ES2091066T3 - Empleo de una aleacion de plata exenta de cadmio como material de soldadura fuerte. - Google Patents

Empleo de una aleacion de plata exenta de cadmio como material de soldadura fuerte.

Info

Publication number
ES2091066T3
ES2091066T3 ES94107328T ES94107328T ES2091066T3 ES 2091066 T3 ES2091066 T3 ES 2091066T3 ES 94107328 T ES94107328 T ES 94107328T ES 94107328 T ES94107328 T ES 94107328T ES 2091066 T3 ES2091066 T3 ES 2091066T3
Authority
ES
Spain
Prior art keywords
weight
cadmium
silver alloy
soldering material
free silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94107328T
Other languages
English (en)
Inventor
Wolfgang Dr Dipl-Ing Weise
Willi Malikowski
Dieter Dipl-Ing Kaufmann
Harald Dr Dipl-Ing Krappitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Application granted granted Critical
Publication of ES2091066T3 publication Critical patent/ES2091066T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Contacts (AREA)
  • Ceramic Products (AREA)
  • Adornments (AREA)
  • Arc Welding In General (AREA)

Abstract

LA INVENCION SE REFIERE A UNA SOLDADURA FUERTE LIBRE DE CADMIO CON TEMPERATURA DE TRABAJO POR DEBAJO DE 630 CONFORMABLE DE FORMA SENCILLA Y DE LA QUE RESULTAN COMPUESTOS DE SOLDADURA DUCTILES, ESTANDO COMPUESTA A PARTIR DE 30 HASTA 60 % EN PESO DE PLATA, 10 HASTA 36 % EN PESO DE COBRE, 15 HASTA 32 % EN PESO DE ZINC, 0,5 HASTA 7 % DE GALIO, 0,5 HASTA 7 % EN PESO DE ESTAÑO Y 0 HASTA 5 % EN PESO DE INDIO.
ES94107328T 1993-07-12 1994-05-11 Empleo de una aleacion de plata exenta de cadmio como material de soldadura fuerte. Expired - Lifetime ES2091066T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4323227A DE4323227C1 (de) 1993-07-12 1993-07-12 Verwendung einer kadmiumfreien Silberlegierung als niedrigschmelzendes Hartlot

Publications (1)

Publication Number Publication Date
ES2091066T3 true ES2091066T3 (es) 1996-10-16

Family

ID=6492560

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94107328T Expired - Lifetime ES2091066T3 (es) 1993-07-12 1994-05-11 Empleo de una aleacion de plata exenta de cadmio como material de soldadura fuerte.

Country Status (6)

Country Link
US (1) US6299835B1 (es)
EP (1) EP0634495B1 (es)
JP (1) JP3357184B2 (es)
DE (2) DE4323227C1 (es)
ES (1) ES2091066T3 (es)
ZA (1) ZA945008B (es)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19938230C1 (de) * 1999-08-12 2001-02-01 Degussa Hochsilberhaltige Hartlotlegierungen I
DE19938229C1 (de) * 1999-08-12 2001-02-01 Degussa Hochsilberhaltige Hartlotlegierungen II
US6620378B2 (en) * 2000-02-14 2003-09-16 Keith Weinstein Precious metal solder
US7389834B1 (en) * 2003-09-29 2008-06-24 Smith International, Inc. Braze alloys
US7267187B2 (en) * 2003-10-24 2007-09-11 Smith International, Inc. Braze alloy and method of use for drilling applications
US20050089440A1 (en) * 2003-10-24 2005-04-28 Kembaiyan Kumar T. Braze alloy
ES2318490T3 (es) * 2004-06-02 2009-05-01 Argentium International Limited Procedimiento para la produccion de articulos acabados o semi-acabados a base de aleacion de plata que comprende cobre y germanio.
DE102004040779B4 (de) * 2004-08-23 2009-06-18 Abb Technology Ag Verwendung von Silberlegierungen als Hartlote
DE102004040778B4 (de) * 2004-08-23 2011-11-24 Umicore Ag & Co. Kg Silberhartlotlegierungen
CN100377832C (zh) * 2005-11-22 2008-04-02 南京航空航天大学 含镓和铈的无镉银钎料
CN100352597C (zh) * 2005-11-25 2007-12-05 常熟市华银焊料有限公司 含镓、铟和铈的无镉银钎料
CN100408255C (zh) * 2006-04-19 2008-08-06 南京航空航天大学 含铟和铈的无镉银钎料
CN100457368C (zh) * 2006-07-12 2009-02-04 常熟市华银焊料有限公司 含镓和稀土铈的无镉银钎料
CN100420538C (zh) * 2006-11-26 2008-09-24 常熟市华银焊料有限公司 一种含镓、铟和铈的无镉银基钎料
TR200701159A2 (tr) * 2007-02-26 2008-09-22 Güner Kuyumculuk Kalip Maki̇na San. Ve Ti̇c. Ltd. Şti̇. Altın ve diğer madenlerin birleştirilmesi yönteminde yenilik
KR101231550B1 (ko) * 2012-07-30 2013-02-07 (주)알코마 은납 브레이징 합금
EP2756914A1 (de) * 2013-01-18 2014-07-23 Umicore AG & Co. KG Lotlegierung
CN103480988B (zh) * 2013-09-26 2015-08-19 郑州机械研究所 一种高锡银基焊条
CN106001989A (zh) * 2016-06-23 2016-10-12 国网江苏省电力公司宿迁供电公司 银钎焊料及其制备方法
CN106624427B (zh) * 2016-12-15 2019-12-13 金华市金钟焊接材料有限公司 一种低熔点具有优良润湿性能的低镉银钎料
CN106736022B (zh) * 2016-12-15 2019-12-13 金华市金钟焊接材料有限公司 一种含稀土元素的低熔点低镉银钎料
DE102021006556A1 (de) 2021-03-18 2022-12-08 MAPAL Fabrik für Präzisionswerkzeuge Dr. Kress KG Lotlegierung, Lötpaste und Lötfolie mit einer solchen Lotlegierung
DE102021202673A1 (de) 2021-03-18 2022-09-22 MAPAL Fabrik für Präzisionswerkzeuge Dr. Kress KG Lotlegierung, Lötpaste und Lötfolie mit einer solchen Lotlegierung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU450673A1 (ru) * 1973-01-12 1974-11-25 Предприятие П/Я А-1067 Припой дл пайки узлов электровакуумных приборов
GB1469856A (en) * 1974-05-28 1977-04-06 Johnson Matthey Co Ltd Solder alloy
JPS586599B2 (ja) * 1975-05-02 1983-02-05 タナカキキンゾクコウギヨウ カブシキガイシヤ テイユウテンギンロウ
DE2745409C3 (de) * 1977-10-08 1982-03-11 W.C. Heraeus Gmbh, 6450 Hanau Kupfer und Zink enthaltende Hartlot-Legierung
DE3315498A1 (de) * 1983-04-28 1984-10-31 W.C. Heraeus Gmbh, 6450 Hanau Schichtverbund-kontaktstueck
JPS6457996A (en) * 1987-08-29 1989-03-06 Tokuriki Honten Kk Gold alloy filler metal
JP3064042B2 (ja) * 1991-05-10 2000-07-12 シチズン時計株式会社 銀ロウ材
DE4209291C2 (de) * 1992-03-21 1994-06-01 Erich Prof Dr Tech Lugscheider Legierung für ein Hartlot
DE4315190C2 (de) 1992-09-02 1994-08-25 Degussa Verwendung von Silberlegierungen als kadmiumfreies Hartlot
DE4315188C1 (de) * 1992-09-02 1994-04-07 Degussa Verwendung einer kadmiumfreien Silberlegierung als Hartlot
EP0595254A1 (de) 1992-10-28 1994-05-04 Degussa Ag Verfahren zum Auflöten von Hartstoffen auf Stähle

Also Published As

Publication number Publication date
JP3357184B2 (ja) 2002-12-16
ZA945008B (en) 1995-02-21
US6299835B1 (en) 2001-10-09
EP0634495B1 (de) 1996-08-28
DE4323227C1 (de) 1994-07-28
DE59400548D1 (de) 1996-10-02
EP0634495A1 (de) 1995-01-18
JPH0751887A (ja) 1995-02-28

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