BR0215041A - Solda macia sem chumbo - Google Patents

Solda macia sem chumbo

Info

Publication number
BR0215041A
BR0215041A BR0215041-7A BR0215041A BR0215041A BR 0215041 A BR0215041 A BR 0215041A BR 0215041 A BR0215041 A BR 0215041A BR 0215041 A BR0215041 A BR 0215041A
Authority
BR
Brazil
Prior art keywords
weight
lead
soft
nickel
soft solder
Prior art date
Application number
BR0215041-7A
Other languages
English (en)
Portuguese (pt)
Inventor
Roland Pfarr
Herrmann Walter
Hermann Wald
Original Assignee
Pfarr Stanztechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pfarr Stanztechnik Gmbh filed Critical Pfarr Stanztechnik Gmbh
Publication of BR0215041A publication Critical patent/BR0215041A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Organic Insulating Materials (AREA)
BR0215041-7A 2001-12-15 2002-12-10 Solda macia sem chumbo BR0215041A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10161826 2001-12-15
PCT/DE2002/004525 WO2003051572A1 (de) 2001-12-15 2002-12-10 Bleifreies weichlot

Publications (1)

Publication Number Publication Date
BR0215041A true BR0215041A (pt) 2004-11-03

Family

ID=7709452

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0215041-7A BR0215041A (pt) 2001-12-15 2002-12-10 Solda macia sem chumbo

Country Status (11)

Country Link
US (1) US20050008525A1 (enExample)
EP (1) EP1453636B1 (enExample)
JP (1) JP2005512813A (enExample)
KR (1) KR20040063990A (enExample)
CN (1) CN1310736C (enExample)
AT (1) ATE334775T1 (enExample)
BR (1) BR0215041A (enExample)
DE (1) DE50207747D1 (enExample)
HU (1) HUP0402010A2 (enExample)
MX (1) MXPA04005835A (enExample)
WO (1) WO2003051572A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4791685B2 (ja) * 2003-05-22 2011-10-12 シャープ株式会社 導電性ボール、電極構造、電子部品の電極の形成方法、電子部品ならびに電子機器
DE102004038280B4 (de) 2004-08-03 2006-07-27 W.C. Heraeus Gmbh Verfahren zum Herstellen von Feinstlotpulvern
CN1314512C (zh) * 2005-01-28 2007-05-09 于大全 无铅钎料合金添加剂及无铅合金钎料
JP4322844B2 (ja) * 2005-06-10 2009-09-02 シャープ株式会社 半導体装置および積層型半導体装置
RU2302932C2 (ru) * 2005-07-11 2007-07-20 Тольяттинский государственный университет Способ изготовления припоя
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP4040644B2 (ja) * 2005-07-28 2008-01-30 シャープ株式会社 半田付け実装構造の製造方法および半田付け実装方法
DE102006047764A1 (de) * 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
DE202006015429U1 (de) * 2006-10-09 2008-02-21 Innowatec Dipl.-Ing. Grieger & Englert Gmbh & Co. Kg Vorrichtung zum Reinigen eines Druckzylinders
WO2008084603A1 (ja) * 2007-01-11 2008-07-17 Topy Kogyo Kabushiki Kaisha マニュアルソルダリング用無鉛はんだ合金
KR20120102803A (ko) * 2008-03-05 2012-09-18 센주긴조쿠고교 가부시키가이샤 납프리 땜납 접속 구조체 및 땜납 볼
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
US8509731B2 (en) * 2009-11-06 2013-08-13 Research In Motion Limited Location determination for mobile devices in emergency situations
CN101885119B (zh) * 2010-06-25 2012-01-11 常熟市华银焊料有限公司 含V、Nd和Ge的Sn-Cu-Ni无铅钎料
RU2541249C2 (ru) * 2013-02-20 2015-02-10 Открытое акционерное общество "АВТОВАЗ" Способ изготовления припоя на основе олова
CN105750758A (zh) * 2016-04-29 2016-07-13 广东中实金属有限公司 一种高可靠性的低温无铅焊料及其制备方法
CN107502782B (zh) * 2017-10-24 2019-06-21 河南科技大学 铜合金热镀用稀土锡基合金及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6231639B1 (en) * 1997-03-07 2001-05-15 Metaullics Systems Co., L.P. Modular filter for molten metal
DE19729545A1 (de) * 1997-07-10 1999-01-14 Euromat Gmbh Lotlegierung
US20020155024A1 (en) * 2000-10-27 2002-10-24 H-Technologies Group, Inc. Lead-free solder compositions
DE60217199T2 (de) * 2001-02-09 2007-10-04 Taiho Kogyo Co., Ltd., Toyota Bleifreies Weichlot und Weichlotverbindung
CN1346728A (zh) * 2001-09-19 2002-05-01 大连理工大学 含稀土多合金组元无铅钎料合金

Also Published As

Publication number Publication date
MXPA04005835A (es) 2005-03-31
US20050008525A1 (en) 2005-01-13
CN1310736C (zh) 2007-04-18
CN1604832A (zh) 2005-04-06
EP1453636A1 (de) 2004-09-08
DE50207747D1 (de) 2006-09-14
KR20040063990A (ko) 2004-07-15
WO2003051572A1 (de) 2003-06-26
HUP0402010A2 (hu) 2005-01-28
EP1453636B1 (de) 2006-08-02
JP2005512813A (ja) 2005-05-12
ATE334775T1 (de) 2006-08-15

Similar Documents

Publication Publication Date Title
BR0215041A (pt) Solda macia sem chumbo
US3819366A (en) Dental alloy
HUP0401432A2 (en) Improvements in or relating to solders
ATE400481T1 (de) Durch eine metallbefestigung verbundener glasartikel und diesen verwendende verbindungskonstruktion
CA2100114A1 (en) Copper-Bismuth Alloys
JPS59205105A (ja) 導電性複合材料
BR9807975A (pt) Composição de solda, solda, utilização de uma solda, método de união de dois ou mais componentes e componente eletrônico ou placa de circuito impresso
JP2001071173A (ja) 無鉛はんだ
BR0007604A (pt) Liga à base de cobre e processo para formar uma liga à base de cobre
DE60133467D1 (de) Modifiziertes serumalbumin mit verringerter affinität für nickel und kupfer
JP6247819B2 (ja) アルミニウム用はんだ及びはんだ継手
DE69408689T2 (de) Diffusionsverbinden von werkstoffen mittels silber-germanium-legierungen und silber-germanium-legierung zum verwenden in diesem verfahren
MX393462B (es) Aleacion de soldadura, pasta de soldadura, soldadura de preforma, bola de soldadura, soldadura de alambre, soldadura con nucleo de flujo de resina, junta de soldadura, tarjeta de circuito electronico y tarjeta de circuito electronico multi-capa
ES2196465T3 (es) Procedimiento para la preparacion y utilizacion de una aleacion de cobre, estaño y titanio.
JP7216419B2 (ja) 鉛フリーはんだ合金及びはんだ継手
US1090939A (en) Composition of matter to be used for the manufacture of plates for artificial teeth.
FI4140636T3 (fi) Juotosseos ja sen käyttö juotosliitosta varten
PH12021552996B1 (en) Solder alloy, cast article, formed article, and solder joint
Moser et al. Trends in wettability studies of Pb-free solders. Basic and application. Part I. Surface tension and density measurements of Sn-Zn-and Sn-Zn-Bi-Sb alloys. Experiment vs. modelling
JP2001121286A (ja) 銅くわれ防止無鉛はんだ
Nicholson et al. The Use of Bismuth Alloy Systems for Reflow and Wave Soldering
EP1249302A4 (en) SOLDER ALLOY, ELECTRONIC PART WITH SOLDER BALL AND BUMP
KR950009753A (ko) 표면 장착용 전자 부품
DE102008052095A1 (de) Warn-Ohrringe
FI4122639T3 (fi) Juoteseos ja juoteseoksen käyttö seospallona tai seosliitoksena

Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]