ES2091066T3 - Empleo de una aleacion de plata exenta de cadmio como material de soldadura fuerte. - Google Patents
Empleo de una aleacion de plata exenta de cadmio como material de soldadura fuerte.Info
- Publication number
- ES2091066T3 ES2091066T3 ES94107328T ES94107328T ES2091066T3 ES 2091066 T3 ES2091066 T3 ES 2091066T3 ES 94107328 T ES94107328 T ES 94107328T ES 94107328 T ES94107328 T ES 94107328T ES 2091066 T3 ES2091066 T3 ES 2091066T3
- Authority
- ES
- Spain
- Prior art keywords
- weight
- cadmium
- silver alloy
- soldering material
- free silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Contacts (AREA)
- Adornments (AREA)
- Ceramic Products (AREA)
- Arc Welding In General (AREA)
Abstract
LA INVENCION SE REFIERE A UNA SOLDADURA FUERTE LIBRE DE CADMIO CON TEMPERATURA DE TRABAJO POR DEBAJO DE 630 CONFORMABLE DE FORMA SENCILLA Y DE LA QUE RESULTAN COMPUESTOS DE SOLDADURA DUCTILES, ESTANDO COMPUESTA A PARTIR DE 30 HASTA 60 % EN PESO DE PLATA, 10 HASTA 36 % EN PESO DE COBRE, 15 HASTA 32 % EN PESO DE ZINC, 0,5 HASTA 7 % DE GALIO, 0,5 HASTA 7 % EN PESO DE ESTAÑO Y 0 HASTA 5 % EN PESO DE INDIO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4323227A DE4323227C1 (de) | 1993-07-12 | 1993-07-12 | Verwendung einer kadmiumfreien Silberlegierung als niedrigschmelzendes Hartlot |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2091066T3 true ES2091066T3 (es) | 1996-10-16 |
Family
ID=6492560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES94107328T Expired - Lifetime ES2091066T3 (es) | 1993-07-12 | 1994-05-11 | Empleo de una aleacion de plata exenta de cadmio como material de soldadura fuerte. |
Country Status (6)
Country | Link |
---|---|
US (1) | US6299835B1 (es) |
EP (1) | EP0634495B1 (es) |
JP (1) | JP3357184B2 (es) |
DE (2) | DE4323227C1 (es) |
ES (1) | ES2091066T3 (es) |
ZA (1) | ZA945008B (es) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19938230C1 (de) * | 1999-08-12 | 2001-02-01 | Degussa | Hochsilberhaltige Hartlotlegierungen I |
DE19938229C1 (de) * | 1999-08-12 | 2001-02-01 | Degussa | Hochsilberhaltige Hartlotlegierungen II |
US6620378B2 (en) * | 2000-02-14 | 2003-09-16 | Keith Weinstein | Precious metal solder |
US7389834B1 (en) * | 2003-09-29 | 2008-06-24 | Smith International, Inc. | Braze alloys |
US20050089440A1 (en) * | 2003-10-24 | 2005-04-28 | Kembaiyan Kumar T. | Braze alloy |
US7267187B2 (en) * | 2003-10-24 | 2007-09-11 | Smith International, Inc. | Braze alloy and method of use for drilling applications |
WO2005118903A1 (en) * | 2004-06-02 | 2005-12-15 | Middlesex Silver Co. Limited | Process for making finished or semi-finished articles of silver alloy comprising copper and germanium |
DE102004040778B4 (de) * | 2004-08-23 | 2011-11-24 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
DE102004040779B4 (de) * | 2004-08-23 | 2009-06-18 | Abb Technology Ag | Verwendung von Silberlegierungen als Hartlote |
CN100377832C (zh) * | 2005-11-22 | 2008-04-02 | 南京航空航天大学 | 含镓和铈的无镉银钎料 |
CN100352597C (zh) * | 2005-11-25 | 2007-12-05 | 常熟市华银焊料有限公司 | 含镓、铟和铈的无镉银钎料 |
CN100408255C (zh) * | 2006-04-19 | 2008-08-06 | 南京航空航天大学 | 含铟和铈的无镉银钎料 |
CN100457368C (zh) * | 2006-07-12 | 2009-02-04 | 常熟市华银焊料有限公司 | 含镓和稀土铈的无镉银钎料 |
CN100420538C (zh) * | 2006-11-26 | 2008-09-24 | 常熟市华银焊料有限公司 | 一种含镓、铟和铈的无镉银基钎料 |
TR200701159A2 (tr) * | 2007-02-26 | 2008-09-22 | Güner Kuyumculuk Kalip Maki̇na San. Ve Ti̇c. Ltd. Şti̇. | Altın ve diğer madenlerin birleştirilmesi yönteminde yenilik |
KR101231550B1 (ko) * | 2012-07-30 | 2013-02-07 | (주)알코마 | 은납 브레이징 합금 |
EP2756914A1 (de) * | 2013-01-18 | 2014-07-23 | Umicore AG & Co. KG | Lotlegierung |
CN103480988B (zh) * | 2013-09-26 | 2015-08-19 | 郑州机械研究所 | 一种高锡银基焊条 |
CN106001989A (zh) * | 2016-06-23 | 2016-10-12 | 国网江苏省电力公司宿迁供电公司 | 银钎焊料及其制备方法 |
CN106624427B (zh) * | 2016-12-15 | 2019-12-13 | 金华市金钟焊接材料有限公司 | 一种低熔点具有优良润湿性能的低镉银钎料 |
CN106736022B (zh) * | 2016-12-15 | 2019-12-13 | 金华市金钟焊接材料有限公司 | 一种含稀土元素的低熔点低镉银钎料 |
DE102021006556A1 (de) | 2021-03-18 | 2022-12-08 | MAPAL Fabrik für Präzisionswerkzeuge Dr. Kress KG | Lotlegierung, Lötpaste und Lötfolie mit einer solchen Lotlegierung |
DE102021202673A1 (de) | 2021-03-18 | 2022-09-22 | MAPAL Fabrik für Präzisionswerkzeuge Dr. Kress KG | Lotlegierung, Lötpaste und Lötfolie mit einer solchen Lotlegierung |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU450673A1 (ru) * | 1973-01-12 | 1974-11-25 | Предприятие П/Я А-1067 | Припой дл пайки узлов электровакуумных приборов |
GB1469856A (en) * | 1974-05-28 | 1977-04-06 | Johnson Matthey Co Ltd | Solder alloy |
JPS586599B2 (ja) * | 1975-05-02 | 1983-02-05 | タナカキキンゾクコウギヨウ カブシキガイシヤ | テイユウテンギンロウ |
DE2745409C3 (de) * | 1977-10-08 | 1982-03-11 | W.C. Heraeus Gmbh, 6450 Hanau | Kupfer und Zink enthaltende Hartlot-Legierung |
DE3315498A1 (de) * | 1983-04-28 | 1984-10-31 | W.C. Heraeus Gmbh, 6450 Hanau | Schichtverbund-kontaktstueck |
JPS6457996A (en) * | 1987-08-29 | 1989-03-06 | Tokuriki Honten Kk | Gold alloy filler metal |
JP3064042B2 (ja) * | 1991-05-10 | 2000-07-12 | シチズン時計株式会社 | 銀ロウ材 |
DE4209291C2 (de) * | 1992-03-21 | 1994-06-01 | Erich Prof Dr Tech Lugscheider | Legierung für ein Hartlot |
DE4315190C2 (de) | 1992-09-02 | 1994-08-25 | Degussa | Verwendung von Silberlegierungen als kadmiumfreies Hartlot |
DE4315188C1 (de) * | 1992-09-02 | 1994-04-07 | Degussa | Verwendung einer kadmiumfreien Silberlegierung als Hartlot |
EP0595254A1 (de) | 1992-10-28 | 1994-05-04 | Degussa Ag | Verfahren zum Auflöten von Hartstoffen auf Stähle |
-
1993
- 1993-07-12 DE DE4323227A patent/DE4323227C1/de not_active Expired - Lifetime
-
1994
- 1994-05-11 ES ES94107328T patent/ES2091066T3/es not_active Expired - Lifetime
- 1994-05-11 DE DE59400548T patent/DE59400548D1/de not_active Expired - Lifetime
- 1994-05-11 EP EP94107328A patent/EP0634495B1/de not_active Expired - Lifetime
- 1994-07-11 ZA ZA945008A patent/ZA945008B/xx unknown
- 1994-07-11 JP JP15859394A patent/JP3357184B2/ja not_active Expired - Fee Related
- 1994-07-12 US US08/273,742 patent/US6299835B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ZA945008B (en) | 1995-02-21 |
DE4323227C1 (de) | 1994-07-28 |
EP0634495B1 (de) | 1996-08-28 |
JPH0751887A (ja) | 1995-02-28 |
DE59400548D1 (de) | 1996-10-02 |
US6299835B1 (en) | 2001-10-09 |
EP0634495A1 (de) | 1995-01-18 |
JP3357184B2 (ja) | 2002-12-16 |
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Legal Events
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