KR980000745A - 퍼짐성이 우수한 무연땜납 - Google Patents

퍼짐성이 우수한 무연땜납 Download PDF

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Publication number
KR980000745A
KR980000745A KR1019960025305A KR19960025305A KR980000745A KR 980000745 A KR980000745 A KR 980000745A KR 1019960025305 A KR1019960025305 A KR 1019960025305A KR 19960025305 A KR19960025305 A KR 19960025305A KR 980000745 A KR980000745 A KR 980000745A
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KR
South Korea
Prior art keywords
lead
free solder
excellent spreadability
spreadability
present
Prior art date
Application number
KR1019960025305A
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English (en)
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KR0177681B1 (ko
Inventor
유충식
김미연
Original Assignee
이형도
삼성전기 주식회사
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Application filed by 이형도, 삼성전기 주식회사 filed Critical 이형도
Priority to KR1019960025305A priority Critical patent/KR0177681B1/ko
Publication of KR980000745A publication Critical patent/KR980000745A/ko
Application granted granted Critical
Publication of KR0177681B1 publication Critical patent/KR0177681B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명의 목적은 퍼짐성이 우수하여 특히 일반전자부품의 전자기기 배선용으로 매우 적합한 무연땜납을 제공함에 있다.
본 발명은 중량%로, Ag : 3-5%, Bi : 5-10%, Cu : 0.1-2% 및 잔부 Sn으로 조성되는 퍼짐성이 우수한 무연땜납에 관한 것을 그 기술적 요지로 한다.

Description

퍼짐성이 우수한 무연땜납
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종래의 땜납과 본 발명의 무연땜납에 대한 퍼짐정도를 비교한 그래프.

Claims (2)

  1. 중량%로, Ag : 3-5%, Bi : 5-10%, Cu : 0.1-2% 및 잔부 Sn으로 조성됨을 특징으로 하는 퍼짐성이 우수한 무연땜납.
  2. 고상선 온도가 185-200℃이고, 액상선 온도가 203-230℃이며, Ag, Bi, Cu 및 Sn을 포함하여 구성됨을 특징으로 하는 퍼짐성이 우수한 무연땜납.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960025305A 1996-06-28 1996-06-28 퍼짐성이 우수한 무연땜납 KR0177681B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960025305A KR0177681B1 (ko) 1996-06-28 1996-06-28 퍼짐성이 우수한 무연땜납

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960025305A KR0177681B1 (ko) 1996-06-28 1996-06-28 퍼짐성이 우수한 무연땜납

Publications (2)

Publication Number Publication Date
KR980000745A true KR980000745A (ko) 1998-03-30
KR0177681B1 KR0177681B1 (ko) 1999-02-18

Family

ID=19464423

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960025305A KR0177681B1 (ko) 1996-06-28 1996-06-28 퍼짐성이 우수한 무연땜납

Country Status (1)

Country Link
KR (1) KR0177681B1 (ko)

Also Published As

Publication number Publication date
KR0177681B1 (ko) 1999-02-18

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