KR870005109A - 내 마이그레이션성이 우수한 동합금 - Google Patents
내 마이그레이션성이 우수한 동합금 Download PDFInfo
- Publication number
- KR870005109A KR870005109A KR860009589A KR860009589A KR870005109A KR 870005109 A KR870005109 A KR 870005109A KR 860009589 A KR860009589 A KR 860009589A KR 860009589 A KR860009589 A KR 860009589A KR 870005109 A KR870005109 A KR 870005109A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- copper alloy
- migration resistance
- excellent migration
- impurities
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims 4
- 230000005012 migration Effects 0.000 title claims 4
- 238000013508 migration Methods 0.000 title claims 4
- 239000010949 copper Substances 0.000 claims 3
- 239000012535 impurity Substances 0.000 claims 3
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (3)
- 0.05 내지 0.20중량%의 Fe, 0.02 내지 0.05중량% P, 1.0 내지 5.0중량%의 Zn, 2.5중량% 미만의 Sn 및 실질적인 잔량의 Cu와 불순물로 이루어지는 것을 특징으로 하는 내마이그레이션성이 우수한 동합금.
- 0.05 내지 0.15중량%의 Fe, 0.025 내지 0.05중량%의 P, 1.1 내지 5,0중량%의 Zn, 0.1내지 2.5중량%의 Sn 및 실질적인 잔량의 Cu와 불순물로 이루어지는 것을 특징으로 하는 스프링한도 성질 및 내마이그레이션성이 우수한 동합금.
- 0.05내지 0.20중량%의 Fe,0.025내지 0.050중량%의 P,1.1내지 3.5중량%의 Zn,0.1 중량%미만의 Sn 및 실질적인 잔량의 Cu와 불순물로 이루어지는 것을 특징으로 하는 전기전도성 및 내마이그레이션이 우수한 동합금.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60-254358 | 1985-11-13 | ||
JP60254358A JPS62116745A (ja) | 1985-11-13 | 1985-11-13 | 耐マイグレ−シヨン性に優れたりん青銅 |
JP60-276233 | 1985-12-09 | ||
JP60276233A JPS62136539A (ja) | 1985-12-09 | 1985-12-09 | 耐マイグレ−シヨン性に優れた高導電性銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870005109A true KR870005109A (ko) | 1987-06-04 |
KR900007451B1 KR900007451B1 (ko) | 1990-10-10 |
Family
ID=26541650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860009589A KR900007451B1 (ko) | 1985-11-13 | 1986-11-13 | 내마이그레이션성이 우수한 동합금 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4822562A (ko) |
EP (1) | EP0222406B1 (ko) |
KR (1) | KR900007451B1 (ko) |
DE (1) | DE3680991D1 (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0776397B2 (ja) * | 1989-07-25 | 1995-08-16 | 三菱伸銅株式会社 | Cu合金製電気機器用コネクタ |
US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
US5820701A (en) * | 1996-11-07 | 1998-10-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US5865910A (en) * | 1996-11-07 | 1999-02-02 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
US6132528A (en) * | 1997-04-18 | 2000-10-17 | Olin Corporation | Iron modified tin brass |
US6679956B2 (en) | 1997-09-16 | 2004-01-20 | Waterbury Rolling Mills, Inc. | Process for making copper-tin-zinc alloys |
US6695934B1 (en) * | 1997-09-16 | 2004-02-24 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
US6436206B1 (en) | 1999-04-01 | 2002-08-20 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US6344171B1 (en) | 1999-08-25 | 2002-02-05 | Kobe Steel, Ltd. | Copper alloy for electrical or electronic parts |
JP4848539B2 (ja) * | 2001-08-23 | 2011-12-28 | Dowaメタルテック株式会社 | 放熱板およびパワー半導体モジュール、icパッケージ |
DE10317330B4 (de) * | 2002-04-15 | 2013-12-24 | Autonetworks Technologies, Ltd. | Lichtbogenbeständiger Anschluss, Verwendung davon für ein lichtbogenbeständiges Anschlusspaar, für einen Verbinder, für einen Anschlusskasten, für eine Unterbrechervorrichtung oder dgl. und für ein Kraftfahrzeug und einen Motor |
CN103370828B (zh) | 2010-11-17 | 2016-06-08 | 诺而达阿普尔顿有限责任公司 | 碱性集电极阳极 |
US8721765B2 (en) * | 2011-11-14 | 2014-05-13 | Mueller Industries, Inc. | Lead free dezincification alloy and method of making same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2155406A (en) * | 1938-04-28 | 1939-04-25 | Chase Brass & Copper Co | Electrical conductor |
DE2353238C2 (de) * | 1973-10-24 | 1975-09-11 | Wieland-Werke Ag, 7900 Ulm | Verwendung einer phosphorhaltigen Messinglegierung |
JPS5834536B2 (ja) * | 1980-06-06 | 1983-07-27 | 日本鉱業株式会社 | 半導体機器のリ−ド材用の銅合金 |
JPS5710257A (en) * | 1980-06-23 | 1982-01-19 | Tamagawa Kikai Kinzoku Kk | Lead material for semiconductor having heat resistant and conductive property |
JPS5931839A (ja) * | 1982-08-17 | 1984-02-21 | Kobe Steel Ltd | 高力導電性銅合金 |
JPS62116745A (ja) * | 1985-11-13 | 1987-05-28 | Kobe Steel Ltd | 耐マイグレ−シヨン性に優れたりん青銅 |
JPS62136539A (ja) * | 1985-12-09 | 1987-06-19 | Kobe Steel Ltd | 耐マイグレ−シヨン性に優れた高導電性銅合金 |
-
1986
- 1986-11-13 US US06/930,114 patent/US4822562A/en not_active Expired - Lifetime
- 1986-11-13 EP EP86115808A patent/EP0222406B1/en not_active Expired - Lifetime
- 1986-11-13 KR KR1019860009589A patent/KR900007451B1/ko not_active IP Right Cessation
- 1986-11-13 DE DE8686115808T patent/DE3680991D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4822562A (en) | 1989-04-18 |
EP0222406A3 (en) | 1989-06-28 |
KR900007451B1 (ko) | 1990-10-10 |
EP0222406B1 (en) | 1991-08-21 |
EP0222406A2 (en) | 1987-05-20 |
DE3680991D1 (de) | 1991-09-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR870005109A (ko) | 내 마이그레이션성이 우수한 동합금 | |
KR910003863A (ko) | Cu 합금제 전기기기용 콘넥터 | |
KR940006693A (ko) | 카드뮴 부재 땜납으로서의 은 합금의 용도 | |
KR900013096A (ko) | 열간 압연성 및 도금 가열 밀착성이 뛰어난 고강도 동합금 | |
KR890016193A (ko) | 반도체 장치용 Cu합금제 리이드프레임재 | |
KR830010215A (ko) | 구리 기본 합금 | |
KR840005986A (ko) | 균질한 저융점 구리기초 합금. | |
KR860006562A (ko) | 동기(銅基)합금 | |
KR860000675A (ko) | Ptc세라믹 조성물 | |
KR850008243A (ko) | 반도체 기구용 리이드 재료(半導體機구用 lead材料) | |
SE8703493D0 (sv) | Kopparbaserad legering | |
KR880010487A (ko) | 본딩 선 | |
KR900019209A (ko) | 동합금으로 제조된 초미선(超微線)과 그것을 사용한 반도체소자 | |
KR940006692A (ko) | 브레이징 솔더로서의 카드뮴-비함유 은 합금의 용도 | |
JPS648237A (en) | Copper alloy for terminal and connector | |
KR870008045A (ko) | 용접용 황동합금 | |
KR900019088A (ko) | 은-산화물 전기 접점 재료 | |
JPS6462429A (en) | Busbar for electrical connection box | |
KR890008338A (ko) | 내식성 금색 동합금 | |
KR930020500A (ko) | 후막 저항기 조성물 | |
KR920006524A (ko) | 고전도성 전기, 전자부품용 동합금 | |
KR970025826A (ko) | 고강도 무연 땜납용 재료 | |
KR890016108A (ko) | 고무-변성된 폴리스티렌 수지 조성물 | |
JPS5690946A (en) | High strength copper alloy with high electric conductivity | |
KR960017880A (ko) | 납 무함유 땜질 합금 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050817 Year of fee payment: 16 |
|
EXPY | Expiration of term |