KR880010487A - 본딩 선 - Google Patents

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Publication number
KR880010487A
KR880010487A KR1019870015233A KR870015233A KR880010487A KR 880010487 A KR880010487 A KR 880010487A KR 1019870015233 A KR1019870015233 A KR 1019870015233A KR 870015233 A KR870015233 A KR 870015233A KR 880010487 A KR880010487 A KR 880010487A
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South Korea
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impurity element
bonding line
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KR1019870015233A
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KR950010860B1 (ko
Inventor
마사노리 도끼다
겐지 모리
다까노리 후꾸다
에이이찌 후지모또
도시다께 오오다끼
Original Assignee
오오이시 다께오
다쓰다 덴센 가부시끼가이샤
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Publication of KR880010487A publication Critical patent/KR880010487A/ko
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Publication of KR950010860B1 publication Critical patent/KR950010860B1/ko

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    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Wire Bonding (AREA)
  • Conductive Materials (AREA)

Abstract

내용 없음

Description

본딩 선
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 순도 99.99중량%이상의 동으로된 본딩 선으로서, 은 및 규소로된 제1의 불순물 원소군중의 어느 한 원소의 함유량도 5ppm 이하이며, 비스무트, 철, 니켈, 주석, 유황, 인 및 납으로된 제2의 불순물 원소군중의 어느 한 원소의 함유량도 1ppm 이하이며, 제3의 불순물인 산소의 함유량도 5ppm 이하이며, 또한 제1의 불순물 원소의 함유량과 제2의 불순물 원소의 함유량과 산소의 함유량의 총 합계가 10ppm 이하인 동으로 된 것을 특징으로 하는 본딩 선.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870015233A 1987-02-27 1987-12-29 본딩 선(bonding 線) KR950010860B1 (ko)

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JP62-44744 1987-02-27
JP62044744A JPH084100B2 (ja) 1987-02-27 1987-02-27 ボンディング線
JP?62-44744 1987-02-27

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KR880010487A true KR880010487A (ko) 1988-10-10
KR950010860B1 KR950010860B1 (ko) 1995-09-25

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JP4691533B2 (ja) * 2006-08-31 2011-06-01 新日鉄マテリアルズ株式会社 半導体装置用銅合金ボンディングワイヤ
EP1954114A1 (en) * 2006-09-30 2008-08-06 Umicore AG & Co. KG Use of an adhesive composition for die-attaching high power semiconductors
JP2011091114A (ja) * 2009-10-20 2011-05-06 Nitto Denko Corp 配線回路基板およびその製法
EP2684970A4 (en) * 2011-03-07 2015-03-04 Jx Nippon Mining & Metals Corp COPPER OR COPPER ALLOY HAVING REDUCED RAY EMISSION AND CONNECTING WIRE OBTAINED FROM COPPER OR COPPER ALLOY AS RAW MATERIAL
SG190482A1 (en) * 2011-12-01 2013-06-28 Heraeus Materials Tech Gmbh Doped 4n copper wire for bonding in microelectronics device
EP3103567A4 (en) * 2014-02-04 2017-11-01 Senju Metal Industry Co., Ltd Method for producing metal ball, joining material, and metal ball
WO2016170904A1 (ja) 2015-04-22 2016-10-27 日立金属株式会社 金属粒子およびその製造方法、被覆金属粒子、金属粉体
CN107723488B (zh) * 2017-10-09 2019-11-08 南理工泰兴智能制造研究院有限公司 一种耐氧化键合铜丝材料的制备方法
KR101884812B1 (ko) 2018-02-05 2018-08-07 전박 수술용 장갑

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JPS60124959A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
GB2175009B (en) * 1985-03-27 1990-02-07 Mitsubishi Metal Corp Wire for bonding a semiconductor device and process for producing the same
GB2178761B (en) * 1985-03-29 1989-09-20 Mitsubishi Metal Corp Wire for bonding a semiconductor device

Also Published As

Publication number Publication date
EP0283587A1 (en) 1988-09-28
KR950010860B1 (ko) 1995-09-25
DE3782162T2 (de) 1993-02-11
JPS63211731A (ja) 1988-09-02
DE3782162D1 (de) 1992-11-12
JPH084100B2 (ja) 1996-01-17
EP0283587B1 (en) 1992-10-07

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