KR970033400A - 고온용 무연땜납 - Google Patents

고온용 무연땜납 Download PDF

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Publication number
KR970033400A
KR970033400A KR1019950048488A KR19950048488A KR970033400A KR 970033400 A KR970033400 A KR 970033400A KR 1019950048488 A KR1019950048488 A KR 1019950048488A KR 19950048488 A KR19950048488 A KR 19950048488A KR 970033400 A KR970033400 A KR 970033400A
Authority
KR
South Korea
Prior art keywords
lead
free solder
high temperature
bismuth
aluminum
Prior art date
Application number
KR1019950048488A
Other languages
English (en)
Other versions
KR100293181B1 (ko
Inventor
유충식
김미연
이도재
Original Assignee
이형도
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이형도, 삼성전기주식회사 filed Critical 이형도
Priority to KR1019950048488A priority Critical patent/KR100293181B1/ko
Publication of KR970033400A publication Critical patent/KR970033400A/ko
Application granted granted Critical
Publication of KR100293181B1 publication Critical patent/KR100293181B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 전자부품의 배선용으로 사용되는 고온용 무연땜납을 제공함에 그 목적이 있다.
상기 목적달성을 위해 본 발명은 중량%로, 은:2.5-3.5%, 알루미늄:0.1-1% 비스무스:5-10%, 및 잔부 주석으로 조성되는 고온용 무연땜납에 관한 것을 그 요지로 한다.

Description

고온용 무연땜납
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종래의 땜납과 본 발명에 의한 무연땜납에 대한 기계적 특성을 나타내는 그래프.
제2도는 본 발명에 의한 무연땜납에 대한 시간에 따른 젖음성을 나타내는 그래프.

Claims (3)

  1. 중량%로, 은(Ag):2.5-3.5%, 알루미늄(Al):0.1-1% 비스무스(Bi):5-10%, 및 잔부 주석(Sn)으로 조성됨을 특징으로 하는 고온용 무연 땜납.
  2. 제1항에 있어서, 상기 무연땜납의 조성이 중량%로, 은(Ag):2.9-3.2%, 알루미늄(Al):0.5-1% 비스무스(Bi):6-7%, 및 잔부 주석(Sn)으로 조성됨을 특징으로 하는 고온용 무연땜납.
  3. 고상선온도가 200-215℃이고, 액상선 온도가 220-240℃이며, 은, 알루미늄, 비스무스 및 주석을 포함함을 특징으로 하는 고온용 무연땜납.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950048488A 1995-12-11 1995-12-11 고온용무연땜납 KR100293181B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950048488A KR100293181B1 (ko) 1995-12-11 1995-12-11 고온용무연땜납

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950048488A KR100293181B1 (ko) 1995-12-11 1995-12-11 고온용무연땜납

Publications (2)

Publication Number Publication Date
KR970033400A true KR970033400A (ko) 1997-07-22
KR100293181B1 KR100293181B1 (ko) 2001-11-22

Family

ID=37527166

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950048488A KR100293181B1 (ko) 1995-12-11 1995-12-11 고온용무연땜납

Country Status (1)

Country Link
KR (1) KR100293181B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101406174B1 (ko) * 2007-06-18 2014-06-12 엠케이전자 주식회사 주석, 은 및 비스무스를 함유하는 무연솔더

Also Published As

Publication number Publication date
KR100293181B1 (ko) 2001-11-22

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