JPS6471593A - Solder - Google Patents

Solder

Info

Publication number
JPS6471593A
JPS6471593A JP22924987A JP22924987A JPS6471593A JP S6471593 A JPS6471593 A JP S6471593A JP 22924987 A JP22924987 A JP 22924987A JP 22924987 A JP22924987 A JP 22924987A JP S6471593 A JPS6471593 A JP S6471593A
Authority
JP
Japan
Prior art keywords
solder
connection part
material component
contg
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22924987A
Other languages
Japanese (ja)
Inventor
Shinichi Tonai
Masamitsu Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON GENMA KK
Original Assignee
NIPPON GENMA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON GENMA KK filed Critical NIPPON GENMA KK
Priority to JP22924987A priority Critical patent/JPS6471593A/en
Publication of JPS6471593A publication Critical patent/JPS6471593A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To improve the reliability of a solder connecting part by taking Pb and Sn, or Pb or Sn as a basic material component and further contg. at least one kind of Tl or Ag, Bi, Cu and Sb at a specified rate. CONSTITUTION:A solder is formed by taking Pb and/or Sn as a base material component and further contg. 0.001-0.1wt.% Tl. Or it is composed of contg. in the base material component of Pb and Sn at least >= one kind of the adding elements of <=5% Ag, <=30% Bi, <=1% Cu and <=10% Sb, and 0.001-0.01% Tl. The ductility even of a solder connection part is drastically improved by the blending of these adding elements. Destruction or stress damage is thus prevented because the connection part has a big ductility even if a large stress is given thermally and mechanically on the solder connection part. Consequently the reliability of a solder connection part is improved.
JP22924987A 1987-09-12 1987-09-12 Solder Pending JPS6471593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22924987A JPS6471593A (en) 1987-09-12 1987-09-12 Solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22924987A JPS6471593A (en) 1987-09-12 1987-09-12 Solder

Publications (1)

Publication Number Publication Date
JPS6471593A true JPS6471593A (en) 1989-03-16

Family

ID=16889152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22924987A Pending JPS6471593A (en) 1987-09-12 1987-09-12 Solder

Country Status (1)

Country Link
JP (1) JPS6471593A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071179A (en) * 1993-06-16 1995-01-06 Internatl Business Mach Corp <Ibm> Lead-free tin - bismuth solder
JPH0788679A (en) * 1993-06-16 1995-04-04 Internatl Business Mach Corp <Ibm> Lead-free tin antimony bismuth copper solder
JPH0788680A (en) * 1993-06-16 1995-04-04 Internatl Business Mach Corp <Ibm> Composition of high-temperature lead-free tin based solder
JPH08132278A (en) * 1994-11-01 1996-05-28 Ishikawa Kinzoku Kk Solder alloy
WO1998048069A1 (en) * 1997-04-22 1998-10-29 Ecosolder International Pty Limited Lead-free solder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071179A (en) * 1993-06-16 1995-01-06 Internatl Business Mach Corp <Ibm> Lead-free tin - bismuth solder
JPH0788679A (en) * 1993-06-16 1995-04-04 Internatl Business Mach Corp <Ibm> Lead-free tin antimony bismuth copper solder
JPH0788680A (en) * 1993-06-16 1995-04-04 Internatl Business Mach Corp <Ibm> Composition of high-temperature lead-free tin based solder
JPH08132278A (en) * 1994-11-01 1996-05-28 Ishikawa Kinzoku Kk Solder alloy
WO1998048069A1 (en) * 1997-04-22 1998-10-29 Ecosolder International Pty Limited Lead-free solder

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