KR940006691A - 브레이징 솔더로서의 카드뮴-비함유 은 합금의 용도 - Google Patents

브레이징 솔더로서의 카드뮴-비함유 은 합금의 용도 Download PDF

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Publication number
KR940006691A
KR940006691A KR1019930017107A KR930017107A KR940006691A KR 940006691 A KR940006691 A KR 940006691A KR 1019930017107 A KR1019930017107 A KR 1019930017107A KR 930017107 A KR930017107 A KR 930017107A KR 940006691 A KR940006691 A KR 940006691A
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KR
South Korea
Prior art keywords
cadmium
silver alloy
brazing solder
free silver
weight
Prior art date
Application number
KR1019930017107A
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English (en)
Other versions
KR100328155B1 (ko
Inventor
바이세 볼프강
뵐커 알렉산더
카우프만 디이터
말리코프스키 빌리
보이어즈 외르크
크랍피츠 하랄트
Original Assignee
헤르만 브렌나이스 · 마르틴 펠드만
데구사 아크티엔게젤샤프트
게르하르트 만 · 헬무트 푀르스터
데메트론 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 헤르만 브렌나이스 · 마르틴 펠드만, 데구사 아크티엔게젤샤프트, 게르하르트 만 · 헬무트 푀르스터, 데메트론 게엠베하 filed Critical 헤르만 브렌나이스 · 마르틴 펠드만
Publication of KR940006691A publication Critical patent/KR940006691A/ko
Application granted granted Critical
Publication of KR100328155B1 publication Critical patent/KR100328155B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Contacts (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
  • Coating With Molten Metal (AREA)
  • Arc Welding In General (AREA)

Abstract

가공 온도가 630℃이하인 카드뮴-비함유 브레이징 솔더(brazing solder)를 은 45 내지 80중량%, 구리 5 내지 13중량%, 갈륨 10 내지 25중량%, 아연 8 내지 20중량% 및 인듐 및/또는 주석 0 내지 5중량%의 조성으로 수득한다.

Description

브레이징 솔더로서의 카드뮴-비함유 은 합금의 용도
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 은 45 내지 80중량%, 구리 5 내지 13중량%, 갈률 10 내지 25중량%, 아연 8 내지 20중량% 및 인듐 및/또는 주석 0 내지 5중량%를 함유하는 카드뮴-비함유 은 합금의 브레이징 솔더(brazing solder)로서의 용도.
  2. 제1항에 잇어서, 은 62 내지 72중량%, 구리 5 내지 13중량%, 갈륨 12 내지 24중량% 및 아연 9 내지 18중량%로 이루어짐을 특징으로 하는 카드뮴-비함유 은 합금의 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930017107A 1992-09-02 1993-08-31 카드뮴비함유은합금을포함하는브레이징솔더 KR100328155B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE4229189 1992-09-02
DEP4229189.5 1992-09-02
DE4315188A DE4315188C1 (de) 1992-09-02 1993-05-07 Verwendung einer kadmiumfreien Silberlegierung als Hartlot
DEP4315188.4 1993-05-07

Publications (2)

Publication Number Publication Date
KR940006691A true KR940006691A (ko) 1994-04-25
KR100328155B1 KR100328155B1 (ko) 2002-06-20

Family

ID=25918128

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930017107A KR100328155B1 (ko) 1992-09-02 1993-08-31 카드뮴비함유은합금을포함하는브레이징솔더

Country Status (8)

Country Link
US (1) US5341981A (ko)
EP (1) EP0586928B1 (ko)
JP (1) JPH06190587A (ko)
KR (1) KR100328155B1 (ko)
AT (1) ATE166017T1 (ko)
DE (2) DE4315188C1 (ko)
DK (1) DK0586928T3 (ko)
ES (1) ES2117074T3 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4323227C1 (de) * 1993-07-12 1994-07-28 Degussa Verwendung einer kadmiumfreien Silberlegierung als niedrigschmelzendes Hartlot
DE19921332A1 (de) * 1999-05-08 2000-11-16 Degussa Flußmittel für das Hartlöten von schwerbenetzbaren metallischen Werkstoffen
US7389834B1 (en) 2003-09-29 2008-06-24 Smith International, Inc. Braze alloys
US20050089440A1 (en) * 2003-10-24 2005-04-28 Kembaiyan Kumar T. Braze alloy
US7267187B2 (en) * 2003-10-24 2007-09-11 Smith International, Inc. Braze alloy and method of use for drilling applications
CN100352597C (zh) * 2005-11-25 2007-12-05 常熟市华银焊料有限公司 含镓、铟和铈的无镉银钎料
CN100408255C (zh) * 2006-04-19 2008-08-06 南京航空航天大学 含铟和铈的无镉银钎料
JP2010257530A (ja) 2009-04-24 2010-11-11 Toshiba Corp 半導体集積回路装置
CN102699569A (zh) * 2012-06-18 2012-10-03 北京有色金属研究总院 一种核工业用高温镍基膏状钎焊料及其制备方法
CN107350663B (zh) * 2017-08-30 2019-06-11 桂林电子科技大学 液态金属增强基纳米银焊膏热界面材料及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1234397B (de) * 1954-11-20 1967-02-16 Duerrwaechter E Dr Doduco Verwendung von Gold- und/oder Silber-Legierungen als Werkstoff fuer elektrische Kontakte und Verfahren zur Herstellung von Kontakten
GB1444350A (en) * 1972-10-03 1976-07-28 Johnson Matthey Co Ltd Dental alloys
SU450673A1 (ru) * 1973-01-12 1974-11-25 Предприятие П/Я А-1067 Припой дл пайки узлов электровакуумных приборов
DE2745409C3 (de) * 1977-10-08 1982-03-11 W.C. Heraeus Gmbh, 6450 Hanau Kupfer und Zink enthaltende Hartlot-Legierung
JPS5691999A (en) * 1979-12-25 1981-07-25 Mitsubishi Metal Corp Hard gold-alloy soldering material
DE3315498A1 (de) * 1983-04-28 1984-10-31 W.C. Heraeus Gmbh, 6450 Hanau Schichtverbund-kontaktstueck
US4659384A (en) * 1984-09-07 1987-04-21 Tokuriki Honten Company, Limited Gallium alloy for dental restorations
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder

Also Published As

Publication number Publication date
EP0586928A1 (de) 1994-03-16
EP0586928B1 (de) 1998-05-13
US5341981A (en) 1994-08-30
DK0586928T3 (da) 1999-01-18
ES2117074T3 (es) 1998-08-01
JPH06190587A (ja) 1994-07-12
ATE166017T1 (de) 1998-05-15
DE4315188C1 (de) 1994-04-07
KR100328155B1 (ko) 2002-06-20
DE59308535D1 (de) 1998-06-18

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