HUP0402010A2 - Ólommentes lágyforraszanyag - Google Patents
Ólommentes lágyforraszanyag Download PDFInfo
- Publication number
- HUP0402010A2 HUP0402010A2 HU0402010A HUP0402010A HUP0402010A2 HU P0402010 A2 HUP0402010 A2 HU P0402010A2 HU 0402010 A HU0402010 A HU 0402010A HU P0402010 A HUP0402010 A HU P0402010A HU P0402010 A2 HUP0402010 A2 HU P0402010A2
- Authority
- HU
- Hungary
- Prior art keywords
- solder
- silver
- nickel
- lead
- indium
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 60
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 25
- 239000000956 alloy Substances 0.000 claims abstract description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 claims abstract description 18
- 239000004332 silver Substances 0.000 claims abstract description 17
- 229910052738 indium Inorganic materials 0.000 claims abstract description 15
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 12
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 7
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910017944 Ag—Cu Inorganic materials 0.000 claims abstract description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 229910052747 lanthanoid Inorganic materials 0.000 claims abstract description 4
- 150000002602 lanthanoids Chemical class 0.000 claims abstract description 4
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 230000008018 melting Effects 0.000 description 14
- 238000002844 melting Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000005476 soldering Methods 0.000 description 12
- 230000005496 eutectics Effects 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 210000001787 dendrite Anatomy 0.000 description 10
- 238000007711 solidification Methods 0.000 description 8
- 230000008023 solidification Effects 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000009736 wetting Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910007116 SnPb Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 238000004870 electrical engineering Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- -1 wetting ability Chemical compound 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10161826 | 2001-12-15 | ||
| PCT/DE2002/004525 WO2003051572A1 (de) | 2001-12-15 | 2002-12-10 | Bleifreies weichlot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUP0402010A2 true HUP0402010A2 (hu) | 2005-01-28 |
Family
ID=7709452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HU0402010A HUP0402010A2 (hu) | 2001-12-15 | 2002-12-10 | Ólommentes lágyforraszanyag |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20050008525A1 (enExample) |
| EP (1) | EP1453636B1 (enExample) |
| JP (1) | JP2005512813A (enExample) |
| KR (1) | KR20040063990A (enExample) |
| CN (1) | CN1310736C (enExample) |
| AT (1) | ATE334775T1 (enExample) |
| BR (1) | BR0215041A (enExample) |
| DE (1) | DE50207747D1 (enExample) |
| HU (1) | HUP0402010A2 (enExample) |
| MX (1) | MXPA04005835A (enExample) |
| WO (1) | WO2003051572A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4791685B2 (ja) * | 2003-05-22 | 2011-10-12 | シャープ株式会社 | 導電性ボール、電極構造、電子部品の電極の形成方法、電子部品ならびに電子機器 |
| DE102004038280B4 (de) | 2004-08-03 | 2006-07-27 | W.C. Heraeus Gmbh | Verfahren zum Herstellen von Feinstlotpulvern |
| CN1314512C (zh) * | 2005-01-28 | 2007-05-09 | 于大全 | 无铅钎料合金添加剂及无铅合金钎料 |
| JP4322844B2 (ja) * | 2005-06-10 | 2009-09-02 | シャープ株式会社 | 半導体装置および積層型半導体装置 |
| RU2302932C2 (ru) * | 2005-07-11 | 2007-07-20 | Тольяттинский государственный университет | Способ изготовления припоя |
| TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法 |
| JP4040644B2 (ja) * | 2005-07-28 | 2008-01-30 | シャープ株式会社 | 半田付け実装構造の製造方法および半田付け実装方法 |
| DE102006047764A1 (de) * | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C |
| DE202006015429U1 (de) * | 2006-10-09 | 2008-02-21 | Innowatec Dipl.-Ing. Grieger & Englert Gmbh & Co. Kg | Vorrichtung zum Reinigen eines Druckzylinders |
| WO2008084603A1 (ja) * | 2007-01-11 | 2008-07-17 | Topy Kogyo Kabushiki Kaisha | マニュアルソルダリング用無鉛はんだ合金 |
| KR20120102803A (ko) * | 2008-03-05 | 2012-09-18 | 센주긴조쿠고교 가부시키가이샤 | 납프리 땜납 접속 구조체 및 땜납 볼 |
| US8395051B2 (en) * | 2008-12-23 | 2013-03-12 | Intel Corporation | Doping of lead-free solder alloys and structures formed thereby |
| US8509731B2 (en) * | 2009-11-06 | 2013-08-13 | Research In Motion Limited | Location determination for mobile devices in emergency situations |
| CN101885119B (zh) * | 2010-06-25 | 2012-01-11 | 常熟市华银焊料有限公司 | 含V、Nd和Ge的Sn-Cu-Ni无铅钎料 |
| RU2541249C2 (ru) * | 2013-02-20 | 2015-02-10 | Открытое акционерное общество "АВТОВАЗ" | Способ изготовления припоя на основе олова |
| CN105750758A (zh) * | 2016-04-29 | 2016-07-13 | 广东中实金属有限公司 | 一种高可靠性的低温无铅焊料及其制备方法 |
| CN107502782B (zh) * | 2017-10-24 | 2019-06-21 | 河南科技大学 | 铜合金热镀用稀土锡基合金及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527628A (en) * | 1993-07-20 | 1996-06-18 | Iowa State University Research Foudation, Inc. | Pb-free Sn-Ag-Cu ternary eutectic solder |
| US6224690B1 (en) * | 1995-12-22 | 2001-05-01 | International Business Machines Corporation | Flip-Chip interconnections using lead-free solders |
| US6231691B1 (en) * | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
| US6231639B1 (en) * | 1997-03-07 | 2001-05-15 | Metaullics Systems Co., L.P. | Modular filter for molten metal |
| DE19729545A1 (de) * | 1997-07-10 | 1999-01-14 | Euromat Gmbh | Lotlegierung |
| US20020155024A1 (en) * | 2000-10-27 | 2002-10-24 | H-Technologies Group, Inc. | Lead-free solder compositions |
| DE60217199T2 (de) * | 2001-02-09 | 2007-10-04 | Taiho Kogyo Co., Ltd., Toyota | Bleifreies Weichlot und Weichlotverbindung |
| CN1346728A (zh) * | 2001-09-19 | 2002-05-01 | 大连理工大学 | 含稀土多合金组元无铅钎料合金 |
-
2002
- 2002-12-10 BR BR0215041-7A patent/BR0215041A/pt not_active Application Discontinuation
- 2002-12-10 US US10/498,154 patent/US20050008525A1/en not_active Abandoned
- 2002-12-10 CN CNB028249046A patent/CN1310736C/zh not_active Expired - Fee Related
- 2002-12-10 AT AT02791624T patent/ATE334775T1/de not_active IP Right Cessation
- 2002-12-10 JP JP2003552486A patent/JP2005512813A/ja active Pending
- 2002-12-10 DE DE50207747T patent/DE50207747D1/de not_active Expired - Lifetime
- 2002-12-10 WO PCT/DE2002/004525 patent/WO2003051572A1/de not_active Ceased
- 2002-12-10 MX MXPA04005835A patent/MXPA04005835A/es not_active Application Discontinuation
- 2002-12-10 KR KR10-2004-7008958A patent/KR20040063990A/ko not_active Withdrawn
- 2002-12-10 EP EP02791624A patent/EP1453636B1/de not_active Expired - Lifetime
- 2002-12-10 HU HU0402010A patent/HUP0402010A2/hu unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MXPA04005835A (es) | 2005-03-31 |
| US20050008525A1 (en) | 2005-01-13 |
| BR0215041A (pt) | 2004-11-03 |
| CN1310736C (zh) | 2007-04-18 |
| CN1604832A (zh) | 2005-04-06 |
| EP1453636A1 (de) | 2004-09-08 |
| DE50207747D1 (de) | 2006-09-14 |
| KR20040063990A (ko) | 2004-07-15 |
| WO2003051572A1 (de) | 2003-06-26 |
| EP1453636B1 (de) | 2006-08-02 |
| JP2005512813A (ja) | 2005-05-12 |
| ATE334775T1 (de) | 2006-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12090579B2 (en) | High reliability lead-free solder alloys for harsh environment electronics applications | |
| HUP0402010A2 (hu) | Ólommentes lágyforraszanyag | |
| US6156132A (en) | Solder alloys | |
| CN116815011A (zh) | 高温超高可靠性合金 | |
| GB2421030A (en) | Solder alloy | |
| JP2009506203A (ja) | 半田合金 | |
| JP3353640B2 (ja) | はんだ合金 | |
| JPWO2018174162A1 (ja) | はんだ継手 | |
| JP3857987B2 (ja) | ロウ材 | |
| JP3736819B2 (ja) | 無鉛はんだ合金 | |
| JPH09155587A (ja) | 錫−亜鉛系無鉛半田合金 | |
| JP2005512813A6 (ja) | 無鉛ソフトハンダ | |
| JP4770733B2 (ja) | はんだ及びそれを使用した実装品 | |
| JPH11172352A (ja) | 高温はんだ付用Ｚｎ合金 | |
| JP3386009B2 (ja) | はんだ合金 | |
| JPH11172353A (ja) | 高温はんだ付用Ｚｎ合金 | |
| JP2001287082A (ja) | はんだ合金 | |
| JP3095187B2 (ja) | 金属・セラミックス接合用ろう材 | |
| JP2004358539A (ja) | 高温ろう材 | |
| JP3835582B2 (ja) | 高温はんだ付用Ｚｎ合金 | |
| JP4359983B2 (ja) | 電子部品の実装構造体およびその製造方法 | |
| JPH11172354A (ja) | 高温はんだ付用Ｚｎ合金 | |
| JPH10249579A (ja) | はんだ材料 | |
| CA2540486A1 (en) | Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), nickel (ni), phosphorus (p) and/or rare earth: cerium (ce) or lanthanum (la) | |
| JPH09192877A (ja) | はんだ材料 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FD9A | Lapse of provisional protection due to non-payment of fees |