JPS6471593A - Solder - Google Patents
SolderInfo
- Publication number
- JPS6471593A JPS6471593A JP22924987A JP22924987A JPS6471593A JP S6471593 A JPS6471593 A JP S6471593A JP 22924987 A JP22924987 A JP 22924987A JP 22924987 A JP22924987 A JP 22924987A JP S6471593 A JPS6471593 A JP S6471593A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- connection part
- material component
- contg
- reliability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To improve the reliability of a solder connecting part by taking Pb and Sn, or Pb or Sn as a basic material component and further contg. at least one kind of Tl or Ag, Bi, Cu and Sb at a specified rate. CONSTITUTION:A solder is formed by taking Pb and/or Sn as a base material component and further contg. 0.001-0.1wt.% Tl. Or it is composed of contg. in the base material component of Pb and Sn at least >= one kind of the adding elements of <=5% Ag, <=30% Bi, <=1% Cu and <=10% Sb, and 0.001-0.01% Tl. The ductility even of a solder connection part is drastically improved by the blending of these adding elements. Destruction or stress damage is thus prevented because the connection part has a big ductility even if a large stress is given thermally and mechanically on the solder connection part. Consequently the reliability of a solder connection part is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22924987A JPS6471593A (en) | 1987-09-12 | 1987-09-12 | Solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22924987A JPS6471593A (en) | 1987-09-12 | 1987-09-12 | Solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6471593A true JPS6471593A (en) | 1989-03-16 |
Family
ID=16889152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22924987A Pending JPS6471593A (en) | 1987-09-12 | 1987-09-12 | Solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6471593A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH071179A (en) * | 1993-06-16 | 1995-01-06 | Internatl Business Mach Corp <Ibm> | Lead-free tin - bismuth solder |
JPH0788679A (en) * | 1993-06-16 | 1995-04-04 | Internatl Business Mach Corp <Ibm> | Lead-free tin antimony bismuth copper solder |
JPH0788680A (en) * | 1993-06-16 | 1995-04-04 | Internatl Business Mach Corp <Ibm> | Composition of high-temperature lead-free tin based solder |
JPH08132278A (en) * | 1994-11-01 | 1996-05-28 | Ishikawa Kinzoku Kk | Solder alloy |
WO1998048069A1 (en) * | 1997-04-22 | 1998-10-29 | Ecosolder International Pty Limited | Lead-free solder |
-
1987
- 1987-09-12 JP JP22924987A patent/JPS6471593A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH071179A (en) * | 1993-06-16 | 1995-01-06 | Internatl Business Mach Corp <Ibm> | Lead-free tin - bismuth solder |
JPH0788679A (en) * | 1993-06-16 | 1995-04-04 | Internatl Business Mach Corp <Ibm> | Lead-free tin antimony bismuth copper solder |
JPH0788680A (en) * | 1993-06-16 | 1995-04-04 | Internatl Business Mach Corp <Ibm> | Composition of high-temperature lead-free tin based solder |
JPH08132278A (en) * | 1994-11-01 | 1996-05-28 | Ishikawa Kinzoku Kk | Solder alloy |
WO1998048069A1 (en) * | 1997-04-22 | 1998-10-29 | Ecosolder International Pty Limited | Lead-free solder |
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