KR890016193A - 반도체 장치용 Cu합금제 리이드프레임재 - Google Patents
반도체 장치용 Cu합금제 리이드프레임재 Download PDFInfo
- Publication number
- KR890016193A KR890016193A KR1019880014327A KR880014327A KR890016193A KR 890016193 A KR890016193 A KR 890016193A KR 1019880014327 A KR1019880014327 A KR 1019880014327A KR 880014327 A KR880014327 A KR 880014327A KR 890016193 A KR890016193 A KR 890016193A
- Authority
- KR
- South Korea
- Prior art keywords
- frame material
- lead frame
- semiconductor devices
- alloy lead
- alloy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (1)
- Ni : 0.5-2%, Sn : 1.2-2.5%, Si : 0.05-0.5%, Zn : 0.1-1%, Ca : 0.001-0.01%, Mg : 0.001-0.05%, Pb : 0.001-0.01%를 함유하고 나머지가 Cu와 불가피한 불순물로 이루어진 조성(이상중량%)을 갖고 있는 Cu합금으로 구성되어 고강도를 갖고 또한 납땜의 내열박리성 및 내타발금형 마모성에 우수한것을 특징으로하는 반도체 장치용 Cu합금제 리이드프레임재.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP???63-?101748 | 1988-04-25 | ||
| JP63101748A JPH01272733A (ja) | 1988-04-25 | 1988-04-25 | 半導体装置用Ｃｕ合金製リードフレーム材 |
| JP?63-101748 | 1988-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR890016193A true KR890016193A (ko) | 1989-11-28 |
| KR960010816B1 KR960010816B1 (ko) | 1996-08-09 |
Family
ID=14308864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019880014327A KR960010816B1 (ko) | 1988-04-25 | 1988-11-01 | 반도체장치용 Cu 합금제 리이드프레임재 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4877577A (ko) |
| JP (1) | JPH01272733A (ko) |
| KR (1) | KR960010816B1 (ko) |
| DE (1) | DE3908513A1 (ko) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01272733A (ja) * | 1988-04-25 | 1989-10-31 | Mitsubishi Shindoh Co Ltd | 半導体装置用Ｃｕ合金製リードフレーム材 |
| JPH02221344A (ja) * | 1989-02-21 | 1990-09-04 | Mitsubishi Shindoh Co Ltd | 熱間圧延性およびめっき加熱密着性のすぐれた高強度Ｃｕ合金 |
| JP2503793B2 (ja) * | 1991-03-01 | 1996-06-05 | 三菱伸銅株式会社 | 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材 |
| JP2673973B2 (ja) * | 1991-03-07 | 1997-11-05 | 三菱伸銅 株式会社 | 耐熱間圧延割れ性のすぐれた高強度Ｃｕ合金 |
| JPH04280462A (ja) * | 1991-03-08 | 1992-10-06 | Mitsubishi Electric Corp | リードフレームおよびこのリードフレームを使用した半導体装置 |
| JP2780584B2 (ja) * | 1992-11-13 | 1998-07-30 | 三菱伸銅株式会社 | 熱間加工性および打抜き加工性に優れた電気電子部品用Ｃｕ合金 |
| JPH0945815A (ja) * | 1995-08-03 | 1997-02-14 | Sumitomo Electric Ind Ltd | 半導体用パッケージ、該パッケージ用板状部材及びその製造方法 |
| JP3728776B2 (ja) | 1995-08-10 | 2005-12-21 | 三菱伸銅株式会社 | めっき予備処理工程中にスマットが発生することのない高強度銅合金 |
| JP4329967B2 (ja) * | 2000-04-28 | 2009-09-09 | 古河電気工業株式会社 | プラスチック基板に設けられるピングリッドアレイ用ｉｃリードピンに適した銅合金線材 |
| JP3520034B2 (ja) * | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
| JP3520046B2 (ja) | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
| US7090732B2 (en) * | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
| CN113981265A (zh) * | 2021-09-07 | 2022-01-28 | 铜陵有色金属集团股份有限公司金威铜业分公司 | 热轧性能优异的铜合金及其制造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4612167A (en) * | 1984-03-02 | 1986-09-16 | Hitachi Metals, Ltd. | Copper-base alloys for leadframes |
| JPS6152332A (ja) * | 1984-08-21 | 1986-03-15 | Toshiba Corp | ボンデイングワイヤ− |
| JP2555067B2 (ja) * | 1987-04-24 | 1996-11-20 | 古河電気工業株式会社 | 高力銅基合金の製造法 |
| JPH01272733A (ja) * | 1988-04-25 | 1989-10-31 | Mitsubishi Shindoh Co Ltd | 半導体装置用Ｃｕ合金製リードフレーム材 |
-
1988
- 1988-04-25 JP JP63101748A patent/JPH01272733A/ja active Granted
- 1988-10-12 US US07/256,747 patent/US4877577A/en not_active Expired - Lifetime
- 1988-11-01 KR KR1019880014327A patent/KR960010816B1/ko not_active IP Right Cessation
-
1989
- 1989-03-15 DE DE3908513A patent/DE3908513A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| US4877577A (en) | 1989-10-31 |
| KR960010816B1 (ko) | 1996-08-09 |
| JPH0480102B2 (ko) | 1992-12-17 |
| DE3908513C2 (ko) | 1990-09-20 |
| DE3908513A1 (de) | 1989-11-09 |
| JPH01272733A (ja) | 1989-10-31 |
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Legal Events
| Date | Code | Title | Description |
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| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| G160 | Decision to publish patent application | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20100520 Year of fee payment: 15 |
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| EXPY | Expiration of term |