents

범용 무연땜납 Download PDF

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Publication number
KR970000429A
KR970000429A KR1019950019012A KR19950019012A KR970000429A KR 970000429 A KR970000429 A KR 970000429A KR 1019950019012 A KR1019950019012 A KR 1019950019012A KR 19950019012 A KR19950019012 A KR 19950019012A KR 970000429 A KR970000429 A KR 970000429A
Authority
KR
South Korea
Prior art keywords
free solder
purpose lead
general purpose
general
lead free
Prior art date
Application number
KR1019950019012A
Other languages
English (en)
Inventor
유충식
김미연
이도재
Original Assignee
이형도
삼성전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이형도, 삼성전기 주식회사 filed Critical 이형도
Priority to KR1019950019012A priority Critical patent/KR970000429A/ko
Priority to SG1995002013A priority patent/SG50377A1/en
Priority to JP7339644A priority patent/JP2638759B2/ja
Publication of KR970000429A publication Critical patent/KR970000429A/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명의 목적은 일반전자부품의 전자기기 배선용으로 사용되는 범용 무연땜납을 제공함에 있다. 본 발명은 중량％로, Ag:3.1-7％, Bi:6-30％ 및 잔부 Sn으로 조성되는 범용 무연땜납에 관한 것을 그 기술적 요지로 한다.

Description

범용 무연땜납
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 무연땜납에 대한 납땜성을 나타내는 그래프, 제2도는 종래의 땜납과 본 발명의 무연땜납에 대한 기계적 성질을 비교한 그래프

Claims (4)

  1. 중량％로, Ag:3.1-7％, Bi:6-30％ 및 잔부 Sn으로 조성됨을 특징으로 하는 범용 무연땜납
  2. 제1항에 있어서, 상기 조성이 중량％로, Ag:6-7％, Bi:29-30％ 및 잔부 Sn으로 이루어지는 범용 무연땜납
  3. 제1항에 있어서, 상기 조성이 중량％로, Ag:3.1-4％, Bi:6-7％ 및 잔부 Sn으로 이루어지는 범용 무연땜납
  4. 고상선 온도가 138-200℃이고, 액상선 온도가 144-220℃이며, Ag, Bi 및 Sn을 포함하여 구성됨을 특징으로 하는 범용 무연땜납
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950019012A 1995-06-30 1995-06-30 범용 무연땜납 KR970000429A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019950019012A KR970000429A (ko) 1995-06-30 1995-06-30 범용 무연땜납
SG1995002013A SG50377A1 (en) 1995-06-30 1995-12-04 Universal lead-free soldering material
JP7339644A JP2638759B2 (ja) 1995-06-30 1995-12-26 無鉛半田

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950019012A KR970000429A (ko) 1995-06-30 1995-06-30 범용 무연땜납

Publications (1)

Publication Number Publication Date
KR970000429A true KR970000429A (ko) 1997-01-21

Family

ID=19419408

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019012A KR970000429A (ko) 1995-06-30 1995-06-30 범용 무연땜납

Country Status (3)

Country Link
JP (1) JP2638759B2 (ko)
KR (1) KR970000429A (ko)
SG (1) SG50377A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
KR100833113B1 (ko) * 2007-12-31 2008-06-12 덕산하이메탈(주) 무연솔더합금 및 그 제조방법
CN105215569A (zh) * 2015-10-30 2016-01-06 苏州优诺电子材料科技有限公司 一种无铅焊料合金

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08132277A (ja) * 1994-11-01 1996-05-28 Ishikawa Kinzoku Kk 無鉛はんだ

Also Published As

Publication number Publication date
JP2638759B2 (ja) 1997-08-06
JPH0919791A (ja) 1997-01-21
SG50377A1 (en) 1998-07-20

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A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E601 Decision to refuse application