JP2005510055A - マイクロエレクトロニクス基板の自動処理用の低減フットプリントツール - Google Patents

マイクロエレクトロニクス基板の自動処理用の低減フットプリントツール Download PDF

Info

Publication number
JP2005510055A
JP2005510055A JP2003544796A JP2003544796A JP2005510055A JP 2005510055 A JP2005510055 A JP 2005510055A JP 2003544796 A JP2003544796 A JP 2003544796A JP 2003544796 A JP2003544796 A JP 2003544796A JP 2005510055 A JP2005510055 A JP 2005510055A
Authority
JP
Japan
Prior art keywords
substrate
zone
carrier
processing
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003544796A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005510055A5 (https=
Inventor
ロバート イー． ラーソン
シーン ディー． シモンデット
デビッド シー． ジンマーマン
トッド ケー． マシエジ
クイリン ダブリュ． マッシーズ
Original Assignee
エフエスアイ インターナショナル インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エフエスアイ インターナショナル インコーポレイテッド filed Critical エフエスアイ インターナショナル インコーポレイテッド
Publication of JP2005510055A publication Critical patent/JP2005510055A/ja
Publication of JP2005510055A5 publication Critical patent/JP2005510055A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
JP2003544796A 2001-11-13 2002-11-08 マイクロエレクトロニクス基板の自動処理用の低減フットプリントツール Withdrawn JP2005510055A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33805701P 2001-11-13 2001-11-13
PCT/US2002/035998 WO2003043060A2 (en) 2001-11-13 2002-11-08 Reduced footprint tool for automated processing of substrates

Publications (2)

Publication Number Publication Date
JP2005510055A true JP2005510055A (ja) 2005-04-14
JP2005510055A5 JP2005510055A5 (https=) 2006-01-05

Family

ID=23323233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003544796A Withdrawn JP2005510055A (ja) 2001-11-13 2002-11-08 マイクロエレクトロニクス基板の自動処理用の低減フットプリントツール

Country Status (7)

Country Link
US (2) US6979165B2 (https=)
EP (1) EP1446828A2 (https=)
JP (1) JP2005510055A (https=)
KR (1) KR20050044434A (https=)
CN (1) CN1608308A (https=)
TW (1) TW200305188A (https=)
WO (1) WO2003043060A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009081362A (ja) * 2007-09-27 2009-04-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2010509784A (ja) * 2006-11-15 2010-03-25 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 環状に配置されているワークピースストッカ

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1608308A (zh) 2001-11-13 2005-04-20 Fsi国际公司 微型电子基片的自动化加工用的减少占地的工具
WO2003080479A2 (en) 2002-03-20 2003-10-02 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
TWI262165B (en) * 2002-10-16 2006-09-21 Sez Ag Device and method for transporting wafer-shaped articles
JP4486507B2 (ja) 2003-01-02 2010-06-23 ローマ リンダ ユニヴァーシティ メディカル センター 陽子線治療システムのための構成管理及び読み出しシステム
TWI290901B (en) * 2003-06-23 2007-12-11 Au Optronics Corp Warehousing conveyor system
JP2007500941A (ja) * 2003-07-31 2007-01-18 エフエスアイ インターナショナル インコーポレイテッド 高度に均一な酸化物層、とりわけ超薄層の調節された成長
JP4413562B2 (ja) * 2003-09-05 2010-02-10 東京エレクトロン株式会社 処理システム及び処理方法
WO2005027202A1 (en) * 2003-09-11 2005-03-24 Fsi International, Inc. Semiconductor wafer immersion systems and treatments using modulated acoustic energy
WO2005025767A1 (en) * 2003-09-11 2005-03-24 Fsi International, Inc. Acoustic diffusers for acoustic field uniformity
US20070286710A1 (en) * 2003-11-10 2007-12-13 Van Der Meulen Peter Semiconductor manufacturing process modules
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US8313277B2 (en) 2003-11-10 2012-11-20 Brooks Automation, Inc. Semiconductor manufacturing process modules
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP4381121B2 (ja) * 2003-12-11 2009-12-09 大日本スクリーン製造株式会社 基板処理装置
JP4532499B2 (ja) * 2004-09-24 2010-08-25 平田機工株式会社 容器搬送装置
KR100644054B1 (ko) * 2004-12-29 2006-11-10 동부일렉트로닉스 주식회사 세정 장치 및 게이트 산화막의 전세정 방법
JP4208844B2 (ja) * 2005-01-14 2009-01-14 富士通マイクロエレクトロニクス株式会社 露光装置及びその制御方法
JP4293150B2 (ja) * 2005-03-29 2009-07-08 セイコーエプソン株式会社 基板移載装置、基板移載方法、および電気光学装置の製造方法
US9339900B2 (en) 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
US7513822B2 (en) 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
US9059227B2 (en) 2005-06-18 2015-06-16 Futrfab, Inc. Methods and apparatus for vertically orienting substrate processing tools in a clean space
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
JP4767641B2 (ja) * 2005-09-27 2011-09-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
DE102006028057B4 (de) * 2005-10-17 2017-07-20 Dynamic Microsystems Semiconductor Equipment Gmbh Vorrichtung zum Lagern von kontaminationsempfindlichen, plattenförmigen Gegenständen, insbesondere zum Lagern von Halbleiterwafern
EP1988568A4 (en) * 2006-02-22 2011-10-26 Ebara Corp SUBSTRATE TREATMENT DEVICE, SUBSTRATE PROTECTION DEVICE, SUBSTRATE TREATMENT DEVICE AND DEVICE FOR TREATMENT WITH A CHEMICAL SOLUTION
US20070231108A1 (en) * 2006-04-04 2007-10-04 Applied Materials, Inc. Method and apparatus for transferring wafers
TWI452643B (zh) * 2006-05-11 2014-09-11 東京威力科創股份有限公司 Inspection device and inspection method
US7887280B2 (en) * 2006-05-11 2011-02-15 Tokyo Electron Limited Processing apparatus
US7764366B2 (en) * 2006-07-11 2010-07-27 Besi North America, Inc. Robotic die sorter with optical inspection system
JP4215079B2 (ja) * 2006-07-31 2009-01-28 村田機械株式会社 クリーンストッカと物品の保管方法
JP4904995B2 (ja) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 ロードポート装置
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
JP2008100805A (ja) * 2006-10-18 2008-05-01 Ihi Corp 基板保管庫
US20080112787A1 (en) 2006-11-15 2008-05-15 Dynamic Micro Systems Removable compartments for workpiece stocker
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7949425B2 (en) * 2006-12-06 2011-05-24 Axcelis Technologies, Inc. High throughput wafer notch aligner
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US20080206022A1 (en) * 2007-02-27 2008-08-28 Smith John M Mult-axis robot arms in substrate vacuum processing tool
US20080206036A1 (en) * 2007-02-27 2008-08-28 Smith John M Magnetic media processing tool with storage bays and multi-axis robot arms
US8950998B2 (en) * 2007-02-27 2015-02-10 Brooks Automation, Inc. Batch substrate handling
US20080219810A1 (en) * 2007-03-05 2008-09-11 Van Der Meulen Peter Semiconductor manufacturing process modules
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US20080310939A1 (en) * 2007-06-15 2008-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for use in a lithography tool
KR100887161B1 (ko) * 2007-08-03 2009-03-09 주식회사 에이디피엔지니어링 플라즈마 처리장치
US9633881B2 (en) * 2008-02-05 2017-04-25 Brooks Automation, Inc. Automatic handling buffer for bare stocker
US8070410B2 (en) 2008-02-05 2011-12-06 Lutz Rebstock Scalable stocker with automatic handling buffer
KR101702901B1 (ko) * 2008-02-05 2017-02-06 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 베어 스토커용 자동 취급 버퍼
DE102008009090B3 (de) * 2008-02-14 2009-06-04 MAG Industrial Automation Systems, LLC., Sterling Heights Beschickungs- und Entnahme-Anlage für Werkzeug-Maschinen
CN102099907B (zh) * 2008-07-15 2014-04-02 株式会社爱发科 工件传送系统和方法
US9048274B2 (en) * 2008-12-08 2015-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Portable stocker and method of using same
JP5083221B2 (ja) * 2009-01-05 2012-11-28 パナソニック株式会社 パレット自動交換装置
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5696135B2 (ja) * 2009-03-30 2015-04-08 エーティーエス オートメーション ツーリング システムズ インコーポレイテッドＡｔｓ Ａｕｔｏｍａｔｉｏｎ Ｔｏｏｌｉｎｇ Ｓｙｓｔｅｍｓ Ｉｎｃ． ウエハーハンドリングシステムおよびその方法
US8911554B2 (en) * 2010-01-05 2014-12-16 Applied Materials, Inc. System for batch processing of magnetic media
AT510516B1 (de) * 2010-09-21 2013-10-15 Trumpf Maschinen Austria Gmbh Fertigungszelle mit einer werkteil- transfereinrichtung und transporteinrichtung für werkteile und teileträger
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame
CN103295931A (zh) * 2012-02-29 2013-09-11 Lgcns株式会社 Led晶圆的提供装置及方法
US9045827B2 (en) * 2012-03-09 2015-06-02 Lg Cns Co., Ltd. Apparatus and method for supplying light-emitting diode (LED) wafer
US9136149B2 (en) 2012-11-16 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Loading port, system for etching and cleaning wafers and method of use
CN104813438B (zh) 2012-11-28 2017-07-25 盛美半导体设备（上海）有限公司 半导体硅片的清洗方法和装置
US12189828B2 (en) 2013-01-05 2025-01-07 Frederick A. Flitsch Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them
KR102075528B1 (ko) * 2013-05-16 2020-03-03 삼성디스플레이 주식회사 증착장치, 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치
US9378992B2 (en) 2014-06-27 2016-06-28 Axcelis Technologies, Inc. High throughput heated ion implantation system and method
KR102160106B1 (ko) * 2014-07-03 2020-09-25 세메스 주식회사 웨이퍼 이송 장치
CN105278259A (zh) * 2015-07-27 2016-01-27 江苏影速光电技术有限公司 单机双台面多工位自动pcb板曝光设备及其曝光方法
US9607803B2 (en) 2015-08-04 2017-03-28 Axcelis Technologies, Inc. High throughput cooled ion implantation system and method
JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US10916464B1 (en) * 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
JP7255615B2 (ja) * 2021-01-29 2023-04-11 村田機械株式会社 コンベアシステム
GB2610156A (en) * 2021-04-29 2023-03-01 Edwards Ltd Semiconductor processing system
KR20230111438A (ko) * 2022-01-18 2023-07-25 삼성전자주식회사 반도체 기판 처리 장치
JP7824188B2 (ja) * 2022-09-26 2026-03-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568234A (en) 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
JPS63303060A (ja) * 1987-05-30 1988-12-09 Tokuda Seisakusho Ltd 真空処理装置
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
US5064337A (en) 1988-07-19 1991-11-12 Tokyo Electron Limited Handling apparatus for transferring carriers and a method of transferring carriers
KR0155158B1 (ko) * 1989-07-25 1998-12-01 카자마 젠쥬 종형 처리 장치 및 처리방법
US5505577A (en) * 1990-11-17 1996-04-09 Tokyo Electron Limited Transfer apparatus
JP2986121B2 (ja) * 1991-03-26 1999-12-06 東京エレクトロン株式会社 ロードロック装置及び真空処理装置
US5376212A (en) * 1992-02-18 1994-12-27 Tokyo Electron Yamanashi Limited Reduced-pressure processing apparatus
US5378145A (en) 1992-07-15 1995-01-03 Tokyo Electron Kabushiki Kaisha Treatment system and treatment apparatus
TW245823B (https=) * 1992-10-05 1995-04-21 Tokyo Electron Co Ltd
EP0757844A1 (en) * 1994-04-28 1997-02-12 Semitool, Inc. Semiconductor processing systems
US5544421A (en) 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
DE59611078D1 (de) * 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
JP3478364B2 (ja) * 1995-06-15 2003-12-15 株式会社日立国際電気 半導体製造装置
US6672819B1 (en) * 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US6279724B1 (en) 1997-12-19 2001-08-28 Semitoll Inc. Automated semiconductor processing system
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
JP2000514956A (ja) * 1996-07-15 2000-11-07 セミトゥール・インコーポレイテッド 自動化された半導体処理システム
US6572320B2 (en) * 1997-05-05 2003-06-03 Semitool, Inc. Robot for handling workpieces in an automated processing system
US6579052B1 (en) * 1997-07-11 2003-06-17 Asyst Technologies, Inc. SMIF pod storage, delivery and retrieval system
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
NL1008143C2 (nl) * 1998-01-27 1999-07-28 Asm Int Stelsel voor het behandelen van wafers.
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US6365033B1 (en) 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
EP1084509A1 (en) * 1998-05-27 2001-03-21 Varian Semiconductor Equipment Associates Inc. Batch end effector for semiconductor wafer handling
JP3455458B2 (ja) * 1999-02-01 2003-10-14 東京エレクトロン株式会社 塗布、現像装置及び塗布現像処理における基板再生システム
JP3442686B2 (ja) * 1999-06-01 2003-09-02 東京エレクトロン株式会社 基板処理装置
US6217727B1 (en) 1999-08-30 2001-04-17 Micron Technology, Inc. Electroplating apparatus and method
US6376261B1 (en) 2000-01-03 2002-04-23 Advanced Micro Devices Inc. Method for varying nitride strip makeup process based on field oxide loss and defect count
US6413356B1 (en) * 2000-05-02 2002-07-02 Applied Materials, Inc. Substrate loader for a semiconductor processing system
US6444481B1 (en) 2001-07-02 2002-09-03 Advanced Micro Devices, Inc. Method and apparatus for controlling a plating process
CN1608308A (zh) 2001-11-13 2005-04-20 Fsi国际公司 微型电子基片的自动化加工用的减少占地的工具
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010509784A (ja) * 2006-11-15 2010-03-25 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 環状に配置されているワークピースストッカ
JP2009081362A (ja) * 2007-09-27 2009-04-16 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
WO2003043060A2 (en) 2003-05-22
US20050063799A1 (en) 2005-03-24
KR20050044434A (ko) 2005-05-12
TW200305188A (en) 2003-10-16
CN1608308A (zh) 2005-04-20
US7134827B2 (en) 2006-11-14
US20030091410A1 (en) 2003-05-15
EP1446828A2 (en) 2004-08-18
WO2003043060A3 (en) 2003-11-27
US6979165B2 (en) 2005-12-27

Similar Documents

Publication Publication Date Title
JP2005510055A (ja) マイクロエレクトロニクス基板の自動処理用の低減フットプリントツール
US6822413B2 (en) Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
US11587816B2 (en) Container storage add-on for bare workpiece stocker
CN1329948C (zh) 晶片机
CN1996552B (zh) 晶片机
JP4309264B2 (ja) 半導体材料取扱い装置
JP4309263B2 (ja) 半導体ツールインターフェースのフレーム
EP1252079B1 (en) Wafer transport system
WO2008085233A1 (en) Loader and buffer for reduced lot size
JP2003533015A (ja) モジュールソーター
JP2002544678A (ja) 小環境内でのカセットバッファリング
JP2005294280A (ja) 密閉容器搬送システム
KR102811816B1 (ko) 로봇 및 이를 구비한 기판 반송 시스템
JP2024542506A (ja) 半導体製造設備用ウエハの自動ティーチング装置｛ａｕｔｏｍａｔｉｃ ｗａｆｅｒ ｔｅａｃｈｉｎｇ ａｐｐａｒａｔｕｓ ｆｏｒ ｓｅｍｉｃｏｎｄｕｃｔｏｒ ｍａｎｕｆａｃｔｕｒｉｎｇ ｅｑｕｉｐｍｅｎｔ｝
US20040258505A1 (en) Processing equipment modular font-end
EP1460676A2 (en) Reduced footprint tool for automated processing of microelectronic substrates
JP2004186358A (ja) 半導体基板入替装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051108

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051108

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20070202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20070202